Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
  • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
  • H01L23/293—Organic, e.g. plastic
  • H01L23/295—Organic, e.g. plastic containing a filler
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
  • H01L21/52—Mounting semiconductor bodies in containers
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
  • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
  • C08J5/18—Manufacture of films or sheets
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K7/00—Use of ingredients characterised by shape
  • C08K7/02—Fibres or whiskers
  • C08K7/04—Fibres or whiskers inorganic
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L101/00—Compositions of unspecified macromolecular compounds
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
  • C09J11/02—Non-macromolecular additives
  • C09J11/04—Non-macromolecular additives inorganic
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J201/00—Adhesives based on unspecified macromolecular compounds
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J7/00—Adhesives in the form of films or foils
  • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K2201/00—Specific properties of additives
  • C08K2201/002—Physical properties
  • C08K2201/003—Additives being defined by their diameter
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K2201/00—Specific properties of additives
  • C08K2201/016—Additives defined by their aspect ratio
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2203/00—Applications
  • C08L2203/20—Applications use in electrical or conductive gadgets
  • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

• the present invention relates to a resin film forming sheet for chips, which can efficiently form a resin film having a high thermal diffusivity on any surface of a semiconductor chip and can manufacture a highly reliable semiconductor device.
• chip a semiconductor chip having electrodes such as bumps on a circuit surface
• the electrodes are bonded to a substrate.
• the surface (chip back surface) opposite to the circuit surface of the chip may be exposed.
• the exposed chip back surface may be protected by an organic film.
• a chip having a protective film made of an organic film is obtained by applying a liquid resin to the back surface of a wafer by spin coating, drying and curing, and cutting the protective film together with the wafer.
• the thickness accuracy of the protective film formed in this way is not sufficient, the product yield may be lowered.
• Patent Document 1 a protective film-forming sheet for a chip having a support sheet and a protective film-forming layer comprising a heat or energy ray-curable component and a binder polymer component formed on the support sheet is disclosed.
• a semiconductor wafer manufactured in a large diameter state may be cut and separated (diced) into element pieces (semiconductor chips) and then transferred to the next bonding process.
• the semiconductor wafer is subjected to dicing, cleaning, drying, expanding, and pick-up processes in a state of being adhered to the adhesive sheet in advance, and then transferred to the next bonding process.
• Patent Document 2 various dicing / die bonding adhesive sheets having both a wafer fixing function and a die bonding function have been proposed in order to simplify the pickup process and the bonding process (for example, Patent Document 2). reference).
• the adhesive sheet disclosed in Patent Document 2 enables so-called direct die bonding, and the application process of the die bonding adhesive can be omitted.
• the adhesive sheet it is possible to obtain a semiconductor chip having an adhesive layer attached to the back surface, and direct die bonding such as between an organic substrate and a chip, between a lead frame and a chip, and between a chip and a chip is possible. It becomes.
• Such an adhesive sheet achieves a wafer fixing function and a die bonding function by imparting fluidity to the adhesive layer, and heat or energy ray curing formed on the support sheet and the support sheet. It has an adhesive layer composed of an adhesive component and a binder polymer component.
• an adhesive layer is applied to the bump formation surface, that is, the surface of the chip, Die bonding will be performed.
• Patent Document 3 discloses a heat conductive adhesive film in which a magnetic field is applied to a film composition containing boron nitride powder and the boron nitride powder in the composition is oriented and solidified in a certain direction.
• the heat conductive adhesive film formed using the film composition described in Patent Document 3 has a process of applying a magnetic field in the manufacturing process as described above, and the manufacturing process is complicated. Further, when the resin film is formed using the boron nitride powder having an average particle diameter of 1 to 2 ⁇ m disclosed in the examples of Patent Document 3, the resin film forming layer composition is thickened due to the small particle diameter. There are things to do. When the resin film forming layer composition is thickened, the coating suitability of the resin film forming layer composition is lowered, and it may be difficult to form a smooth resin film.
• the present invention has been made in view of the above circumstances, and in the manufacturing process of a semiconductor device, the number of steps is increased, and the semiconductor wafer or chip is not subjected to special processing that makes the process complicated.
• the object is to impart heat dissipation characteristics to the obtained semiconductor device.
