TWI620797B - 高溫穩定性熱傳導材料 - Google Patents

高溫穩定性熱傳導材料 Download PDF

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Publication number
TWI620797B
TWI620797B TW101102003A TW101102003A TWI620797B TW I620797 B TWI620797 B TW I620797B TW 101102003 A TW101102003 A TW 101102003A TW 101102003 A TW101102003 A TW 101102003A TW I620797 B TWI620797 B TW I620797B
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Taiwan
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composition
component
metal
thermally conductive
polysiloxane
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TW101102003A
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Chinese (zh)
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TW201245338A (en
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杜拉 艾杜 巴哈瓦加
凱莉 梅欣
伊莉莎白 伍德
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道康寧公司
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08Materials not undergoing a change of physical state when used
    • C09K5/14Solid materials, e.g. powdery or granular
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0091Complexes with metal-heteroatom-bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415Five-membered rings
    • C08K5/3417Five-membered rings condensed with carbocyclic rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • C08L101/12Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/06Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
    • F28F21/067Details
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F23/00Features relating to the use of intermediate heat-exchange materials, e.g. selection of compositions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2217Oxides; Hydroxides of metals of magnesium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2227Oxides; Hydroxides of metals of aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2296Oxides; Hydroxides of metals of zinc
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/10Metal compounds
    • C08K3/14Carbides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/28Nitrogen-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/56Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW101102003A 2011-01-26 2012-01-18 高溫穩定性熱傳導材料 TWI620797B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161436214P 2011-01-26 2011-01-26
US61/436,214 2011-01-26

Publications (2)

Publication Number Publication Date
TW201245338A TW201245338A (en) 2012-11-16
TWI620797B true TWI620797B (zh) 2018-04-11

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Family Applications (1)

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TW101102003A TWI620797B (zh) 2011-01-26 2012-01-18 高溫穩定性熱傳導材料

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US (2) US9598575B2 (cg-RX-API-DMAC7.html)
EP (1) EP2668239B1 (cg-RX-API-DMAC7.html)
JP (1) JP6048416B2 (cg-RX-API-DMAC7.html)
KR (1) KR101866299B1 (cg-RX-API-DMAC7.html)
CN (2) CN109401333A (cg-RX-API-DMAC7.html)
TW (1) TWI620797B (cg-RX-API-DMAC7.html)
WO (1) WO2012102852A1 (cg-RX-API-DMAC7.html)

