JP6336905B2 - フィルム状接着剤、半導体接合用接着シート、および半導体装置の製造方法 - Google Patents
フィルム状接着剤、半導体接合用接着シート、および半導体装置の製造方法 Download PDFInfo
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- JP6336905B2 JP6336905B2 JP2014528238A JP2014528238A JP6336905B2 JP 6336905 B2 JP6336905 B2 JP 6336905B2 JP 2014528238 A JP2014528238 A JP 2014528238A JP 2014528238 A JP2014528238 A JP 2014528238A JP 6336905 B2 JP6336905 B2 JP 6336905B2
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Classifications
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- C—CHEMISTRY; METALLURGY
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
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- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
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- C—CHEMISTRY; METALLURGY
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1811—C10or C11-(Meth)acrylate, e.g. isodecyl (meth)acrylate, isobornyl (meth)acrylate or 2-naphthyl (meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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Description
〔1〕バインダー樹脂(A)、エポキシ樹脂(B)、熱硬化剤(C)及びフィラー(D)を含むフィルム状接着剤であって、
D65標準光源における全光線透過率が70%以上であり、
ヘイズ値が50%以下であるフィルム状接着剤。
ウエハにフィルム状接着剤または半導体接合用接着シートの接着剤層を貼付する工程、ウエハを個片化しチップを得る工程、及びフィルム状接着剤または接着剤層を介してチップを固定する工程を含む半導体装置の製造方法。
本発明のフィルム状接着剤は、バインダー樹脂(A)、エポキシ樹脂(B)、熱硬化剤(C)及びフィラー(D)を必須成分として含み、各種物性を改良するため、必要に応じ他の成分を含んでいてもよい。以下、これらの各成分について具体的に説明する。
バインダー樹脂は、フィルム状接着剤に造膜性と可とう性を与える重合体成分であれば限定されないが、たとえばアクリル重合体、ポリエステル樹脂、ポリビニルアルコール樹脂、ポリビニルブチラール、ポリ塩化ビニル、ポリスチレン、ポリアミド樹脂、セルロース、ポリエチレン、ポリイソブチレン、ポリビニルエーテル、ポリイミド樹脂、フェノキシ樹脂、スチレン−イソプレン−スチレンブロック共重合体、スチレン−ブタジエン−スチレンブロック共重合体などが挙げられる。これらのバインダー樹脂は、単独で用いてもよいし、2種以上を組み合わせて用いてもよいが、異種のバインダー樹脂同士の相溶性が低いことに起因したフィルム状接着剤の透明性の低下を避ける観点からは、単独で用いることが好ましく、2種以上を組み合わせる場合は、組成が似通ったものを選択するなど、相溶性を低下させないように選択することが好ましい。上記に挙げたものの中でも、フィルム状接着剤の種々の特性、特にバインダー樹脂と他の成分の相溶性を調整しやすいアクリル重合体を用いることが好ましい。
