JP6239498B2 - チップ用樹脂膜形成用シート - Google Patents

チップ用樹脂膜形成用シート Download PDF

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Publication number
JP6239498B2
JP6239498B2 JP2014503852A JP2014503852A JP6239498B2 JP 6239498 B2 JP6239498 B2 JP 6239498B2 JP 2014503852 A JP2014503852 A JP 2014503852A JP 2014503852 A JP2014503852 A JP 2014503852A JP 6239498 B2 JP6239498 B2 JP 6239498B2
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JP
Japan
Prior art keywords
resin film
forming layer
film forming
sheet
chip
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JP2014503852A
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English (en)
Japanese (ja)
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JPWO2013133268A1 (ja
Inventor
祐一郎 吾妻
祐一郎 吾妻
市川　功
功 市川
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Lintec Corp
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Lintec Corp
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Publication date
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Publication of JPWO2013133268A1 publication Critical patent/JPWO2013133268A1/ja
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Publication of JP6239498B2 publication Critical patent/JP6239498B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
JP2014503852A 2012-03-07 2013-03-05 チップ用樹脂膜形成用シート Active JP6239498B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012050787 2012-03-07
JP2012050787 2012-03-07
PCT/JP2013/055981 WO2013133268A1 (ja) 2012-03-07 2013-03-05 チップ用樹脂膜形成用シート

Publications (2)

Publication Number Publication Date
JPWO2013133268A1 JPWO2013133268A1 (ja) 2015-07-30
JP6239498B2 true JP6239498B2 (ja) 2017-11-29

Family

ID=49116743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014503852A Active JP6239498B2 (ja) 2012-03-07 2013-03-05 チップ用樹脂膜形成用シート

Country Status (5)

Country Link
JP (1) JP6239498B2 (ko)
KR (3) KR101584473B1 (ko)
CN (1) CN104160491B (ko)
TW (1) TWI600738B (ko)
WO (1) WO2013133268A1 (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6646360B2 (ja) * 2015-04-24 2020-02-14 日東電工株式会社 封止用樹脂シート、及び、電子デバイス装置
JP6683563B2 (ja) * 2015-07-21 2020-04-22 積水化学工業株式会社 接着シート
CN111372771A (zh) * 2017-12-08 2020-07-03 积水化学工业株式会社 叠层体以及电子装置
JP2018139326A (ja) * 2018-05-31 2018-09-06 日東電工株式会社 電子デバイス装置の製造方法
ES2874676T3 (es) * 2019-02-27 2021-11-05 Roehm Gmbh Etiquetas de prevención de falsificaciones para aplicaciones a alta temperatura
KR20220035462A (ko) * 2019-08-26 2022-03-22 후지필름 가부시키가이샤 열전도 재료 형성용 조성물, 열전도 재료, 열전도 시트, 열전도층 포함 디바이스
CN112582281B (zh) * 2019-09-29 2023-08-25 矽磐微电子(重庆)有限公司 半导体封装方法及半导体封装结构
CN112582282B (zh) * 2019-09-29 2023-07-25 矽磐微电子(重庆)有限公司 半导体封装方法及半导体封装结构
CN112582283B (zh) * 2019-09-29 2023-11-21 矽磐微电子(重庆)有限公司 半导体封装方法及半导体封装结构
WO2023248380A1 (ja) * 2022-06-22 2023-12-28 三菱電機株式会社 熱伝導性樹脂組成物、熱伝導性シートおよびその製造方法、熱伝導性硬化物およびその製造方法、パワーモジュール、ならびに、モータのステータ

Family Cites Families (21)

* Cited by examiner, † Cited by third party
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JP3005324B2 (ja) * 1991-07-09 2000-01-31 東洋高砂乾電池株式会社 高熱放散材組成物
JP3378374B2 (ja) * 1993-09-14 2003-02-17 株式会社東芝 樹脂封止型半導体装置の製造方法、樹脂封止型半導体装置及び封止用樹脂シート
KR950010029A (ko) * 1993-09-14 1995-04-26 사토 후미오 수지 밀봉형 반도체장치 및 그 제조방법
JP2002030223A (ja) * 2000-07-18 2002-01-31 Sekisui Chem Co Ltd 熱伝導性樹脂組成物
JP2002069392A (ja) 2000-08-31 2002-03-08 Polymatech Co Ltd 熱伝導性接着フィルムおよびその製造方法ならびに電子部品
JP5134747B2 (ja) * 2000-11-28 2013-01-30 日立化成工業株式会社 接着フィルム及び半導体装置
JP3544362B2 (ja) 2001-03-21 2004-07-21 リンテック株式会社 半導体チップの製造方法
JP2010235953A (ja) 2002-05-02 2010-10-21 Three M Innovative Properties Co 熱伝導性シート並びにその製造方法
JP4089636B2 (ja) * 2004-02-19 2008-05-28 三菱電機株式会社 熱伝導性樹脂シートの製造方法およびパワーモジュールの製造方法
JP2005281467A (ja) * 2004-03-29 2005-10-13 Toshiba Corp 高熱伝導性樹脂、および部材、ならびにそれらを用いた電気機器および半導体装置
JP4812391B2 (ja) * 2005-10-14 2011-11-09 昭和電工株式会社 熱伝導性樹脂組成物、その構造体及びその用途
JP4893046B2 (ja) * 2006-03-22 2012-03-07 東レ株式会社 電子機器用接着剤組成物、それを用いた電子機器用接着剤シート
JP5005258B2 (ja) 2006-05-23 2012-08-22 リンテック株式会社 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
JP5407601B2 (ja) * 2008-09-01 2014-02-05 油化電子株式会社 熱伝導成形体
JP5332464B2 (ja) * 2008-09-30 2013-11-06 住友ベークライト株式会社 樹脂組成物および樹脂組成物を使用して作製した半導体装置
JP5308859B2 (ja) * 2008-10-20 2013-10-09 株式会社カネカ 高耐光性高熱伝導性照明器具用樹脂成形体
US20100252961A1 (en) * 2009-04-06 2010-10-07 3M Innovative Properties Company Optical film replication on low thermal diffusivity tooling with conformal coating
JP2011162706A (ja) * 2010-02-12 2011-08-25 Nitto Denko Corp 熱伝導性粘着シートの製造方法
JP5742375B2 (ja) * 2010-03-31 2015-07-01 東レ株式会社 電子機器用接着剤組成物およびそれを用いた電子機器用接着剤シート
JP5023179B2 (ja) * 2010-03-31 2012-09-12 リンテック株式会社 チップ用樹脂膜形成用シートおよび半導体チップの製造方法
JP6182967B2 (ja) * 2013-05-09 2017-08-23 日立化成株式会社 半導体素子用高熱伝導性接着フィルム

Also Published As

Publication number Publication date
TWI600738B (zh) 2017-10-01
WO2013133268A1 (ja) 2013-09-12
CN104160491B (zh) 2018-05-11
CN104160491A (zh) 2014-11-19
JPWO2013133268A1 (ja) 2015-07-30
KR20140128999A (ko) 2014-11-06
KR101969991B1 (ko) 2019-04-17
KR101584473B1 (ko) 2016-01-11
KR20160018876A (ko) 2016-02-17
KR20160006801A (ko) 2016-01-19
TW201402758A (zh) 2014-01-16

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