• the present inventors have set the heat diffusivity of the resin film formed on any surface of the semiconductor chip within a predetermined range, thereby improving the heat dissipation characteristics of the semiconductor device.
• the present invention has been completed.
• the present invention includes the following gist. [1] having a support sheet and a resin film forming layer formed on the support sheet;
• the resin film-forming layer contains a binder polymer component (A), a curable component (B) and an inorganic filler (C), A resin film-forming sheet for chips, wherein the resin film-forming layer has a thermal diffusivity of 2 ⁇ 10 ⁇ 6 m 2 / s or more.
• the inorganic filler (C) includes anisotropic shaped particles (C1) having an aspect ratio of 5 or more and an average particle size of 20 ⁇ m or less, and interfering particles (C2) having an average particle size of more than 20 ⁇ m.
• anisotropic shaped particles (C1) having an aspect ratio of 5 or more and an average particle size of 20 ⁇ m or less
• interfering particles (C2) having an average particle size of more than 20 ⁇ m.
• a resin film is formed on any surface of a semiconductor chip, by using the chip resin film forming sheet according to the present invention, a semiconductor wafer and a chip can be obtained without special treatment. Reliability can be improved.
• the resin film forming sheet for chips according to the present invention includes a support sheet and a resin film forming layer formed on the support sheet.
• the resin film-forming layer contains a binder polymer component (A), a curable component (B), and an inorganic filler (C).
• Binder polymer component The binder polymer component (A) is used for imparting sufficient adhesion and film forming property (sheet forming property) to the resin film forming layer.
• the binder polymer component (A) conventionally known acrylic polymers, polyester resins, urethane resins, acrylic urethane resins, silicone resins, rubber-based polymers, and the like can be used.
• the weight average molecular weight (Mw) of the binder polymer component (A) is preferably 10,000 to 2,000,000, more preferably 100,000 to 1,500,000. If the weight average molecular weight of the binder polymer component (A) is too low, the adhesive force between the resin film forming layer and the support sheet increases, and transfer failure of the resin film forming layer may occur. Adhesiveness may decrease and transfer to a chip or the like may not be possible, or the resin film may peel from the chip or the like after transfer.
• the glass transition temperature (Tg) of the acrylic polymer is preferably in the range of ⁇ 60 to 50 ° C., more preferably ⁇ 50 to 40 ° C., and particularly preferably ⁇ 40 to 30 ° C. If the glass transition temperature of the acrylic polymer is too low, the peeling force between the resin film-forming layer and the support sheet may increase, resulting in poor transfer of the resin film-forming layer, and if it is too high, the adhesion of the resin film-forming layer will be reduced. However, the transfer to the chip or the like may be impossible, or the resin film may be peeled off from the chip or the like after the transfer.
• the monomer constituting the acrylic polymer includes a (meth) acrylic acid ester monomer or a derivative thereof.
• an alkyl (meth) acrylate having an alkyl group having 1 to 18 carbon atoms specifically methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (Meth) acrylate, etc .
• polymerizing the monomer which has a hydroxyl group has preferable compatibility with the sclerosing
• the acrylic polymer may be copolymerized with acrylic acid, methacrylic acid, itaconic acid, vinyl acetate, acrylonitrile, styrene, or the like.
• thermoplastic resin may be blended as the binder polymer component (A).
• the thermoplastic resin is a polymer excluding an acrylic polymer, and is blended in order to maintain the flexibility of the cured resin film.
• the thermoplastic resin preferably has a weight average molecular weight of 1,000 to 100,000, more preferably 3,000 to 80,000.
• the glass transition temperature of the thermoplastic resin is preferably -30 to 150 ° C, more preferably -20 to 120 ° C. If the glass transition temperature of the thermoplastic resin is too low, the peeling force between the resin film forming layer and the support sheet may increase, and transfer failure of the resin film forming layer may occur. Adhesive strength may be insufficient.
• thermoplastic resin examples include polyester resin, urethane resin, acrylic urethane resin, phenoxy resin, silicone resin, polybutene, polybutadiene, and polystyrene. These can be used individually by 1 type or in mixture of 2 or more types.