エポキシ樹脂(B)としては、従来公知の種々のエポキシ樹脂を用いることができる。エポキシ樹脂としては、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、フェニレン骨格型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、ビフェニル型エポキシ樹脂、トリフェノールメタン型エポキシ樹脂、複素環型エポキシ樹脂、スチルベン型エポキシ樹脂、縮合環芳香族炭化水素変性エポキシ樹脂や、これらのハロゲン化物などの構造単位中に2つ以上の官能基が含まれるエポキシ樹脂が挙げられる。また、不飽和炭化水素基を有するものを用いてもよい。このようなエポキシ樹脂は、たとえば特開2008−133330に開示されている。エポキシ樹脂のエポキシ当量は特に限定されないが、150〜250(g/eq)であることが好ましい。エポキシ当量は、JIS K7236;2001に準じて測定される値である。これらのエポキシ樹脂は1種単独で用いてもよく、2種類以上を併用してもよい。
熱硬化剤(C)は、エポキシ樹脂(B)に対する熱硬化剤として機能する。熱硬化剤(C)としては、エポキシ基と反応しうる官能基を分子中に2個以上有する化合物が挙げられる。エポキシ基と反応しうる官能基としてはフェノール性水酸基、アルコール性水酸基、アミノ基、カルボキシル基、酸無水物に由来する官能基などが挙げられ、これらの中では、フェノール性水酸基、アミノ基および酸無水物に由来する官能基が好ましく、フェノール性水酸基およびアミノ基がより好ましい。
フィルム状接着剤にフィラー(D)を配合することにより、フィルム状接着剤の線膨張係数を調整できる場合がある。また、フィルム状接着剤の硬化後の吸湿率をより低減することも可能となる。吸湿率を低減することにより、半導体パッケージの信頼性を向上できる。フィラーは、いわゆる無機充填剤、有機充填剤のいずれであってもよいが、耐熱性の観点から無機充填剤が好ましく用いられる。
フィラー(D)の平均粒子径は、より好ましくは1〜40nm、特に好ましくは10〜30nmである。フィラー(D)の平均粒子径がこのような範囲にあることで、フィルム状接着剤の厚みが厚い場合であっても、ヘイズ値を低く抑え、全光線透過率を高く維持することが可能となる。
フィラー(D)の平均粒子径は、レーザー回折・散乱法によって測定される体積平均粒子径を示す。
他の成分としては、下記成分が挙げられる。
硬化促進剤(E)は、フィルム状接着剤の硬化速度を調整するために用いられる。好ましい硬化促進剤としては、トリエチレンジアミン、ベンジルジメチルアミン、トリエタノールアミン、ジメチルアミノエタノール、トリス(ジメチルアミノメチル)フェノールなどの3級アミン類;2−メチルイミダゾール、2−フェニルイミダゾール、2−フェニル−4−メチルイミダゾール、2−フェニル−4,5−ジヒドロキシメチルイミダゾール、2−フェニル−4−メチル−5−ヒドロキシメチルイミダゾールなどのイミダゾール類;トリブチルホスフィン、ジフェニルホスフィン、トリフェニルホスフィンなどの有機ホスフィン類;テトラフェニルホスホニウムテトラフェニルボレート、トリフェニルホスフィンテトラフェニルボレートなどのテトラフェニルボロン塩などが挙げられる。これらは1種単独で、または2種以上混合して使用することができる。
半導体ウエハやチップ等の無機物と反応する官能基及びバインダー樹脂(A)やエポキシ樹脂(B)等が有する有機官能基と反応する官能基を有するカップリング剤(F)を用いることで、フィルム状接着剤の被着体に対する接着力を向上させることができる。また、フィルム状接着剤を硬化して得られる硬化物の耐熱性を損なうことなく、その耐水性を向上させることができる。カップリング剤(F)としては、シランカップリング剤が好ましい。
フィルム状接着剤は、エネルギー線重合性化合物(G)を含有してもよい。エネルギー線重合性化合物(G)は、不飽和炭化水素基を含み、紫外線、電子線等のエネルギー線の照射を受けると重合硬化する。エネルギー線重合性化合物(G)をエネルギー線照射によって重合させることで、フィルム状接着剤の接着力を低下させることができる。このため、支持シートとフィルム状接着剤との層間剥離を容易に行えるようになる。
フィルム状接着剤にエネルギー線重合性化合物(G)を配合する場合、紫外線などのエネルギー線を照射して、フィルム状接着剤からなる接着剤層の支持シートからの剥離性を向上させることができる。フィルム状接着剤中に光重合開始剤(H)を含有させることで、重合・硬化時間および光線照射量を少なくすることができる。
