JP6196776B2 - ウェーハの加工方法 - Google Patents
ウェーハの加工方法 Download PDFInfo
- Publication number
- JP6196776B2 JP6196776B2 JP2013008068A JP2013008068A JP6196776B2 JP 6196776 B2 JP6196776 B2 JP 6196776B2 JP 2013008068 A JP2013008068 A JP 2013008068A JP 2013008068 A JP2013008068 A JP 2013008068A JP 6196776 B2 JP6196776 B2 JP 6196776B2
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- JP
- Japan
- Prior art keywords
- wafer
- outer peripheral
- chuck table
- height
- chamfered portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02021—Edge treatment, chamfering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Description
5 チャックテーブル
6 測定手段
8 切削手段
51 制御手段
52 判定手段
53 報知手段
91 外周面取り部
W ウェーハ
Claims (1)
- 外周面取り部を有するウェーハの該外周面取り部を除去するウェーハの加工方法であって、
回転可能なチャックテーブルの回転中心にウェーハの中心を位置付けて該チャックテーブル上面にウェーハを保持するウェーハ保持工程と、
該ウェーハ保持工程の後に、高さを測定する測定手段をウェーハの外周面取り部近傍に位置付けて、チャックテーブルを回転させながらウェーハの上面側の外周面取り部の高さを全周にわたって測定する外周高さ測定工程と、
該外周高さ測定工程において高さバラツキが所定値を超えた場合に、エラーを報知する報知工程と、
該外周高さ測定工程において全周にわたって高さバラツキが所定値以下の場合に、切削ブレードによりウェーハの外周面取り部を除去する除去工程と、
該報知工程の後に、ウェーハの裏面及び該チャックテーブルの表面を洗浄する洗浄工程と、から構成され、
該洗浄工程の後に、再び該ウェーハ保持工程及び該外周高さ工程を実施することを特徴とするウェーハの加工方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013008068A JP6196776B2 (ja) | 2013-01-21 | 2013-01-21 | ウェーハの加工方法 |
TW102143836A TWI602229B (zh) | 2013-01-21 | 2013-11-29 | Wafer processing methods |
CN201410014268.0A CN103943488B (zh) | 2013-01-21 | 2014-01-13 | 晶片的加工方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013008068A JP6196776B2 (ja) | 2013-01-21 | 2013-01-21 | ウェーハの加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014139964A JP2014139964A (ja) | 2014-07-31 |
JP6196776B2 true JP6196776B2 (ja) | 2017-09-13 |
Family
ID=51191099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013008068A Active JP6196776B2 (ja) | 2013-01-21 | 2013-01-21 | ウェーハの加工方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6196776B2 (ja) |
CN (1) | CN103943488B (ja) |
TW (1) | TWI602229B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200035341A (ko) | 2018-09-26 | 2020-04-03 | 가부시기가이샤 디스코 | 웨이퍼의 외주 가장자리 상면 높이 측정 장치 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104570502A (zh) * | 2014-12-30 | 2015-04-29 | 深圳市华星光电技术有限公司 | 液晶面板之间隔物的制造方法及制造间隔物的设备 |
JP6695102B2 (ja) * | 2015-05-26 | 2020-05-20 | 株式会社ディスコ | 加工システム |
JP6635864B2 (ja) * | 2016-04-15 | 2020-01-29 | 株式会社ディスコ | 加工装置 |
JP2018114580A (ja) * | 2017-01-17 | 2018-07-26 | 株式会社ディスコ | ウエーハの加工方法及び切削装置 |
JP6953075B2 (ja) * | 2017-08-09 | 2021-10-27 | 株式会社ディスコ | 切削装置及びウェーハの加工方法 |
US11101404B2 (en) | 2018-03-26 | 2021-08-24 | Nichia Corporation | Method for manufacturing semiconductor device and semiconductor device |
JP7222636B2 (ja) * | 2018-09-12 | 2023-02-15 | 株式会社ディスコ | エッジトリミング装置 |
JP7016032B2 (ja) | 2019-09-24 | 2022-02-04 | 日亜化学工業株式会社 | 半導体素子の製造方法 |
CN114888983A (zh) * | 2022-05-31 | 2022-08-12 | 杭州中为光电技术有限公司 | 硅片自动倒角清洗一体化设备 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06196381A (ja) * | 1992-12-22 | 1994-07-15 | Canon Inc | 基板保持装置 |
JP3628538B2 (ja) * | 1999-01-12 | 2005-03-16 | シャープ株式会社 | 基板面取装置 |
JP4102081B2 (ja) * | 2002-02-28 | 2008-06-18 | 株式会社荏原製作所 | 研磨装置及び研磨面の異物検出方法 |
JP4615225B2 (ja) * | 2004-01-09 | 2011-01-19 | 株式会社ディスコ | 板状物に形成された電極の加工装置,板状物に形成された電極の加工方法,及び板状物に形成された電極の加工装置のチャックテーブルの平面度測定方法 |
JP2008212921A (ja) * | 2007-02-08 | 2008-09-18 | Toray Ind Inc | 塗布方法、プラズマディスプレイ用部材の製造方法および塗布装置 |
JP5922342B2 (ja) * | 2011-05-10 | 2016-05-24 | 株式会社ディスコ | ウエーハの面取り部除去装置 |
-
2013
- 2013-01-21 JP JP2013008068A patent/JP6196776B2/ja active Active
- 2013-11-29 TW TW102143836A patent/TWI602229B/zh active
-
2014
- 2014-01-13 CN CN201410014268.0A patent/CN103943488B/zh active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200035341A (ko) | 2018-09-26 | 2020-04-03 | 가부시기가이샤 디스코 | 웨이퍼의 외주 가장자리 상면 높이 측정 장치 |
Also Published As
Publication number | Publication date |
---|---|
TW201430931A (zh) | 2014-08-01 |
TWI602229B (zh) | 2017-10-11 |
CN103943488A (zh) | 2014-07-23 |
JP2014139964A (ja) | 2014-07-31 |
CN103943488B (zh) | 2018-04-20 |
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