JP2013194103A - 接着剤組成物、接着シートおよび半導体装置の製造方法 - Google Patents
接着剤組成物、接着シートおよび半導体装置の製造方法 Download PDFInfo
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- JP2013194103A JP2013194103A JP2012061102A JP2012061102A JP2013194103A JP 2013194103 A JP2013194103 A JP 2013194103A JP 2012061102 A JP2012061102 A JP 2012061102A JP 2012061102 A JP2012061102 A JP 2012061102A JP 2013194103 A JP2013194103 A JP 2013194103A
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- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10697—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer being cross-linked
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10733—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing epoxy
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10743—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing acrylate (co)polymers or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
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Abstract
【解決手段】 本発明に係る接着剤組成物は、アクリル重合体(A)、不飽和炭化水素基を有する熱硬化性樹脂(B)および反応性二重結合を表面に有するフィラー(C)を含むことを特徴としている。
【選択図】なし
Description
(1)アクリル重合体(A)、不飽和炭化水素基を有する熱硬化性樹脂(B)および反応性二重結合を表面に有するフィラー(C)を含む接着剤組成物。
本発明に係る接着剤組成物は、アクリル重合体(A)(以下「(A)成分」とも言う。他の成分についても同様である。)、熱硬化性樹脂(B)、フィラー(C)を必須成分として含み、各種物性を改良するため、必要に応じ他の成分を含んでいても良い。以下、これら各成分について具体的に説明する。
アクリル重合体(A)としては従来公知のアクリル重合体を用いることができる。アクリル重合体(A)の重量平均分子量(Mw)は、1万〜200万であることが好ましく、10万〜150万であることがより好ましい。アクリル重合体(A)の重量平均分子量が低過ぎると、接着剤層と支持体との接着力が高くなってチップのピックアップ不良が起こることがある。アクリル重合体(A)の重量平均分子量が高すぎると、被着体の凹凸へ接着剤層が追従できないことがあり、ボイドなどの発生要因になることがある。アクリル重合体(A)の重量平均分子量は、ゲル・パーミエーション・クロマトグラフィー(GPC)法により測定されるポリスチレン換算値である。
熱硬化性樹脂(B)は、エポキシ樹脂および熱硬化剤からなり、本発明では、エポキシ樹脂および熱硬化剤の何れか一方または両方が不飽和炭化水素基を有する。エポキシ樹脂としては、不飽和炭化水素基を有するエポキシ樹脂(B1)および不飽和炭化水素基を有しないエポキシ樹脂(B1’)があり、熱硬化剤としては、不飽和炭化水素基を有する熱硬化剤(B2)および不飽和炭化水素基を有しない熱硬化剤(B2’)がある。本発明の熱硬化性樹脂(B)には、不飽和炭化水素基を有するエポキシ樹脂(B1)および不飽和炭化水素基を有する熱硬化剤(B2)の何れか一方を必須成分として含む。また、エポキシ樹脂(B1)およびエポキシ樹脂(B1’)の何れか一方を必須成分として含み、熱硬化剤(B2)および熱硬化剤(B2’)の何れか一方を必須成分として含む。ただし、エポキシ樹脂および熱硬化剤の両方が不飽和炭化水素基を有しない場合、すなわち成分(B1’)と成分(B2’)のみの組み合わせは除外される。