フィルム状接着剤には、その初期接着力及び凝集力を調節するために、架橋剤(I)を添加することもできる。架橋剤(I)としては有機多価イソシアネート化合物、有機多価イミン化合物などが挙げられる。
フィルム状接着剤には、上記の他に、必要に応じて各種添加剤が配合されてもよい。各種添加剤としては、可塑剤、帯電防止剤、酸化防止剤、難燃剤、ゲッタリング剤や連鎖移動剤などが挙げられる。
全光線透過率が70%未満であったり、ヘイズ値が50%を超えると、半導体装置の製造工程において、フィルム状接着剤付チップを基板や他のチップ等に固定(ダイボンド)する際、あるいは、フィルム状接着剤付基板に半導体チップ等を固定する際に、アライメント(位置決め)マークを読み取ることが困難になり、正確にダイボンドすることができない。
フィルム状接着剤のD65標準光源における全光線透過率は、好ましくは75〜100%であり、ヘイズ値は、好ましくは1〜40%である。
フィルム状接着剤の全光線透過率やヘイズ値は、フィラー(D)の平均粒子径や、フィラー(D)以外の各成分の相溶性を調整することにより制御できる。
本発明に係る半導体接合用接着シートは、上記の各成分からなるフィルム状接着剤からなる接着剤層を、支持シート上に積層して製造される。接着剤層は、感圧接着性または熱接着性と加熱硬化性とを有する。接着剤層が感圧接着性を有する場合には、未硬化状態で被着体に押圧して貼付することができる。また、接着剤層が熱接着性を有する場合には、被着体に押圧する際に、接着剤層を加熱して貼付することができる。本発明における熱接着性とは、常温では感圧接着性がないが、熱により軟化して被着体に接着可能となることをいう。したがって、本発明の半導体接合用接着シートにおける接着剤層は、未硬化状態では各種被着体を一時的に保持する機能を有する。そのため、半導体接合用接着シートにより被着体を保持した状態で被着体のシートの貼付されていない面(裏面)の加工、たとえば研削加工を行うことができる。そして、熱硬化を経て最終的には耐衝撃性の高い硬化物を与えることができ、接着強度にも優れ、厳しい高温度高湿度条件下においても十分な接着性を保持しうる。フィルム状接着剤を構成する接着剤組成物は、上記の各成分を適宜の割合で混合して得られる。混合に際しては、各成分を予め溶媒で希釈しておいてもよく、また混合時に溶媒に加えてもよい。
これらの中でも、樹脂フィルムとしては、23℃における貯蔵弾性率が、好ましくは1×107Pa以上、より好ましくは1×108〜1×109Paである樹脂フィルムを用いることが好ましい。また、引張試験に基づく23℃における応力緩和率が、好ましくは40%以上、より好ましくは70〜90%である樹脂フィルムを用いることが好ましい。貯蔵弾性率や応力緩和率が上記範囲の樹脂フィルムを用いることで、ウエハの裏面研削工程において、ウエハの反りやディンプルの発生を抑制できる。
ここで、引張試験に基づく23℃における応力緩和率は、以下の方法により測定される。樹脂フィルムを15mm×140mmにカットしてサンプルを形成する。23℃、相対湿度50%の環境下で、万能引張試験機(SHIMADZU社製オートグラフAG−10kNIS)を用いて、このサンプルの両端20mmを掴み、毎分200mmの速度で引っ張り、10%伸張したときの応力A(N/m2)と、テープの伸張停止から1分後の応力B(N/m2)とを測定する。これらの応力A、Bの値から、(A−B)/A×100(%)を応力緩和率として算出する。
このようなフィルムの特性は、ウレタンポリマーとビニル系ポリマーとからなる複合フィルムや、ウレタンアクリレート硬化物フィルムで得られやすい。ウレタンポリマーとビニル系ポリマーとからなる複合フィルムとしては、たとえば特開2007−84722に開示されているものを用いることができる。ウレタンアクリレート硬化物フィルムとしては、たとえば特開平11−343469に開示されているものを用いることができる。
粘着シートの粘着力は、好ましくは10〜10000mN/25mm、より好ましくは50〜2000mN/25mmである。粘着力は、JIS Z 0237;2009に準拠して、被着体(SUS)に貼付して30分経過後における粘着シートの180°引き剥がし法による粘着力である。粘着シートの粘着力を上記範囲とすることで、粘着剤層から接着剤層を剥離することが容易になる。