Families Citing this family (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013052838A1 (en) * 2011-10-06 2013-04-11 Dow Corning Corporation Method of forming a gel having improved thermal stability
JP2014534292A (ja) * 2011-10-06 2014-12-18 ダウ コーニング コーポレーションDow Corning Corporation 改善された熱安定性を有するゲル
US9070660B2 (en) 2013-03-15 2015-06-30 Intel Corporation Polymer thermal interface material having enhanced thermal conductivity
KR102174540B1 (ko) 2013-03-15 2020-11-05 다우 실리콘즈 코포레이션 알칼리 토금속을 포함하는 아릴 기-함유 실록산 조성물
JP6205824B2 (ja) * 2013-04-26 2017-10-04 富士電機株式会社 パワーモジュール
KR102335293B1 (ko) * 2013-09-18 2021-12-06 다우 실리콘즈 코포레이션 수지-선형 유기실록산 블록 공중합체의 조성물
JP2017504715A (ja) 2013-12-05 2017-02-09 ハネウェル・インターナショナル・インコーポレーテッド 調節されたpHを有するメタンスルホン酸第一スズ溶液
KR102172821B1 (ko) * 2014-03-06 2020-11-02 헨켈 아게 운트 코. 카게아아 단결정 알루미나 충전 다이 부착 페이스트
KR102282332B1 (ko) 2014-07-07 2021-07-27 허니웰 인터내셔날 인코포레이티드 이온 스캐빈저를 갖는 열 계면 재료
JP6395153B2 (ja) * 2014-11-04 2018-09-26 日本タングステン株式会社 コーティング膜、その製造方法およびコーティング膜形成方法
KR102470083B1 (ko) 2014-12-05 2022-11-23 허니웰 인터내셔널 인코포레이티드 저열 임피던스를 갖는 고성능 열 계면 재료
CN104497574A (zh) * 2014-12-10 2015-04-08 深圳市博恩实业有限公司 多功能有机硅热界面材料
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
US11686459B2 (en) 2015-12-15 2023-06-27 Wangs Alliance Corporation LED lighting methods and apparatus
US10941924B2 (en) 2015-12-15 2021-03-09 Wangs Alliance Corporation LED lighting methods and apparatus
US10962209B2 (en) 2015-12-15 2021-03-30 Wangs Alliance Corporation LED lighting methods and apparatus
EP3426746B1 (en) 2016-03-08 2021-07-14 Honeywell International Inc. Phase change material
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
US11464438B2 (en) 2016-08-11 2022-10-11 Willowwood Global Llc Conductive human interfaces
US11213409B2 (en) 2016-08-11 2022-01-04 Willowwood Global Llc Conductive human interfaces
SG10201607550RA (en) * 2016-09-09 2018-04-27 3M Innovative Properties Co Thermal Interface Material
US11357974B2 (en) 2016-10-06 2022-06-14 Willowwood Global Llc Electrically conductive gel and conductive human interfaces and electrodes formed using electrically conductive gel
JP6702233B2 (ja) * 2017-03-09 2020-05-27 信越化学工業株式会社 付加硬化型オルガノポリシロキサン樹脂組成物、該組成物の硬化物及び該硬化物を有する半導体装置
JP6941810B2 (ja) * 2017-04-19 2021-09-29 パナソニックIpマネジメント株式会社 樹脂組成物ならびにそれを用いた電子部品および電子機器
WO2019004150A1 (ja) * 2017-06-27 2019-01-03 積水ポリマテック株式会社 熱伝導性シート
US11812525B2 (en) 2017-06-27 2023-11-07 Wangs Alliance Corporation Methods and apparatus for controlling the current supplied to light emitting diodes
WO2019021825A1 (ja) 2017-07-24 2019-01-31 東レ・ダウコーニング株式会社 熱伝導性シリコーンゲル組成物、熱伝導性部材および放熱構造体
KR102625363B1 (ko) 2017-07-24 2024-01-17 다우 도레이 캄파니 리미티드 다성분 경화형 열전도성 실리콘 겔 조성물, 열전도성 부재 및 방열 구조체
EP3660099B1 (en) * 2017-07-24 2024-09-11 Dow Toray Co., Ltd. Thermally-conductive silicone gel composition, thermally-conductive member, and heat dissipation structure
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
EP3683274B1 (en) 2017-09-15 2024-10-30 Dow Toray Co., Ltd. Curable organopolysiloxane composition, and pattern forming method
CN112770848A (zh) 2017-09-15 2021-05-07 道康宁东丽株式会社 电子零件或其前驱体、它们的制造方法
US10344194B2 (en) * 2017-09-27 2019-07-09 Momentive Performance Materials Inc. Thermal interface composition comprising ionically modified siloxane