• thermoplastic resin When the thermoplastic resin is contained, it is contained in an amount of usually 1 to 60 parts by mass, preferably 1 to 30 parts by mass with respect to 100 parts by mass in total of the binder polymer component (A). When the content of the thermoplastic resin is within this range, the above effect can be obtained.
• binder polymer component (A) a polymer having an energy ray polymerizable group in the side chain (energy ray curable polymer) may be used.
• energy ray curable polymer has a function as a binder polymer component (A) and a function as a curable component (B) described later.
• an energy beam polymerizable group what is necessary is just to have the same thing as the energy beam polymerizable functional group which the energy beam polymerizable compound mentioned later contains.
• Examples of the polymer having an energy ray polymerizable group in the side chain include, for example, a polymer having a reactive functional group X in the side chain, a low molecular weight having a functional group Y capable of reacting with the reactive functional group X and an energy ray polymerizable group.
• Examples include polymers prepared by reacting compounds.
• the curable component (B) may be a thermosetting component and a thermosetting agent or an energy beam polymerizable compound. Moreover, you may use combining these.
• the thermosetting component for example, an epoxy resin is preferable.
• epoxy resin a conventionally known epoxy resin can be used.
• epoxy resins include polyfunctional epoxy resins, biphenyl compounds, bisphenol A diglycidyl ether and hydrogenated products thereof, orthocresol novolac epoxy resins, dicyclopentadiene type epoxy resins, biphenyl type epoxy resins, and bisphenols.
• epoxy compounds having two or more functional groups in the molecule such as A-type epoxy resin, bisphenol F-type epoxy resin, and phenylene skeleton-type epoxy resin. These can be used individually by 1 type or in combination of 2 or more types.
• the thermosetting component in the resin film forming layer is preferably 1 with respect to 100 parts by mass of the binder polymer component (A). ⁇ 1500 parts by mass, more preferably 3 ⁇ 1200 parts by mass.
• the content of the thermosetting component is less than 1 part by mass, sufficient adhesiveness may not be obtained.
• the content exceeds 1500 parts by mass, the peeling force between the resin film-forming layer and the support sheet increases, and the resin film A transfer defect of the formation layer may occur.
• thermosetting agent functions as a curing agent for thermosetting components, particularly epoxy resins.
• a preferable thermosetting agent includes a compound having two or more functional groups capable of reacting with an epoxy group in one molecule.
• the functional group include a phenolic hydroxyl group, an alcoholic hydroxyl group, an amino group, a carboxyl group, and an acid anhydride. Of these, phenolic hydroxyl groups, amino groups, acid anhydrides and the like are preferable, and phenolic hydroxyl groups and amino groups are more preferable.
• phenolic curing agent examples include polyfunctional phenolic resins, biphenols, novolac type phenolic resins, dicyclopentadiene type phenolic resins, zylock type phenolic resins, and aralkylphenolic resins.
• amine curing agent is DICY (dicyandiamide). These can be used individually by 1 type or in mixture of 2 or more types.
• the content of the thermosetting agent is preferably 0.1 to 500 parts by mass and more preferably 1 to 200 parts by mass with respect to 100 parts by mass of the thermosetting component.
• the content of the thermosetting agent is small, the adhesiveness may not be obtained due to insufficient curing, and when it is excessive, the moisture absorption rate of the resin film forming layer is increased and the reliability of the semiconductor device may be lowered.
• the energy beam polymerizable compound contains an energy beam polymerizable group and is polymerized and cured when irradiated with energy rays such as ultraviolet rays and electron beams.
• energy beam polymerizable compounds include trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, or 1,4-butylene glycol.
• Examples include acrylate compounds such as diacrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, oligoester acrylate, urethane acrylate oligomer, epoxy-modified acrylate, polyether acrylate, and itaconic acid oligomer.
• acrylate compounds such as diacrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, oligoester acrylate, urethane acrylate oligomer, epoxy-modified acrylate, polyether acrylate, and itaconic acid oligomer.
• Such a compound has at least one polymerizable double bond in the molecule, and usually has a weight average molecular weight of about 100 to 30,000, preferably about 300 to 10,000.
• the energy ray polymerizable compound is preferably used in an amount of 1 to 1500 in the resin film forming layer with respect to 100 parts by mass of the binder polymer component (A).
