TWI602229B - Wafer processing methods - Google Patents

Wafer processing methods Download PDF

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Publication number
TWI602229B
TWI602229B TW102143836A TW102143836A TWI602229B TW I602229 B TWI602229 B TW I602229B TW 102143836 A TW102143836 A TW 102143836A TW 102143836 A TW102143836 A TW 102143836A TW I602229 B TWI602229 B TW I602229B
Authority
TW
Taiwan
Prior art keywords
wafer
chuck table
program
height
processing
Prior art date
Application number
TW102143836A
Other languages
English (en)
Chinese (zh)
Other versions
TW201430931A (zh
Inventor
Rintaro Chano
Koichi Makino
Kokichi Minato
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of TW201430931A publication Critical patent/TW201430931A/zh
Application granted granted Critical
Publication of TWI602229B publication Critical patent/TWI602229B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02021—Edge treatment, chamfering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
TW102143836A 2013-01-21 2013-11-29 Wafer processing methods TWI602229B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013008068A JP6196776B2 (ja) 2013-01-21 2013-01-21 ウェーハの加工方法

Publications (2)

Publication Number Publication Date
TW201430931A TW201430931A (zh) 2014-08-01
TWI602229B true TWI602229B (zh) 2017-10-11

Family

ID=51191099

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102143836A TWI602229B (zh) 2013-01-21 2013-11-29 Wafer processing methods

Country Status (3)

Country Link
JP (1) JP6196776B2 (ja)
CN (1) CN103943488B (ja)
TW (1) TWI602229B (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104570502A (zh) * 2014-12-30 2015-04-29 深圳市华星光电技术有限公司 液晶面板之间隔物的制造方法及制造间隔物的设备
JP6695102B2 (ja) * 2015-05-26 2020-05-20 株式会社ディスコ 加工システム
JP6635864B2 (ja) * 2016-04-15 2020-01-29 株式会社ディスコ 加工装置
JP2018114580A (ja) * 2017-01-17 2018-07-26 株式会社ディスコ ウエーハの加工方法及び切削装置
JP6953075B2 (ja) * 2017-08-09 2021-10-27 株式会社ディスコ 切削装置及びウェーハの加工方法
US11101404B2 (en) 2018-03-26 2021-08-24 Nichia Corporation Method for manufacturing semiconductor device and semiconductor device
JP7222636B2 (ja) * 2018-09-12 2023-02-15 株式会社ディスコ エッジトリミング装置
JP2020051839A (ja) 2018-09-26 2020-04-02 株式会社ディスコ ウェーハの外周縁上面高さ測定装置
JP7016032B2 (ja) 2019-09-24 2022-02-04 日亜化学工業株式会社 半導体素子の製造方法
CN114888983A (zh) * 2022-05-31 2022-08-12 杭州中为光电技术有限公司 硅片自动倒角清洗一体化设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003251559A (ja) * 2002-02-28 2003-09-09 Ebara Corp 研磨装置及び研磨面の異物検出方法
JP2005197578A (ja) * 2004-01-09 2005-07-21 Disco Abrasive Syst Ltd 板状物に形成された電極の加工装置，板状物に形成された電極の加工方法，及び板状物に形成された電極の加工装置のチャックテーブルの平面度測定方法
JP2008212921A (ja) * 2007-02-08 2008-09-18 Toray Ind Inc 塗布方法、プラズマディスプレイ用部材の製造方法および塗布装置
JP2012238658A (ja) * 2011-05-10 2012-12-06 Disco Abrasive Syst Ltd ウエーハの面取り部除去装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06196381A (ja) * 1992-12-22 1994-07-15 Canon Inc 基板保持装置
JP3628538B2 (ja) * 1999-01-12 2005-03-16 シャープ株式会社 基板面取装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003251559A (ja) * 2002-02-28 2003-09-09 Ebara Corp 研磨装置及び研磨面の異物検出方法
JP2005197578A (ja) * 2004-01-09 2005-07-21 Disco Abrasive Syst Ltd 板状物に形成された電極の加工装置，板状物に形成された電極の加工方法，及び板状物に形成された電極の加工装置のチャックテーブルの平面度測定方法
JP2008212921A (ja) * 2007-02-08 2008-09-18 Toray Ind Inc 塗布方法、プラズマディスプレイ用部材の製造方法および塗布装置
JP2012238658A (ja) * 2011-05-10 2012-12-06 Disco Abrasive Syst Ltd ウエーハの面取り部除去装置

Also Published As

Publication number Publication date
CN103943488B (zh) 2018-04-20
CN103943488A (zh) 2014-07-23
JP2014139964A (ja) 2014-07-31
TW201430931A (zh) 2014-08-01
JP6196776B2 (ja) 2017-09-13

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