反応性二重結合基を表面に有するフィラー(C)は、反応性二重結合基を表面に有していれば特に限定されない。反応性二重結合基は、反応性を有するビニル基、アリル基または(メタ)アクリル基であることが好ましい。
接着剤組成物は、上記成分に加えて下記成分を含むことができる。
(D)光重合開始剤
接着剤組成物は、光重合開始剤を含有することが好ましい。光重合開始剤を含有することで、たとえば本発明の接着シートを、ダイシング・ダイボンディングシートとして用いた場合に、ウエハに貼付後、ダイシング工程前に紫外線を照射することで反応性二重結合基を表面に有するフィラーおよび熱硬化性樹脂の有する不飽和炭化水素基を反応せしめ、予備硬化させることができる。予備硬化を行うことにより、硬化前には接着剤層が比較的軟化しているのでウエハへの密着性がよく、かつダイシング時には適度な硬度を有しダイシングブレードへの接着剤の付着その他の不具合を防止することができる。また、支持体(樹脂フィルムまたはダイシングテープ)と、接着剤層の界面の密着性のコントロール等も可能となる。さらに、予備硬化状態では未硬化状態よりも硬度が高くなるため、ワイヤボンディング時の安定性が向上する。
硬化促進剤(E)は、接着剤組成物の硬化速度を調整するために用いられる。好ましい硬化促進剤としては、トリエチレンジアミン、ベンジルジメチルアミン、トリエタノールアミン、ジメチルアミノエタノール、トリス(ジメチルアミノメチル)フェノールなどの3級アミン類;2−メチルイミダゾール、2−フェニルイミダゾール、2−フェニル−4−メチルイミダゾール、2−フェニル−4,5−ジヒドロキシメチルイミダゾール、2−フェニル−4−メチル−5−ヒドロキシメチルイミダゾールなどのイミダゾール類;トリブチルホスフィン、ジフェニルホスフィン、トリフェニルホスフィンなどの有機ホスフィン類;テトラフェニルホスホニウムテトラフェニルボレート、トリフェニルホスフィンテトラフェニルボレートなどのテトラフェニルボロン塩などが挙げられる。これらは1種単独で、または2種以上混合して使用することができる。
カップリング剤(F)は、接着剤層の被着体に対する接着性、密着性を向上させるために用いてもよい。また、カップリング剤(F)を使用することで、接着剤層を硬化して得られる硬化物の耐熱性を損なうことなく、その耐水性を向上することができる。
接着剤組成物には、接着剤層の初期接着力および凝集力を調節するために、架橋剤(G)を添加することもできる。なお、架橋剤を配合する場合には、前記アクリル重合体(A)には、架橋剤と反応する官能基が含まれる。架橋剤(G)としては有機多価イソシアネート化合物、有機多価イミン化合物などが挙げられる。
接着剤組成物には、エネルギー線重合性化合物が配合されていてもよい。エネルギー線重合性化合物(H)は、エネルギー線重合性基を含み、紫外線、電子線等のエネルギー線の照射を受けると重合硬化する。このようなエネルギー線重合性化合物(H)として具体的には、トリメチロールプロパントリアクリレート、ペンタエリスリトールトリアクリレート、ペンタエリスリトールテトラアクリレート、ジペンタエリスリトールモノヒドロキシペンタアクリレート、ジペンタエリスリトールヘキサアクリレートあるいは1,4−ブチレングリコールジアクリレート、1,6−ヘキサンジオールジアクリレート、ポリエチレングリコールジアクリレート、オリゴエステルアクリレート、ウレタンアクリレート系オリゴマー、エポキシ変性アクリレート、ポリエーテルアクリレートおよびイタコン酸オリゴマーなどのアクリレート系化合物が挙げられる。このような化合物は、分子内に少なくとも1つの重合性二重結合を有し、通常は、重量平均分子量が100〜30000、好ましくは300〜10000程度である。エネルギー線重合性化合物(H)を用いる場合、その配合量は、特に限定はされないが、接着剤組成物の固形分全量100質量部に対して、1〜50質量部程度の割合で用いることが好ましい。
