TWI602231B - A substrate processing apparatus, a deposit removal method for a substrate processing apparatus, and a storage medium - Google Patents

A substrate processing apparatus, a deposit removal method for a substrate processing apparatus, and a storage medium Download PDF

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Publication number
TWI602231B
TWI602231B TW104113691A TW104113691A TWI602231B TW I602231 B TWI602231 B TW I602231B TW 104113691 A TW104113691 A TW 104113691A TW 104113691 A TW104113691 A TW 104113691A TW I602231 B TWI602231 B TW I602231B
Authority
TW
Taiwan
Prior art keywords
substrate
cover member
liquid
processing apparatus
wafer
Prior art date
Application number
TW104113691A
Other languages
English (en)
Chinese (zh)
Other versions
TW201612966A (en
Inventor
水野剛資
德永容一
難波宏光
植木達博
費茲安多
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TW201612966A publication Critical patent/TW201612966A/zh
Application granted granted Critical
Publication of TWI602231B publication Critical patent/TWI602231B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B3/00—Drying solid materials or objects by processes involving the application of heat
    • F26B3/18—Drying solid materials or objects by processes involving the application of heat by conduction, i.e. the heat is conveyed from the heat source, e.g. gas flame, to the materials or objects to be dried by direct contact
    • F26B3/20—Drying solid materials or objects by processes involving the application of heat by conduction, i.e. the heat is conveyed from the heat source, e.g. gas flame, to the materials or objects to be dried by direct contact the heat source being a heated surface, e.g. a moving belt or conveyor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microbiology (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Weting (AREA)
TW104113691A 2014-05-09 2015-04-29 A substrate processing apparatus, a deposit removal method for a substrate processing apparatus, and a storage medium TWI602231B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014098039A JP6329428B2 (ja) 2014-05-09 2014-05-09 基板処理装置、基板処理装置の付着物除去方法、及び記憶媒体

Publications (2)

Publication Number Publication Date
TW201612966A TW201612966A (en) 2016-04-01
TWI602231B true TWI602231B (zh) 2017-10-11

Family

ID=54367535

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104113691A TWI602231B (zh) 2014-05-09 2015-04-29 A substrate processing apparatus, a deposit removal method for a substrate processing apparatus, and a storage medium

Country Status (4)

Country Link
US (1) US20150323250A1 (https=)
JP (1) JP6329428B2 (https=)
KR (1) KR102354226B1 (https=)
TW (1) TWI602231B (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6584356B2 (ja) * 2016-03-30 2019-10-02 東京エレクトロン株式会社 基板処理装置及び基板処理装置の処理方法
JP6833548B2 (ja) * 2016-06-30 2021-02-24 キヤノン株式会社 搬送システム、搬送方法、パターン形成装置、及び物品の製造方法
JP6925185B2 (ja) * 2017-06-30 2021-08-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6980457B2 (ja) * 2017-08-23 2021-12-15 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
KR20250005423A (ko) * 2018-01-23 2025-01-09 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 처리 방법
JP7144982B2 (ja) * 2018-06-22 2022-09-30 東京エレクトロン株式会社 基板処理装置
JP7117392B2 (ja) * 2018-11-16 2022-08-12 東京エレクトロン株式会社 基板処理装置及び基板処理装置の洗浄方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010150080A (ja) * 2008-12-25 2010-07-08 Disco Abrasive Syst Ltd シリコンブロックの処理方法
US20130008602A1 (en) * 2011-07-07 2013-01-10 Lam Research Ag Apparatus for treating a wafer-shaped article

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JPH07230954A (ja) * 1994-02-16 1995-08-29 Mitsubishi Electric Corp プラズマ処理装置及びプラズマ処理装置におけるクリーニング方法
US6179915B1 (en) * 1998-11-17 2001-01-30 Promos Technology, Inc On track coater unit cup set
JP2002141326A (ja) * 2000-11-01 2002-05-17 Hitachi Ltd 板状試料の流体処理方法ならびにその装置
JP2002334823A (ja) * 2001-05-08 2002-11-22 Matsushita Electric Ind Co Ltd ベーク方法、ベーク装置及び液晶表示素子の製造方法
US20030010091A1 (en) * 2001-07-10 2003-01-16 Mitchell Bradley Dale System and method for detecting occlusions in a semiconductor manufacturing device
JP5109376B2 (ja) * 2007-01-22 2012-12-26 東京エレクトロン株式会社 加熱装置、加熱方法及び記憶媒体
JP5437168B2 (ja) * 2009-08-07 2014-03-12 東京エレクトロン株式会社 基板の液処理装置および液処理方法
KR101590661B1 (ko) * 2010-09-13 2016-02-01 도쿄엘렉트론가부시키가이샤 액처리 장치, 액처리 방법 및 기억 매체
JP5606992B2 (ja) * 2011-06-09 2014-10-15 東京エレクトロン株式会社 液処理装置および液処理方法
JP5522144B2 (ja) * 2011-10-25 2014-06-18 東京エレクトロン株式会社 加熱装置、加熱方法及び記憶媒体
JP5693438B2 (ja) * 2011-12-16 2015-04-01 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
JP5996381B2 (ja) * 2011-12-28 2016-09-21 東京エレクトロン株式会社 基板処理装置および基板処理方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010150080A (ja) * 2008-12-25 2010-07-08 Disco Abrasive Syst Ltd シリコンブロックの処理方法
US20130008602A1 (en) * 2011-07-07 2013-01-10 Lam Research Ag Apparatus for treating a wafer-shaped article

Also Published As

Publication number Publication date
JP2015216224A (ja) 2015-12-03
TW201612966A (en) 2016-04-01
KR102354226B1 (ko) 2022-01-21
JP6329428B2 (ja) 2018-05-23
US20150323250A1 (en) 2015-11-12
KR20150128596A (ko) 2015-11-18

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