また、粘着剤層の23℃における貯蔵弾性率は、好ましくは1×104Pa以上、より好ましくは1×105〜1×108Paである。貯蔵弾性率が上記範囲の粘着剤層を用いることで、ウエハの裏面研削工程において、ウエハの反りやディンプルの発生を抑制できる。
また、樹脂フィルムの上面、すなわち粘着剤層が設けられる側の樹脂フィルム表面には粘着剤層との密着性を向上させるために、コロナ処理を施したり、プライマー層を設けてもよい。また、粘着剤層とは反対面に各種の塗膜を塗工してもよい。
ウレタンポリマーとビニル系ポリマーとからなる複合フィルムまたはウレタンアクリレート硬化物フィルムとしては、上述したものを用いることができるほか、ウレタンアクリレート硬化物フィルムとして、特開2011−068727に開示されている、ウレタンアクリレート系オリゴマーと、分子内にチオール基を有する化合物とを含有するエネルギー線硬化型組成物を硬化してなるシートを樹脂フィルムに積層させて凹凸吸収層としてもよい。
凹凸吸収層の23℃における貯蔵弾性率は、好ましくは1×104Pa以上、より好ましくは3×105〜3×106Paである。また、凹凸吸収層の20%捻り応力付加の10秒後における応力緩和率は、好ましくは50%以上、より好ましくは80〜99.9%である。貯蔵弾性率や応力緩和率が上記範囲の凹凸吸収層を用いることで、ウエハの半導体接合用接着シートが貼付される面に数十μm程度の高さを有する突起が形成されていても、突起を凹凸吸収層が吸収し、半導体接合用接着シートの表面を平坦に保つことができる。また、このような突起の高さよりも接着剤層の厚さが薄い場合であっても、凹凸吸収層が、接着剤層を貫通した突起を吸収することで接着剤層がウエハ表面に接近・到達し、接着剤層をウエハ表面に接着させることができる。
本発明に係る半導体装置の製造方法は、上記半導体接合用接着シートの接着剤層をウエハに貼付する工程、ウエハを個片化しチップを得る工程、及び接着剤層を介してチップを固定する工程を含む。
本発明に係る半導体装置の第1の製造方法においては、まず、表面に回路が形成された半導体ウエハの回路面に半導体接合用接着シートを貼付する。貼付する際には、半導体ウエハの回路面を半導体接合用接着シートの接着剤層上に載置し、軽く押圧し、場合によって熱を加えて接着剤層を軟化させながら半導体ウエハを固定してもよい。次いで必要に応じ、半導体接合用接着シートにより半導体ウエハの回路面が保護された状態で、ウエハの裏面を研削し、所定厚みのウエハとする。
また、フィルム状接着剤または半導体接合用接着シートをウエハに貼付する前の段階でウエハの裏面研削が終了しており、フィルム状接着剤または半導体接合用接着シートの貼付後はウエハの裏面研削を行わない製造方法であってもよい。
また、ウエハの個片化方法は、ウエハの表面側からウエハの厚さよりも小さい深さの溝を形成し、ウエハの裏面を溝に達するまで研削することにより個片化を行う、いわゆる先ダイシング法によるものであってもよいし、特開2004−111428に記載されているような、ウエハの表面からレーザー光をチップの形状に合わせて入射させ、ウエハ内部に改質領域を形成する工程に、ウエハの裏面を研削する工程を付加したウエハの分割方法であってもよい。
接着剤組成物(1)〜(5)を用い、各接着剤組成物を剥離フィルム(リンテック社製SP−PET381031)に塗布した後に、乾燥(オーブンにて100℃、1分間)させ、厚み20μmのフィルム状接着剤を作製した。また、別に厚み20μmのフィルム状接着剤を作製し、フィルム状接着剤を積層することで、厚み40μm、60μm、80μm、100μmのフィルム状接着剤を得た。次いで、剥離フィルムを剥離し、評価用サンプルとした。ヘイズメーター(日本電色工業社製 NDH−5000)を用いて、JIS K7136:2000に準拠して、評価用サンプルにおけるフィルム状接着剤のヘイズ値(%)を測定した。また、JIS K7361:2000に準拠して、評価用サンプルにおけるフィルム状接着剤のD65標準光源における全光線透過率(%)を測定した。
接着剤組成物(1)〜(5)を用い作製したフィルム状接着剤(50mm角)を、200μmの厚さに積層し、積層シートを得、評価用サンプルとした。評価用サンプルを140℃のオーブンで1時間加熱硬化後、湿熱条件(85℃、相対湿度85%)に所定時間(24時間及び168時間)投入し、投入前後での硬化物の重量変化(%)を測定し、24時間後および168時間後の吸湿率を得た。
