TWI600738B - Wafer resin film formation sheet - Google Patents

Wafer resin film formation sheet Download PDF

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Publication number
TWI600738B
TWI600738B TW102107987A TW102107987A TWI600738B TW I600738 B TWI600738 B TW I600738B TW 102107987 A TW102107987 A TW 102107987A TW 102107987 A TW102107987 A TW 102107987A TW I600738 B TWI600738 B TW I600738B
Authority
TW
Taiwan
Prior art keywords
resin film
forming layer
wafer
film forming
sheet
Prior art date
Application number
TW102107987A
Other languages
English (en)
Chinese (zh)
Other versions
TW201402758A (zh
Inventor
Yuichiro Azuma
Isao Ichikawa
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of TW201402758A publication Critical patent/TW201402758A/zh
Application granted granted Critical
Publication of TWI600738B publication Critical patent/TWI600738B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
TW102107987A 2012-03-07 2013-03-07 Wafer resin film formation sheet TWI600738B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012050787 2012-03-07

Publications (2)

Publication Number Publication Date
TW201402758A TW201402758A (zh) 2014-01-16
TWI600738B true TWI600738B (zh) 2017-10-01

Family

ID=49116743

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102107987A TWI600738B (zh) 2012-03-07 2013-03-07 Wafer resin film formation sheet

Country Status (5)

Country Link
JP (1) JP6239498B2 (ko)
KR (3) KR101584473B1 (ko)
CN (1) CN104160491B (ko)
TW (1) TWI600738B (ko)
WO (1) WO2013133268A1 (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6646360B2 (ja) * 2015-04-24 2020-02-14 日東電工株式会社 封止用樹脂シート、及び、電子デバイス装置
JP6683563B2 (ja) * 2015-07-21 2020-04-22 積水化学工業株式会社 接着シート
CN111372771A (zh) * 2017-12-08 2020-07-03 积水化学工业株式会社 叠层体以及电子装置
JP2018139326A (ja) * 2018-05-31 2018-09-06 日東電工株式会社 電子デバイス装置の製造方法
ES2874676T3 (es) * 2019-02-27 2021-11-05 Roehm Gmbh Etiquetas de prevención de falsificaciones para aplicaciones a alta temperatura
KR20220035462A (ko) * 2019-08-26 2022-03-22 후지필름 가부시키가이샤 열전도 재료 형성용 조성물, 열전도 재료, 열전도 시트, 열전도층 포함 디바이스
CN112582281B (zh) * 2019-09-29 2023-08-25 矽磐微电子(重庆)有限公司 半导体封装方法及半导体封装结构
CN112582282B (zh) * 2019-09-29 2023-07-25 矽磐微电子(重庆)有限公司 半导体封装方法及半导体封装结构
CN112582283B (zh) * 2019-09-29 2023-11-21 矽磐微电子(重庆)有限公司 半导体封装方法及半导体封装结构
WO2023248380A1 (ja) * 2022-06-22 2023-12-28 三菱電機株式会社 熱伝導性樹脂組成物、熱伝導性シートおよびその製造方法、熱伝導性硬化物およびその製造方法、パワーモジュール、ならびに、モータのステータ

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007106901A (ja) * 2005-10-14 2007-04-26 Showa Denko Kk 熱伝導性樹脂組成物、その構造体及びその用途
JP2010087235A (ja) * 2008-09-30 2010-04-15 Sumitomo Bakelite Co Ltd 樹脂組成物および樹脂組成物を使用して作製した半導体装置
JP2010121102A (ja) * 2008-10-20 2010-06-03 Kaneka Corp 高耐光性高熱伝導性樹脂成形体及び照明器具部材
JP2011225856A (ja) * 2010-03-31 2011-11-10 Toray Ind Inc 電子機器用接着剤組成物およびそれを用いた電子機器用接着剤シート
TW201144403A (en) * 2010-02-12 2011-12-16 Nitto Denko Corp Method for manufacturing adhesive sheet having heat conductivity