接着剤組成物には、熱可塑性樹脂(I)を用いてもよい。熱可塑性樹脂(I)は、硬化後の接着剤層の可とう性を保持するために配合される。熱可塑性樹脂(I)としては、重量平均分子量が1000〜10万のものが好ましく、3000〜8万のものがさらに好ましい。熱可塑性樹脂(I)を含有することにより、半導体チップのピックアップ工程における支持体と接着剤層との層間剥離を容易に行うことができ、さらに基板の凹凸へ接着剤層が追従しボイドなどの発生を抑えることができる。
また、接着剤組成物には、前記フィラー(C)以外にも、反応性二重結合を有しないフィラーとして、無機充填材(J)を配合してもよい。無機充填材としては、シリカ、タルク、炭酸カルシウム、チタンホワイト、ベンガラ、炭化珪素、窒化ホウ素等の粉末、これらを球形化したビーズ、単結晶繊維およびガラス繊維等が挙げられる。
接着剤組成物には、上記の他に、必要に応じて各種添加剤が配合されてもよい。各種添加剤としては、可塑剤、帯電防止剤、酸化防止剤、顔料、染料、ゲッタリング剤などが挙げられる。
上記のような各成分からなる接着剤組成物からなる接着剤層は、感圧接着性と加熱硬化性とを有し、未硬化状態では各種被着体に軽く押圧して貼付することができる。また、接着剤層には、フィラーが均一に分散しているため、半導体チップを接合し、ワイヤボンディングを行う高温でも接着剤層の変形が少なく、ワイヤボンディングを安定して行える。そして熱硬化を経て最終的には耐衝撃性の高い硬化物を与えることができ、せん断強度にも優れ、厳しい高温度高湿度条件下においても十分な接着特性を保持し得る。光重合開始剤(D)が含まれる場合には、エネルギー線硬化性をも有し、本硬化の前にエネルギー線照射により予備硬化することができる。予備硬化により接着剤層の硬度が増し、ワイヤボンディング時の安定性が向上する。
本発明に係る半導体装置の製造方法は、上記接着シートの接着剤層に半導体ウエハを貼着し、該半導体ウエハ及び接着剤層をダイシングして半導体チップとし、該半導体チップ裏面に接着剤層を固着残存させて支持体から剥離し、該半導体チップを有機基板やリードフレームのダイパッド部上、または別の半導体チップ上に接着剤層を介して接着する工程を含む。
本発明に係る半導体装置の製造方法においては、まず、表面に回路が形成され、裏面が研削された半導体ウエハを準備する。
実施例および比較例で調製した接着剤組成物を、剥離フィルム上に20μmの厚みになるように塗工し、スジ発生の有無を目視にて確認した。フィラーの分散性が悪く、凝集している場合にはスジが発生する。
前記実施例及び比較例に於いて作製した接着剤層について貯蔵弾性率を以下の通り測定した。
測定装置は、動的粘弾性測定装置(DMAQ800 TAインスツルメンツ社製)を用いて測定される。接着剤層は厚み800μmまで積層したものを縦10mm×横10mmに切断し用いた。測定条件は、引張モードで、一定の周波数(11Hz)で、温度を5℃/分で昇温させ、40〜300℃での測定を行い、その175℃での貯蔵弾性率を決定した。
(半導体チップの製造)
ドライポリッシュ仕上げシリコンウエハ(150mm径, 厚さ75μm)の研磨面に、実施例および比較例の接着シートの貼付をテープマウンター(リンテック社製, Adwill RAD2500)により行い、ウエハダイシング用リングフレームに固定した。その後、紫外線照射装置(リンテック社製, Adwill RAD2000)を用いて支持体面から紫外線を照射(220mW/cm2, 160mJ/cm2)した。次いで、ダイシング装置(株式会社ディスコ製, DFD651)を使用して8mm×8mmのチップサイズにダイシングした。ダイシングの際の切り込み量は、支持体を20μm切り込むようにした。
基板として銅箔張り積層板(三菱ガス化学株式会社製CCL-HL830)の銅箔(18μm厚)に回路パターンが形成され、パターン上にソルダーレジスト(太陽インキ製PSR-4000 AUS303)を有している基板を用いた(株式会社ちの技研製LN001E−001 PCB(Au)AUS303)。上記で得た接着シート上のチップを接着剤層とともに支持体から取り上げ、基板上に、接着剤層を介して120℃, 250gf, 0.5秒間の条件で圧着した。