• the inorganic filler (C) can improve the thermal diffusivity of the resin film-forming layer.
• the thermal diffusivity is improved, and it becomes possible to efficiently diffuse the heat generated by the semiconductor device mounted with the semiconductor chip to which the resin film forming layer is attached.
• the thermal diffusivity is a value obtained by dividing the thermal conductivity of the resin film by the product of the specific heat and specific gravity of the resin film, and indicates that the larger the thermal diffusivity, the better the heat dissipation characteristics.
• the inorganic filler (C) examples include silica (1.3 W / m ⁇ K), zinc oxide (54 W / m ⁇ K), magnesium oxide (59 W / m ⁇ K), and alumina (38 W / m ⁇ K).
• K titanium (21.9 W / m ⁇ K), silicon carbide (100 to 350 W / m ⁇ K), boron nitride (30 to 200 W / m ⁇ K), spherical particles of these, single crystal Examples thereof include fibers and glass fibers.
• the numerical value in parenthesis shows thermal conductivity.
• the inorganic filler (C) preferably contains anisotropic shaped particles (C1) and interfering particles (C2).
• anisotropic shaped particles (C1) When only the anisotropically shaped particles (C1) are used as the inorganic filler (C), the long axis of the resin film forming layer due to stress or gravity applied to the anisotropically shaped particles (C1) during the production process (for example, coating process).
• the proportion of anisotropically shaped particles whose direction is substantially the same as the width direction or the flow direction of the resin film forming layer increases, and it may be difficult to obtain a resin film forming layer having an excellent thermal diffusivity.
• Anisotropically shaped particles exhibit good thermal diffusivity in the long axis direction.
• the ratio of the anisotropically shaped particles in which the major axis direction and the thickness direction of the resin film forming layer are substantially the same increases, so that the heat generated in the semiconductor chip causes the resin film forming layer to It becomes easy to diverge through.
• anisotropically shaped particles (C1) and interfering particles (C2) in combination as the inorganic filler (C)
• the long axis direction of the anisotropically shaped particles is the same as that of the resin film forming layer. It can suppress that it becomes substantially the same as the width direction or the flow direction, and can increase the proportion of anisotropically shaped particles whose major axis direction and the thickness direction of the resin film forming layer are substantially the same.
• the phrase “the major axis direction of anisotropically shaped particles and the thickness direction of the resin film forming layer are substantially the same” specifically means that the major axis direction of anisotropically shaped particles is the same as that of the resin film forming layer. It is in the range of ⁇ 45 to 45 ° with respect to the thickness direction.
• anisotropically shaped particles have anisotropy, and the specific shape thereof has at least one shape selected from the group consisting of a plate shape, a needle shape, and a scale shape. Is preferred.
• Preferred anisotropically shaped particles (C1) include nitride particles, and examples of nitride particles include particles of boron nitride, aluminum nitride, silicon nitride, and the like. Among these, boron nitride particles that are easy to obtain good thermal conductivity are preferable.
• the average particle diameter of the anisotropically shaped particles (C1) is 20 ⁇ m or less, preferably 5 to 20 ⁇ m, more preferably 8 to 20 ⁇ m, and particularly preferably 10 to 15 ⁇ m. Moreover, it is preferable that the average particle diameter of anisotropically-shaped particle
• the average particle diameter of the anisotropically shaped particles (C1) is the number average particle diameter calculated as the arithmetic average value of 20 long axis diameters of randomly selected anisotropically shaped particles (C1) selected with an electron microscope.
• the particle size distribution (CV value) of the anisotropically shaped particles (C1) is preferably 5 to 40%, more preferably 10 to 30%. By setting the particle size distribution of the anisotropically shaped particles (C1) within the above range, efficient and uniform thermal conductivity can be achieved.
• the CV value is an index of particle size variation, and the larger the CV value, the larger the particle size variation.
• the CV value is small, since the particle diameter is uniform, the amount of small-sized particles entering the gap between the particles is reduced, and it becomes difficult to pack the inorganic filler (C) more densely. A resin film forming layer having high thermal conductivity may be difficult to obtain.