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
JP6646643B2 (ja) * 2017-12-14 2020-02-14 株式会社ノリタケカンパニーリミテド 感光性組成物とその利用
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
EP3527615A1 (en) * 2018-02-16 2019-08-21 Venator Germany GmbH Thermoconductive filler particles and polymer compositions containing them
KR102578330B1 (ko) * 2018-06-27 2023-09-18 다우 실리콘즈 코포레이션 열 갭 충전제 및 배터리 관리 시스템을 위한 이의 응용
JP6956697B2 (ja) * 2018-09-18 2021-11-02 住友理工株式会社 シリコーンゴム組成物およびシリコーンゴム架橋体
CN109261207B (zh) * 2018-09-26 2021-05-28 合肥国轩高科动力能源有限公司 光催化材料及其制法和在废旧锂电池电解液处理中的应用
JP7432519B2 (ja) * 2018-10-18 2024-02-16 ダウ・東レ株式会社 耐寒性に優れる硬化性オルガノポリシロキサン組成物、パターン形成方法および電子部品等
JP7033047B2 (ja) * 2018-10-26 2022-03-09 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
CN113166545B (zh) * 2018-12-29 2023-05-23 陶氏环球技术有限责任公司 包含mgo填料的导热组合物以及使用所述组合物的方法和装置
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
CN110172250A (zh) * 2019-05-22 2019-08-27 平湖阿莱德实业有限公司 一种新能源汽车用超低密度高导热填隙界面材料及其制备方法
US20210261845A1 (en) * 2019-06-24 2021-08-26 Fuji Polymer Industries Co., Ltd. Heat-resistant thermally conductive composition and heat-resistant thermally conductive sheet
KR20220100592A (ko) * 2019-11-19 2022-07-15 헨켈 아게 운트 코. 카게아아 열 계면 재료 및 적용 방법
US11598517B2 (en) 2019-12-31 2023-03-07 Lumien Enterprise, Inc. Electronic module group
CN110985903B (zh) 2019-12-31 2020-08-14 江苏舒适照明有限公司 一种灯模组
US12281783B2 (en) 2019-12-31 2025-04-22 Lumien Enterprise, Inc. Electronic module group
CN113661215B (zh) * 2020-02-13 2024-07-23 富士高分子工业株式会社 耐热性有机硅树脂组合物及耐热性有机硅树脂复合材料
WO2021178119A1 (en) * 2020-03-05 2021-09-10 Dow Global Technologies Llc Shear thinning thermally conductive silicone compositions
EP4118162A4 (en) * 2020-03-13 2023-11-29 DDP Specialty Electronic Materials US, LLC Thermal interface material comprising magnesium hydroxide
CN115210321A (zh) * 2020-03-16 2022-10-18 美国陶氏有机硅公司 导热有机硅组合物
CN111503556B (zh) 2020-04-23 2020-11-27 江苏舒适照明有限公司 一种射灯结构
US12187951B2 (en) 2020-07-27 2025-01-07 Google Llc Thermal interface material and method for making the same
US12195666B2 (en) * 2020-07-27 2025-01-14 Google Llc Thermal interface material and method for making the same
CN116368195A (zh) * 2020-09-23 2023-06-30 陶氏环球技术有限责任公司 具有低分配粘度、分配后具有低竖向流动且固化后具有低热阻抗的热界面材料
CN114539781A (zh) * 2020-11-25 2022-05-27 深圳先进电子材料国际创新研究院 一种导热凝胶及其制备方法
WO2022215510A1 (ja) * 2021-04-09 2022-10-13 ダウ・東レ株式会社 硬化性オルガノポリシロキサン組成物、熱伝導性部材および放熱構造体
US12230950B2 (en) 2021-07-29 2025-02-18 Lumien Enterprise, Inc. Junction box
WO2023087233A1 (en) * 2021-11-19 2023-05-25 Dow Silicones Corporation Silicone rubber composition
JPWO2023171353A1 (cg-RX-API-DMAC7.html) 2022-03-08 2023-09-14
CN118829691A (zh) 2022-03-08 2024-10-22 信越化学工业株式会社 导热性加成固化型有机硅组合物及其有机硅固化物
CN115214202A (zh) * 2022-04-26 2022-10-21 北京科技大学 一种高导热层状热界面材料及其制备方法
US11802682B1 (en) 2022-08-29 2023-10-31 Wangs Alliance Corporation Modular articulating lighting
WO2024086136A1 (en) 2022-10-19 2024-04-25 Dow Silicones Corporation Liquid silicone rubber composition
EP4594408A1 (en) 2022-10-19 2025-08-06 Dow Silicones Corporation Liquid silicone rubber composition
CN120077094A (zh) 2022-10-19 2025-05-30 美国陶氏有机硅公司 液体硅酮橡胶组合物
WO2025039204A1 (en) * 2023-08-23 2025-02-27 Dow Silicones Corporation High temperature stable thermally conductive materials

