CN107305898A - 提高图像传感器芯片悬空打线稳定性的方法 - Google Patents
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Abstract
本发明提供一种提高图像传感器芯片悬空打线稳定性的方法,于硅片研磨工艺后,在硅片切割前或切割后于图像传感器芯片背面覆盖防滑膜,所述防滑膜提高拾取芯片过程中芯片与吸嘴之间的摩擦力,增加拾取芯片的稳定性;同时,所述防滑膜减少拾取芯片过程中吸嘴对芯片的冲击力,降低芯片损伤的可能性;所述防滑膜还可提高芯片底面和打线平台表面的摩擦力,防止图像传感器打线工艺中图像传感器发生滑动。
Description
技术领域
本发明涉及电子领域,尤其涉及一种提高图像传感器芯片悬空打线稳定性的方法。
背景技术
图像传感器芯片是将光转换为电信号的电子器件,按照感光原理的不同分为CCD(Charge Coupled Device)和CMOS(Complementary
Metal-Oxide-Semiconductor Transistor)两种,图像传感器芯片在封装时需通过各种方式将焊盘电学连接封装至外部。目前,主流的CIS(CMOS Image Sensor)芯片封装技术包括:COB (Chips On Board)、CSP(Chip Scale Packaging)。
在CSP的晶圆级(Wafer Level)封装的过程中,往往首先将包含有若干CIS芯片的晶圆本体键合于玻璃材质的封装基板上,在封装基板上预先制作对应环绕于每一CIS芯片的支撑侧墙。然后进行对晶圆背面线路工艺的处理例如:TSV(Through Silicon Via)或T-Contact,在完成相关的工艺后针对晶圆进行切割,形成单个CIS芯片的封装结构。封装基板的作用在于:可形成一密闭的空间,无论是在封装的过程中还是封装完毕后的模组制造中防止尘埃、水汽以及外部的直接接触等因素污染CIS芯片的感光面,并且封装基板在封装加工中会提供一定的支撑以加强加工强度。但是,CSP封装芯片存在如下问题:1、表面的封装基板会带来入光线损失并带来反射光的眩扰(flare);2、由于CSP封装的结构是由上表面(玻璃)和下表面(硅片)及四周侧墙所形成的的密封结构,当芯片尺寸较大时,在模组制作的热过程中,封装基板和硅片之间的气压变化容易造成硅片的应力过大,带来芯片的失效的问题。
由于CSP封装的上述问题,目前CSP封装主要被用于中低端、低像素CMOS图像传感器产品。而高像素或超高像素CIS芯片的封装采用的是COB技术,以满足性能和可靠性方面的要求。但是另一方面,COB封装也存在量产规模化投资巨大,设计、生产周期长、不灵活等劣势。
此外,中国发明专利申请:CN 201510641103.0,公开一种《摄像头模组的装配方法》,揭露了一种新型CIS(CMOS Image Sensor)封装方法,该封装方法包括:提供具有悬空金属导线的图像传感器芯片,所述金属导线的第一端键合于所述图像传感器芯片的焊盘,第二端悬空于所述图像传感器芯片;将所述图像传感器芯片与镜头模块装配形成标准件,然后通过所述金属导线的第二端将所述标准件与电路板装配形成摄像头模组。采用此种封装方法具有模组高度低,封装可靠性佳,光学性能优良,模组倾斜度误差较小,成本较COB、CSP小等诸多优势。这种封装方法的核心之一在于制作一端与图像传感器芯片的焊盘键合,另一端悬空的金属导线。在这种方法的金属导线打线过程中,会将图像传感器芯片置于打线平台上,但打线过程中由于打线装置的作用力往往会发生图像传感器芯片在沿水平方向有所滑动,图像传感器芯片发生位移,导致在打线过程中发生金属导线无法对准于图像传感器芯片的位置,影响打线的质量。
此外在芯片拾取的过程中,一般采用吸嘴吸附图像传感器芯片背面的方式,现有技术中图像传感器芯片的背面未采用处理,可能会出现吸附不牢固,图像传感器芯片容易脱落的问题。
发明内容
本发明实施例解决的问题是如何提高图像传感器芯片打线过程中稳定性的问题。
为解决该问题,本发明提供一种提高图像传感器芯片悬空打线稳定性的方法, 于硅片研磨工艺后,在硅片切割前或切割后于图像传感器芯片背面覆盖防滑膜,所述防滑膜提高拾取芯片过程中芯片与吸嘴之间的摩擦力,增加拾取芯片的稳定性;同时,所述防滑膜减少拾取芯片过程中吸嘴对芯片的冲击力,降低芯片损伤的可能性;所述防滑膜还可提高芯片底面和打线平台表面的摩擦力,防止图像传感器打线工艺中图像传感器发生滑动。
优选的,所述防滑层为:环氧树脂、焊接掩膜。
优选的,提供机械压板,所述机械压板压靠于芯片正面,于芯片正面提供压力,增加芯片与打线平台的摩擦力。
优选的,提供吹气装置,所述吹气装置设置于芯片上部,输出空气给芯片正面提供压力,增加芯片与打线平台的摩擦力。
优选的,所述吹气装置不接触芯片表面,减少感光区域被污染的可能性。