• the particle diameter of the inorganic filler (C) may be larger than the thickness of the formed resin film forming layer, resulting in unevenness on the surface of the resin film forming layer.
• the film-forming layer may have poor adhesion.
• CV value is too large, it may become difficult to obtain the heat conductive composition which has uniform performance.
• the particle size distribution (CV value) of the anisotropically shaped particles (C1) was observed with an electron microscope, the major axis diameter was measured for 200 or more particles, the standard deviation of the major axis diameter was determined, and the above average Using the particle diameter, (standard deviation of major axis diameter) / (average particle diameter) can be calculated.
• the aspect ratio of the anisotropically shaped particles (C1) is 5 or more, preferably 5 to 30, more preferably 8 to 20, and still more preferably 10 to 15.
• the aspect ratio is represented by (major axis number average diameter) / (minor axis number average diameter) of the anisotropically shaped particles (C1).
• the short axis number average diameter and the long axis number average diameter are calculated as the arithmetic average values of the short axis diameter and the long axis diameter of 20 anisotropically-shaped particles randomly selected in a transmission electron micrograph.
• the number average particle size is 5 or more, preferably 5 to 30, more preferably 8 to 20, and still more preferably 10 to 15.
• the aspect ratio is represented by (major axis number average diameter) / (minor axis number average diameter) of the anisotropically shaped particles (C1).
• the short axis number average diameter and the long axis number average diameter are calculated as the arithmetic average values of the short
• the aspect ratio of the anisotropically shaped particles (C1) within the above range, the major axis direction of the anisotropically shaped particles (C1) and the width direction and the flow direction of the resin film forming layer are substantially reduced by the disturbing particles (C2). It becomes difficult to be the same, and the anisotropically shaped particles (C1) can form an efficient heat conduction path in the thickness direction of the resin film forming layer, thereby improving the thermal diffusivity.
• the specific gravity of the anisotropically shaped particles (C1) is preferably 2 to 4 g / cm 3 , more preferably 2.2 to 3 g / cm 3 .
• the thermal conductivity in the major axis direction of the anisotropically shaped particles (C1) is preferably 60 to 400 W / m ⁇ K, and more preferably 100 to 300 W / m ⁇ K.
• the formed heat conduction path has high heat conductivity, and as a result, a resin film forming layer having a high thermal diffusivity can be obtained.
• the shape of the interfering particles (C2) is approximately the major axis direction of the anisotropically shaped particles (C1) and the width direction and flow direction (direction parallel to the resin film forming layer) of the resin film forming layer.
• the shape is not particularly limited as long as the shape is prevented from being the same, and the specific shape is preferably spherical.
• Preferred interfering particles (C2) include silica particles and alumina particles, and alumina particles are particularly preferable.
• the average particle diameter of the disturbing particles (C2) is more than 20 ⁇ m, preferably more than 20 ⁇ m and not more than 50 ⁇ m, more preferably more than 20 ⁇ m and not more than 30 ⁇ m.
• the average particle diameter of the interfering particles (C2) is the number average particle diameter calculated as the arithmetic average value of 20 major axis diameters of 20 interfering particles (C2) randomly selected with an electron microscope. .
• the average particle diameter of the interfering particles (C2) is preferably 0.6 to 0.95 times, more preferably 0.7 to 0.9 times the thickness of the resin film forming layer described later. .
• the average particle diameter of the disturbing particles (C2) is less than 0.6 times the thickness of the resin film forming layer, the anisotropic shape in which the major axis direction is substantially the same as the width direction and the flow direction of the resin film forming layer.
• the ratio of the particles (C1) increases, it becomes difficult to form an efficient heat conduction path, and the thermal diffusivity may decrease.
• the surface of the resin film forming layer may be uneven and the adhesiveness of the resin film forming layer may be inferior.
• it may be difficult to obtain a heat conductive resin film forming layer composition having uniform performance.
• the particle size distribution (CV value) of the interfering particles (C2) is preferably 5 to 40%, more preferably 10 to 30%.
• efficient and uniform thermal conductivity can be achieved.
• the CV value is small, since the particle diameter is uniform, the amount of small-sized particles entering the gap between the particles is reduced, and it becomes difficult to pack the inorganic filler (C) more densely.