ウォルツ社製8インチウエハ「WALTS-TEG MB50-0101JY_TYPE-B(ポリイミド膜有り)、厚み725μm」を準備した。このウエハ上に形成された各個片化予定領域上には、544個のパッドが存在する。それらの各パッドに対して、30μmの高さのCuピラーを作製し、更にそれらのCuピラー上にSnAgはんだを15μmの高さで設け、合計高さ45μmのバンプとした。以上の手順により、フリップチップ型ウエハを模した評価用ウエハを用意した。
次いで、ウエハバックグラインド装置(株式会社ディスコ製DGP8760)を用いて研磨及びドライポリッシュ処理を行い、300μm厚のウエハを得た。その後、フルオートマルチウエハマウンタ(リンテック株式会社製RAD-2700F/12)を用いて、ドライポリッシュ面に紫外線(UV)硬化型ダイシングテープ(リンテック株式会社製 Adwill D-678)を貼付しリングフレームに固定した。
続いて、同装置により半導体接合用接着シートの支持シートを剥離し、接着剤層を暴露させた。その後、フルオートダイシングソー(株式会社ディスコ製DFD651)を用いてダイシングを行い、各チップを個片化した(7.3mm×7.3mm)。
整列したチップが付着したダイシングテープに対して、セミオートUV照射装置(リンテック株式会社製RAD-2000m/12)を用いてUV照射を行い(照度230mW/cm2、光量180mJ/cm2、窒素雰囲気下)、ダイシングテープの粘着力を低下させた。次いで、手作業により接着剤層の付着したチップをダイシングテープより剥離し、固着防止のためにチップ収納部底面に剥離フィルム(リンテック株式会社製 SP-PET381031)を貼付したチップトレイに接着剤層側が下を向くようにして収納した。
フリップチップボンダー(九州松下株式会社製、商品名「FB30T-M」)を用い、個片化された接着剤層付きチップをチップトレイから取り出し、そのバンプ設置面(接着剤層が貼付されている面)のパターン認識可否を評価した。チップ10個の試験を行い、10個ともパターン認識可能であったものを「A」、6〜9個であったものを「B」と、5個以下であったものを「C」とした。
フィルム状接着剤を構成する接着剤組成物(1)〜(5)の各成分は、下記及び表1の通りである。下記の成分及び表1の配合量に従い、各成分を配合して接着剤組成物(1)〜(5)を調整した。表1中、各成分の数値は固形分換算の質量部を示し、本発明において固形分とは溶媒以外の全成分をいう。
(B1)エポキシ樹脂:ビスフェノールA型エポキシ樹脂(ジャパンエポキシレジン社製 jER828、エポキシ当量:235g/eq)
(B2)エポキシ樹脂:ノボラック型エポキシ樹脂(日本化薬社製 EOCN−104S、エポキシ当量:218g/eq)
(C)熱硬化剤:ノボラック型フェノール樹脂(DIC社製 TD−2131、フェノール性水酸基当量:103g/eq)
(D1)フィラー:シリカフィラー(日産化学社製 MEK−ST、平均粒子径:10〜15nm)
(D2)フィラー:シリカフィラー(アドマテックス製 YA050C−MJE、平均粒子径:50nm)
(D3)フィラー:シリカフィラー(アドマテックス製 アドマファインSC2050、平均粒子径:500nm)
(D4)フィラー:カーボンブラック(三菱化学社製 #MA650、平均粒子径:28nm)
(E)硬化促進剤:2−フェニル−4,5−ジヒドロキシメチルイミダゾール(四国化成工業社製 キュアゾール2PHZ−PW)
(F)カップリング剤:シランカップリング剤(信越化学社製 KBE−403)
重量平均分子量5000のウレタンアクリレート系オリゴマー(荒川化学社製)50質量部と、イソボルニルアクリレート50質量部と、光重合開始剤(イルガキュア184、チバ・ガイギー社製)2.0質量部と、フタロシアニン系顔料0.2質量部とを配合して光硬化型樹脂組成物を得た。得られた樹脂組成物を、ファウンテンダイ方式により、キャスト用工程シートである剥離処理したPETフィルム(リンテック株式会社製、SP−PET381031)の上に厚みが110μmとなるように塗工して樹脂組成物層を形成した。塗工直後に、樹脂組成物層の上にさらに同じ剥離処理したPETフィルムをラミネートし、その後、高圧水銀ランプ(160W/cm、高さ10cm)を用いて、光量250mJ/cm2 の条件で紫外線照射を行うことにより樹脂組成物層を架橋・硬化させて、2枚の剥離フィルムに挟持された厚さ110μmの樹脂フィルムを得た。