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JP3005324B2 (ja) * 1991-07-09 2000-01-31 東洋高砂乾電池株式会社 高熱放散材組成物
JP3378374B2 (ja) * 1993-09-14 2003-02-17 株式会社東芝 樹脂封止型半導体装置の製造方法、樹脂封止型半導体装置及び封止用樹脂シート
KR950010029A (ko) * 1993-09-14 1995-04-26 사토 후미오 수지 밀봉형 반도체장치 및 그 제조방법
JP2002030223A (ja) * 2000-07-18 2002-01-31 Sekisui Chem Co Ltd 熱伝導性樹脂組成物
JP2002069392A (ja) 2000-08-31 2002-03-08 Polymatech Co Ltd 熱伝導性接着フィルムおよびその製造方法ならびに電子部品
JP5134747B2 (ja) * 2000-11-28 2013-01-30 日立化成工業株式会社 接着フィルム及び半導体装置
JP3544362B2 (ja) 2001-03-21 2004-07-21 リンテック株式会社 半導体チップの製造方法
JP2010235953A (ja) 2002-05-02 2010-10-21 Three M Innovative Properties Co 熱伝導性シート並びにその製造方法
JP4089636B2 (ja) * 2004-02-19 2008-05-28 三菱電機株式会社 熱伝導性樹脂シートの製造方法およびパワーモジュールの製造方法
JP2005281467A (ja) * 2004-03-29 2005-10-13 Toshiba Corp 高熱伝導性樹脂、および部材、ならびにそれらを用いた電気機器および半導体装置
JP4893046B2 (ja) * 2006-03-22 2012-03-07 東レ株式会社 電子機器用接着剤組成物、それを用いた電子機器用接着剤シート
JP5005258B2 (ja) 2006-05-23 2012-08-22 リンテック株式会社 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
JP5407601B2 (ja) * 2008-09-01 2014-02-05 油化電子株式会社 熱伝導成形体
US20100252961A1 (en) * 2009-04-06 2010-10-07 3M Innovative Properties Company Optical film replication on low thermal diffusivity tooling with conformal coating
JP5023179B2 (ja) * 2010-03-31 2012-09-12 リンテック株式会社 チップ用樹脂膜形成用シートおよび半導体チップの製造方法
JP6182967B2 (ja) * 2013-05-09 2017-08-23 日立化成株式会社 半導体素子用高熱伝導性接着フィルム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007106901A (ja) * 2005-10-14 2007-04-26 Showa Denko Kk 熱伝導性樹脂組成物、その構造体及びその用途
JP2010087235A (ja) * 2008-09-30 2010-04-15 Sumitomo Bakelite Co Ltd 樹脂組成物および樹脂組成物を使用して作製した半導体装置
JP2010121102A (ja) * 2008-10-20 2010-06-03 Kaneka Corp 高耐光性高熱伝導性樹脂成形体及び照明器具部材
TW201144403A (en) * 2010-02-12 2011-12-16 Nitto Denko Corp Method for manufacturing adhesive sheet having heat conductivity
JP2011225856A (ja) * 2010-03-31 2011-11-10 Toray Ind Inc 電子機器用接着剤組成物およびそれを用いた電子機器用接着剤シート

Also Published As

Publication number Publication date
JP6239498B2 (ja) 2017-11-29
WO2013133268A1 (ja) 2013-09-12
CN104160491B (zh) 2018-05-11
CN104160491A (zh) 2014-11-19
JPWO2013133268A1 (ja) 2015-07-30
KR20140128999A (ko) 2014-11-06
KR101969991B1 (ko) 2019-04-17
KR101584473B1 (ko) 2016-01-11
KR20160018876A (ko) 2016-02-17
KR20160006801A (ko) 2016-01-19
TW201402758A (zh) 2014-01-16

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