• a resin film forming layer having high thermal conductivity may be difficult to obtain.
• the particle diameter of the inorganic filler (C) may be larger than the thickness of the formed resin film forming layer, resulting in unevenness on the surface of the resin film forming layer.
• the film-forming layer may have poor adhesion.
• the particle size distribution (CV value) of the interfering particles (C2) is observed with an electron microscope, the major axis diameter is measured for 200 or more particles, the standard deviation of the major axis diameter is obtained, and the average particle diameter described above is obtained. Can be obtained by calculating (standard deviation of major axis diameter) / (average particle diameter).
• the content of the inorganic filler (C) in the resin film forming layer is preferably 30 to 80% by mass, more preferably 40 to 70% by mass, and particularly preferably the total solid content constituting the resin film forming layer. 50 to 60% by mass.
• the weight ratio of the anisotropic shaped particles (C1) to the disturbing particles (C2) is preferably 5: 1 to 1 : 5, more preferably 4: 1 to 1: 4.
• the anisotropically shaped particles (C1) whose major axis direction and the thickness direction of the resin film forming layer are substantially the same. ) Ratio can be increased. As a result, the thermal diffusivity of the resin film forming layer can be improved. Moreover, the thickening of the composition for resin film formation layers can be suppressed, and a smooth resin film can be formed.
• the concentration of the inorganic filler (C) in the resin film forming layer is preferably 30 to 50% by volume, more preferably 35 to 45% by volume.
• the other component resin film-forming layer can contain the following components in addition to the binder polymer component (A), the curable component (B), and the inorganic filler (C).
• Colorant (D) can be mix
• the colorant organic or inorganic pigments and dyes are used. Among these, black pigments are preferable from the viewpoint of electromagnetic wave and infrared shielding properties. Examples of the black pigment include carbon black, iron oxide, manganese dioxide, aniline black, activated carbon, and the like, but are not limited thereto. Carbon black is particularly preferable from the viewpoint of increasing the reliability of the semiconductor device.
• the blending amount of the colorant (D) is preferably 0.1 to 35 parts by mass, more preferably 0.5 to 25 parts by mass, particularly preferably 100 parts by mass of the total solid content constituting the resin film forming layer. Is 1 to 15 parts by mass.
• the curing accelerator (E) is used to adjust the curing rate of the resin film forming layer.
• the curing accelerator (E) is preferably used when an epoxy resin and a thermosetting agent are used in combination, particularly when at least a thermosetting component and a thermosetting agent are used as the curable component (B).
• Preferred curing accelerators include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol; 2-methylimidazole, 2-phenylimidazole, 2-phenyl- Imidazoles such as 4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole and 2-phenyl-4-methyl-5-hydroxymethylimidazole; Organic phosphines such as tributylphosphine, diphenylphosphine and triphenylphosphine; And tetraphenylboron salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphinetetraphenylborate. These can be used individually by 1 type or in mixture of 2 or more types.
• the curing accelerator (E) is preferably contained in an amount of 0.01 to 10 parts by mass, more preferably 0.1 to 5 parts by mass with respect to 100 parts by mass of the total amount of the thermosetting component and the thermosetting agent. It is. By containing the curing accelerator (E) in an amount within the above range, it has excellent adhesion even when exposed to high temperatures and high humidity, and has high reliability even when exposed to severe reflow conditions. Can be achieved. If the content of the curing accelerator (E) is small, sufficient adhesion cannot be obtained due to insufficient curing, and if it is excessive, the curing accelerator having high polarity will adhere to the resin film forming layer at high temperature and high humidity. The reliability of the semiconductor device is lowered by moving to the side and segregating.
• the coupling agent (F) having a functional group that reacts with an inorganic substance and a functional group that reacts with an organic functional group is bonded to the chip of the resin film forming layer, adhesion, and / or aggregation of the resin film. It may be used to improve the property. Moreover, the water resistance can be improved by using a coupling agent (F), without impairing the heat resistance of the resin film obtained by hardening
• the coupling agent (F) a compound in which the functional group that reacts with the organic functional group is a group that reacts with the functional group of the binder polymer component (A), the curable component (B), or the like is preferably used. .
• a silane coupling agent is preferable.