得られた半導体パッケージを85℃,湿度60%RH条件下に168時間放置し、吸湿させた後、プレヒート160℃(通常条件)及びプレヒート130℃(過酷条件)で最高温度が260℃になる加熱時間1分間のIRリフロー(リフロー炉:相模理工製WL-15-20DNX型)を3回行なった際に接合部の浮き・剥がれの有無、パッケージクラック発生の有無を走査型超音波探傷装置(日立建機ファインテック株式会社製Hye-Focus)および断面研磨機(リファインテック株式会社製 リファイン・ポリッシャーHV)により断面を削り出し、(株式会社キーエンス製 VHX−100)を用いて断面観察により評価した。基板/半導体チップ接合部に長さ0.5mm以上の剥離を観察した場合を剥離していると判断して、パッケージを27個試験に投入し剥離が発生しなかった個数を数えた。
接着剤組成物を構成する各成分を下記に示す。
(A)アクリル重合体:日本合成化学工業社製 N−4617(水酸基含有)
(B)熱硬化性樹脂:
(B−1)アクリロイル基付加クレゾールノボラック型エポキシ樹脂(日本化薬株式会社製CNA−147)
(B−2)熱硬化剤:アラルキルフェノール樹脂(三井化学株式会社製ミレックスXLC−4L)
(C)フィラー:
(C−1)ビニル基修飾のシリカフィラー(平均粒径0.5μm、SO-C2, アドマテックス社製 ビニルトリメトキシシラン処理品)
(C−2)メタクリル基修飾のフィラー(平均粒径0.5μm、SO-C2, アドマテックス社製 3−メタクリロキシプロピルトリメトキシシラン処理品)
(C−3)エポキシ基修飾のフィラー(平均粒径0.5μm、SO-C2, アドマテックス社製 3−グリシドキシプロピルトリメトキシラン処理品)
(C−4)無修飾フィラー(平均粒径0.5μm、SO-C2、アドマテックス社製)
(D)光重合開始剤(チバ・スペシャルティ・ケミカルズ株式会社製イルガキュア184)
(E)硬化促進剤:イミダゾール(四国化成工業株式会社製キュアゾール2PHZ)
(F)シランカップリング剤(三菱化学株式会社製MKCシリケートMSEP2)
(G)架橋剤:芳香族性多価イソシアナート(日本ポリウレタン工業株式会社製コロネートL)
(接着剤層)
上記各成分を表1に記載の量(質量比)で配合し、接着剤組成物を得た。得られた組成物のメチルエチルケトン溶液(固形濃度30質量%)を用い、分散性を評価した。結果を表1に示す。また、接着剤組成物溶液を、シリコーンで剥離処理された剥離フィルム(リンテック株式会社製、SP−PET381031)の剥離処理面上に乾燥後20μmの厚みになるように塗布、乾燥(乾燥条件:オーブンにて100℃、1分間)した後に支持体(ポリエチレンフィルム、厚さ100μm、表面張力33mN/m)と貼り合せて、接着剤層を支持体上に転写することで接着シートを得た。得られた接着シートを用いて半導体パッケージを作成し、その信頼性を評価した。また、接着剤層の貯蔵弾性率を評価した。結果を表1に示す。表1中PKG信頼性はパッケージ信頼性を意味し、上述の評価において剥離が発生しなかった個数/27(試験に投入したパッケージの個数)であらわした。接着剤層の貯蔵弾性率は全て0.3MPa以上であった。
Claims (7)
- アクリル重合体(A)、不飽和炭化水素基を有する熱硬化性樹脂(B)および反応性二重結合を表面に有するフィラー(C)を含む接着剤組成物。
- 前記フィラー(C)が、反応性二重結合を表面に有するシリカである請求項1に記載の接着剤組成物。
- 請求項1または2に記載の接着剤組成物からなる単層接着フィルム。
- 請求項1または2に記載の接着剤組成物からなる接着剤層が、支持体上に形成されてなる接着シート。
- 支持体が、樹脂フィルムである請求項4に記載の接着シート。
- 支持体が、ダイシングシートである請求項4に記載の接着シート。
- 請求項4〜6の何れかに記載の接着シートの接着剤層に半導体ウエハを貼付し、前記半導体ウエハ及び接着剤層をダイシングして半導体チップとし、前記半導体チップに接着剤層を固着残存させて支持体から剥離し、前記半導体チップをダイパッド部上または他の半導体チップ上に前記接着剤層を介して接着する工程を含む半導体装置の製造方法。
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