その後、フィルム状接着剤と上記の粘着シートから他の剥離フィルムを除去して露出させた粘着シートの粘着剤層とを貼り合わせて、フィルム状接着剤を粘着シート上に転写することで、所望の半導体接合用接着シートを得た。各評価結果を表3に示す。
重量平均分子量4000のポリプロピレングリコール(以下PPG4000と記述)33gとイソホロンジイソシアネート5gを重合させて得られる末端イソシアナートウレタンプレポリマーに、ペンタエリスリトールトリアクリレート10gを反応させ、重量平均分子量が17350のウレタンアクリレート系オリゴマーを得た。
この積層体の凹凸吸収層に実施例1の粘着剤層を転写し、23℃、相対湿度50%の環境下に14日間保管することで養生を行い、凹凸吸収層付き粘着シート(支持シート2)を得た。
次いで、厚みが20μmのフィルム状接着剤を積層し、フィルム状接着剤の厚みが100μmとなるようにした以外は実施例1と同じ手順で形成したフィルム状接着剤を得、凹凸吸収層付き粘着シートの粘着剤層に転写することで半導体接合用接着シートを得た。各評価結果を表3に示す。
接着剤組成物(2)を用いたこと以外は、実施例1と同様にして半導体接合用接着シートを得た。各評価結果を表3に示す。
接着剤組成物(2)を用いたこと以外は、実施例2と同様にして半導体接合用接着シートを得た。各評価結果を表3に示す。
支持シートとして、厚み100μmの低密度ポリエチレンフィルム(支持シート3)を用いたこと以外は、実施例1と同様にして半導体接合用接着シートを得た。各評価結果を表3に示す。
接着剤組成物(3)を用いたこと以外は、実施例1と同様にして半導体接合用接着シートを得た。各評価結果を表3に示す。
接着剤組成物(4)を用いたこと以外は、実施例1と同様にして半導体接合用接着シートを得た。各評価結果を表3に示す。
Claims (6)
- バインダー樹脂(A)、エポキシ樹脂(B)、熱硬化剤(C)及びフィラー(D)を含むフィルム状接着剤であって、
エポキシ樹脂(B)の含有量が、バインダー樹脂(A)100質量部に対して、100〜1000質量部であり、
フィラー(D)の平均粒子径が50nm以下であり、
D65標準光源における全光線透過率が70%以上であり、
ヘイズ値が50%以下であるフィルム状接着剤。 - フィラー(D)を5質量%以上含む請求項1に記載のフィルム状接着剤。
- バインダー樹脂(A)が、エポキシ基含有モノマーに由来する構成単位を5〜30質量%含有するアクリル重合体である請求項1または2に記載のフィルム状接着剤。
- 支持シート上に請求項1〜3のいずれかに記載のフィルム状接着剤が接着剤層として剥離可能に形成された半導体接合用接着シート。
- 支持シートがウレタンポリマーとビニル系ポリマーとからなる複合フィルムまたはウレタンアクリレート硬化物フィルムを構成層として含む請求項4に記載の半導体接合用接着シート。
- 請求項1〜3のいずれかに記載のフィルム状接着剤または請求項4もしくは5に記載の半導体接合用接着シートを用いる半導体装置の製造方法であって、
ウエハにフィルム状接着剤または半導体接合用接着シートの接着剤層を貼付する工程、ウエハを個片化しチップを得る工程、及びフィルム状接着剤または接着剤層を介してチップを固定する工程を含む半導体装置の製造方法。
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JP5978246B2 (ja) * | 2014-05-13 | 2016-08-24 | 日東電工株式会社 | ダイシングテープ一体型半導体裏面用フィルム、及び、半導体装置の製造方法 |
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KR20150037829A (ko) | 2015-04-08 |
CN104508069A (zh) | 2015-04-08 |
KR102169223B1 (ko) | 2020-10-23 |
US9296925B2 (en) | 2016-03-29 |
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