• Such coupling agents include ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropylmethyldiethoxysilane, ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane, ⁇ - (methacryloxypropyl).
• the coupling agent (F) is usually 0.1 to 20 parts by mass, preferably 0.2 to 10 parts by mass, based on 100 parts by mass in total of the binder polymer component (A) and the curable component (B). Preferably, it is contained at a ratio of 0.3 to 5 parts by mass. If the content of the coupling agent (F) is less than 0.1 parts by mass, the above effect may not be obtained, and if it exceeds 20 parts by mass, it may cause outgassing.
• the photopolymerization initiator resin film-forming layer contains an energy beam polymerizable compound as the curable component (B)
• energy beam polymerization is performed by irradiating energy rays such as ultraviolet rays when using the compound.
• the active compound is cured.
• the photopolymerization initiator (G) in the composition constituting the resin film forming layer, the polymerization curing time and the amount of light irradiation can be reduced.
• photopolymerization initiator (G) examples include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, and benzoin dimethyl ketal.
• a photoinitiator (G) can be used individually by 1 type or in combination of 2 or more types.
• the blending ratio of the photopolymerization initiator (G) is preferably 0.1 to 10 parts by mass, and more preferably 1 to 5 parts by mass with respect to 100 parts by mass of the energy beam polymerizable compound. If the amount is less than 0.1 parts by mass, satisfactory transferability may not be obtained due to insufficient photopolymerization. If the amount exceeds 10 parts by mass, a residue that does not contribute to photopolymerization is generated, and the curability of the resin film forming layer is not obtained. May be insufficient.
• a crosslinking agent may be added to adjust the initial adhesive force and cohesive strength of the crosslinking agent resin film-forming layer.
• examples of the crosslinking agent (H) include organic polyvalent isocyanate compounds and organic polyvalent imine compounds.
• organic polyvalent isocyanate compounds include aromatic polyvalent isocyanate compounds, aliphatic polyvalent isocyanate compounds, alicyclic polyvalent isocyanate compounds, trimers of these organic polyvalent isocyanate compounds, and these organic polyvalent isocyanate compounds.
• examples thereof include terminal isocyanate urethane prepolymers obtained by reacting with a polyol compound.
• organic polyvalent isocyanate compound examples include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane-4,4′-.
• organic polyvalent imine compounds include N, N′-diphenylmethane-4,4′-bis (1-aziridinecarboxamide), trimethylolpropane-tri- ⁇ -aziridinylpropionate, tetramethylol. Mention may be made of methane-tri- ⁇ -aziridinylpropionate and N, N′-toluene-2,4-bis (1-aziridinecarboxamide) triethylenemelamine.
• the crosslinking agent (H) is usually in a ratio of 0.01 to 20 parts by weight, preferably 0.1 to 10 parts by weight, more preferably 0.5 to 5 parts by weight with respect to 100 parts by weight of the binder polymer component (A). Used.
• additives may be blended in the general-purpose additive resin film forming layer as necessary.
• additives include leveling agents, plasticizers, antistatic agents, antioxidants, ion scavengers, gettering agents, chain transfer agents, and the like.
• the resin film-forming layer composed of the above components has adhesiveness and curability, and adheres by being pressed against a semiconductor wafer, a chip or the like in an uncured state, or by being pressed while being heated. After curing, a resin film having high impact resistance can be finally provided, the adhesive strength is excellent, and a sufficient protective function can be maintained even under severe high temperature and high humidity conditions.
• the resin film forming layer is preferably used as a film adhesive for fixing a semiconductor chip to a substrate or another semiconductor chip, or as a protective film for a semiconductor wafer or a semiconductor chip.
• the resin film forming layer may have a single layer structure, or may have a multilayer structure as long as one or more layers containing the above components are included.
• the thermal diffusivity of the resin film forming layer is 2 ⁇ 10 ⁇ 6 m 2 / s or more, preferably 2.5 ⁇ 10 ⁇ 6 to 5 ⁇ 10 ⁇ 6 m 2 / s, more preferably 4 ⁇ 10 ⁇ 6. ⁇ 5 ⁇ 10 ⁇ 6 m 2 / s.