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5153244A (en) * 1989-10-31 1992-10-06 Dow Corning Toray Silicone Company, Ltd. Curable organosiloxane composition yielding elastomers exhibiting reduced compression set values
TWI303261B (cg-RX-API-DMAC7.html) * 2001-05-01 2008-11-21 Shinetsu Chemical Co

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB731166A (en) * 1952-05-27 1955-06-01 Midland Silicones Ltd Improvements in or relating to organosiloxane elastomers
GB893399A (en) 1959-09-24 1962-04-11 Dow Corning Improvements in or relating to organosiloxane compositions
NL129346C (cg-RX-API-DMAC7.html) 1966-06-23
US3364161A (en) 1967-01-19 1968-01-16 Navy Usa Silicone rubber composition containing corrosion inhibiting curing agent
US3989667A (en) 1974-12-02 1976-11-02 Dow Corning Corporation Olefinic siloxanes as platinum inhibitors
GB1470465A (en) 1975-01-20 1977-04-14 Int Paint Co Coated marine surfaces
US4087585A (en) 1977-05-23 1978-05-02 Dow Corning Corporation Self-adhering silicone compositions and preparations thereof
US4370358A (en) 1980-09-22 1983-01-25 General Electric Company Ultraviolet curable silicone adhesives
JPS61195129A (ja) 1985-02-22 1986-08-29 Toray Silicone Co Ltd 有機けい素重合体の製造方法
US4584361A (en) 1985-06-03 1986-04-22 Dow Corning Corporation Storage stable, one part polyorganosiloxane compositions
JPS62223788A (ja) 1986-03-26 1987-10-01 株式会社日立製作所 デイスプレイ装置
JP2670804B2 (ja) 1988-05-06 1997-10-29 コスモ石油株式会社 塗膜塗料組成物
US5036117A (en) 1989-11-03 1991-07-30 Dow Corning Corporation Heat-curable silicone compositions having improved bath life
JP3029680B2 (ja) 1991-01-29 2000-04-04 東レ・ダウコーニング・シリコーン株式会社 オルガノペンタシロキサンおよびその製造方法
JP2511348B2 (ja) 1991-10-17 1996-06-26 東レ・ダウコーニング・シリコーン株式会社 オルガノポリシロキサンおよびその製造方法
JP3046484B2 (ja) * 1993-12-28 2000-05-29 ジーイー東芝シリコーン株式会社 安定した電気特性を有するシリコーンゴム組成物
EP0892978A1 (en) 1997-02-07 1999-01-27 Loctite Corporation Conductive, resin-based compositions
JPH1145965A (ja) * 1997-07-28 1999-02-16 Kyocera Corp 伝熱性化合物およびこれを用いた半導体装置
JP3444199B2 (ja) 1998-06-17 2003-09-08 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及びその製造方法
ATE323305T1 (de) 1998-07-24 2006-04-15 Sun Microsystems Inc Verfahren und vorrichtung zur durchführung einer deterministischen speicherzuordnungsantwort in einem computer-system
JP4727017B2 (ja) * 1999-11-15 2011-07-20 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
US20030207128A1 (en) * 2000-04-10 2003-11-06 Tomoaki Uchiya Thermally conductive sheet
US20040092655A1 (en) * 2001-04-02 2004-05-13 Takayoshi Otomo Mouldable silicone gel compositions
US20040195678A1 (en) * 2001-07-02 2004-10-07 Yoshinao Yamazaki Thermoconductive composition
JP4551074B2 (ja) 2003-10-07 2010-09-22 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP4413649B2 (ja) * 2004-03-03 2010-02-10 日産自動車株式会社 放熱構造体及びその製造方法
US20050228097A1 (en) * 2004-03-30 2005-10-13 General Electric Company Thermally conductive compositions and methods of making thereof
US7655719B2 (en) * 2004-07-13 2010-02-02 Cool Options, Inc. Thermally conductive polymer compositions having moderate tensile and flexural properties
JP4828146B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP4828145B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
US20070219312A1 (en) * 2006-03-17 2007-09-20 Jennifer Lynn David Silicone adhesive composition and method for preparing the same
TWI380325B (en) * 2006-09-26 2012-12-21 Polytronics Technology Corp Heat-conductive dielectric polymer composition and heat dissipation substrate containing the same
DE102006048575A1 (de) * 2006-10-13 2008-04-17 Evonik Degussa Gmbh Oberflächenmodifizierte Kieselsäuren
JP4970987B2 (ja) * 2007-03-08 2012-07-11 株式会社メニコン 眼用レンズ材料用シリコーンインク組成物
EP2183312A1 (en) * 2007-08-31 2010-05-12 Cabot Corporation Thermal interface materials
JP4572243B2 (ja) 2008-03-27 2010-11-04 信越化学工業株式会社 熱伝導性積層体およびその製造方法
JP5329114B2 (ja) * 2008-03-31 2013-10-30 株式会社ジーシー 歯科用シリコーン系適合試験材組成物
EP2406321A1 (en) * 2009-03-12 2012-01-18 Dow Corning Corporation Thermal interface materials and methods for their preparation and use
JP5538872B2 (ja) * 2009-12-24 2014-07-02 東レ・ダウコーニング株式会社 シリコーンエラストマー組成物
JP5783128B2 (ja) 2012-04-24 2015-09-24 信越化学工業株式会社 加熱硬化型熱伝導性シリコーングリース組成物
JP5947267B2 (ja) 2013-09-20 2016-07-06 信越化学工業株式会社 シリコーン組成物及び熱伝導性シリコーン組成物の製造方法
EP3150672B1 (en) 2015-10-02 2018-05-09 Shin-Etsu Chemical Co., Ltd. Thermal conductive silicone composition and semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5153244A (en) * 1989-10-31 1992-10-06 Dow Corning Toray Silicone Company, Ltd. Curable organosiloxane composition yielding elastomers exhibiting reduced compression set values
TWI303261B (cg-RX-API-DMAC7.html) * 2001-05-01 2008-11-21 Shinetsu Chemical Co

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