本发明在图像传感器芯片的背面形成防滑膜,该防滑膜能提高拾取芯片过程中芯片与吸嘴之间的摩擦力,增加拾取芯片的稳定性;同时,所述防滑膜减少拾取芯片过程中吸嘴对芯片的冲击力,降低芯片损伤的可能性;所述防滑膜还可提高芯片底面和打线平台表面的摩擦力,防止图像传感器打线工艺中图像传感器发生滑动。
附图说明
图1为现有技术中图像传感器打线过程中第一状态示意图;
图2为现有技术中图像传感器打线过程中第二状态示意图;
图3为本发明一实施例中涉及的图像传感器打线过程中的第一状态示意图;
图4为本发明一实施例中涉及的图像传感器打线过程中的第二状态示意图;
图5为本发明一实施例中涉及的图像传感器拾取过程中的示意图。
具体实施方式
为了提高图像传感器芯片打线的稳定性,本发明提供一种提高图像传感器芯片悬空打线稳定性的方法,包括:于硅片研磨工艺后,在硅片切割前或切割后于芯片背面覆盖防滑膜,所述防滑膜提高拾取芯片过程中芯片与吸嘴之间的摩擦力,增加拾取芯片的稳定性;同时,所述防滑膜减少拾取芯片过程中吸嘴对芯片的冲击力,降低芯片损伤的可能性;所述防滑膜还可提高芯片底面和打线平台表面的摩擦力,防止图像传感器打线工艺中图像传感器发生滑动。下面结合具体实施方式对本发明的发明内容进行说明。
请参照图1、图2,图1为现有技术中图像传感器打线过程中第一状态示意图;图2为现有技术中图像传感器打线过程中第二状态示意图;将图像传感器芯片20放置于打线平台10的表面,图像传感器包括位于中央区域的感光区域和位于感光区域外侧的焊盘区域,在焊盘区域上包括焊盘210,通过打线装置在图像传感器芯片的焊盘210上进行金属键合打线,将金属导线30悬空至图像传感器芯片的外侧,图2中图像传感器芯片实线20为现有技术中打线后的位置,虚线显示的图像传感器芯片20’为原有位置,可以发现发生了移动,这种移动会导致同一图像传感器芯片的后续焊盘的打线无法对准,导致焊盘未良好与金属导线进行电学连接,影响焊盘的信号传输。
图3为本发明一实施例中涉及的图像传感器打线过程中的第一状态示意图;
图4为本发明一实施例中涉及的图像传感器打线过程中的第二状态示意图;图3中于硅片研磨工艺后,在硅片(晶圆)切割前或切割后于图像传感器芯片背面覆盖防滑膜21,请同时参考图5,图5为本发明一实施例中涉及的图像传感器拾取过程中的示意图,芯片拾取装置40由图像传感器芯片20的背面进行拾取,由于防滑膜21的存在,提高了拾取图像传感器芯片过程中芯片与吸嘴之间的摩擦力,增加拾取芯片的稳定性;同时,防滑膜21减少拾取芯片过程中吸嘴41对芯片的冲击力,降低芯片损伤的可能性;请继续参考图4,图4中,由于防滑膜21的存在,打线装置的金属导线30键合于图像传感器芯片20的焊盘210时,提高芯片底面和打线平台表面的摩擦力,能防止图像传感器芯片打线工艺中图像传感器发生滑动。防滑层为:环氧树脂、焊接掩膜。在另一实施例中,提供机械压板,所述机械压板压靠于芯片正面,于芯片正面提供压力,增加芯片与打线平台的摩擦力。在又一实施例中,提供吹气装置,所述吹气装置设置于芯片上部,输出空气给芯片正面提供压力,增加芯片与打线平台的摩擦力,并且吹气装置不接触芯片表面,减少感光区域被污染的可能性。
本发明在图像传感器芯片的背面形成防滑膜,该防滑膜能提高拾取芯片过程中芯片与吸嘴之间的摩擦力,增加拾取芯片的稳定性;同时,所述防滑膜减少拾取芯片过程中吸嘴对芯片的冲击力,降低芯片损伤的可能性;所述防滑膜还可提高芯片底面和打线平台表面的摩擦力,防止图像传感器打线工艺中图像传感器发生滑动。
虽然本发明披露如上,但本发明并非限定于此。任何本领域技术人员,在不脱离本发明的精神和范围内,均可作各种更动与修改,因此本发明的保护范围应当以权利要求所限定的范围为准。
Claims (5)
1.一种提高图像传感器芯片悬空打线稳定性的方法,其特征在于:
于硅片研磨工艺后,在硅片切割前或切割后于图像传感器芯片背面覆盖防滑膜,所述防滑膜提高拾取芯片过程中芯片与吸嘴之间的摩擦力,增加拾取芯片的稳定性;同时,所述防滑膜减少拾取芯片过程中吸嘴对芯片的冲击力,降低芯片损伤的可能性;所述防滑膜还可提高芯片底面和打线平台表面的摩擦力,防止图像传感器打线工艺中图像传感器发生滑动。
2.根据权利要求1所述的提高图像传感器芯片悬空打线稳定性方法,其特征在于,所述防滑层为:环氧树脂、焊接掩膜。
3.根据权利要求1所述的提高图像传感器芯片悬空打线稳定性的方法,其特征在于:提供机械压板,所述机械压板压靠于芯片正面,于芯片正面提供压力,增加芯片与打线平台的摩擦力。
4.根据权利要求1所述的提高图像传感器芯片悬空打线稳定性方法,其特征在于:提供吹气装置,所述吹气装置设置于芯片上部,输出空气给芯片正面提供压力,增加芯片与打线平台的摩擦力。
5.根据权利要求4所述的提高图像传感器芯片悬空打线稳定性方法,其特征在于,所述吹气装置不接触芯片表面,减少感光区域被污染的可能性。
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