• the thermal diffusivity of the cured resin film forming layer (resin film) is preferably 2 ⁇ 10 ⁇ 6 m 2 / s or more, more preferably 2.5 ⁇ 10 ⁇ 6 to 5 ⁇ 10 ⁇ 6 m 2. / S, particularly preferably 4 ⁇ 10 ⁇ 6 to 5 ⁇ 10 ⁇ 6 m 2 / s.
• the thermal diffusivity of the resin film forming layer is less than 2 ⁇ 10 ⁇ 6 m 2 / s, the semiconductor device is deformed due to heat generation of the semiconductor device, causing failure or breakage, and the operation speed of the semiconductor device. Deterioration and malfunction may be caused, and the reliability of the semiconductor device may be reduced.
• the thermal diffusivity of the resin film forming layer or the resin film within the above range, the heat dissipation characteristics of the semiconductor device can be improved, and a semiconductor device having excellent reliability can be manufactured.
• thermal conductivity can be used as an index of heat dissipation characteristics of the resin film forming layer.
• the thermal conductivity of the cured resin film forming layer (resin film) is 4 to 15 W / m ⁇ K is preferable, and 5 to 10 W / m ⁇ K is more preferable.
• the resin film-forming layer is obtained by applying and drying a resin film-forming composition obtained by mixing each of the above components in an appropriate solvent on a support sheet.
• the composition for forming a resin film may be applied on a process film different from the support sheet and dried to form a film, which may be transferred onto the support sheet.
• the resin film forming sheet for chips according to the present invention is formed by releasably forming the resin film forming layer on a support sheet.
• the shape of the resin film forming sheet for chips according to the present invention can take any shape such as a tape shape and a label shape.
• the support sheet for example, polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene naphthalate film, polybutylene terephthalate film, Polyurethane film, ethylene vinyl acetate copolymer film, ionomer resin film, ethylene / (meth) acrylic acid copolymer film, ethylene / (meth) acrylic acid ester copolymer film, polystyrene film, polycarbonate film, polyimide film, fluorine A film such as a resin film is used. These crosslinked films are also used. Furthermore, these laminated films may be sufficient. Moreover, the film which colored these can also be used.
• the support sheet is peeled off when used, and the resin film forming layer is transferred to a semiconductor wafer or chip.
• the support sheet needs to withstand the heating during the heat curing of the resin film forming layer, and therefore, an annealed polyethylene terephthalate film having excellent heat resistance, polyethylene Naphthalate film, polymethylpentene film, and polyimide film are preferably used.
• the surface tension of the support sheet is preferably 40 mN / m or less, more preferably 37 mN / m or less, and particularly preferably 35 mN / m or less. .
• the lower limit is usually about 25 mN / m.
• alkyd, silicone, fluorine, unsaturated polyester, polyolefin, wax, and the like are used as the release agent used for the release treatment.
• alkyd, silicone, and fluorine release agents are heat resistant. This is preferable.
• the release agent is applied as it is without a solvent, or diluted or emulsified with a solvent, and applied with a gravure coater, Mayer bar coater, air knife coater, roll coater, etc.
• the laminate may be formed by room temperature, heat curing, electron beam curing, wet lamination, dry lamination, hot melt lamination, melt extrusion lamination, coextrusion processing, or the like.
• the resin film forming layer may be laminated on a releasable pressure-sensitive adhesive layer provided on the support sheet.
• the re-peelable pressure-sensitive adhesive layer may be a weakly-adhesive layer having an adhesive strength that can peel the resin film-forming layer, or an energy-ray-curable layer whose adhesive strength is reduced by energy beam irradiation. May be used.
• the region where the resin film forming layer is laminated is preliminarily irradiated with energy rays to reduce adhesiveness, while other regions are irradiated with energy rays. For example, for the purpose of bonding to a jig, the adhesive strength may be kept high.
• an energy beam shielding layer may be provided by printing or the like in a region corresponding to the other region of the substrate, and the energy beam irradiation may be performed from the substrate side.
• the re-peelable pressure-sensitive adhesive layer can be formed of various conventionally known pressure-sensitive adhesives (for example, rubber-based, acrylic-based, silicone-based, urethane-based, vinyl ether-based general-purpose pressure-sensitive adhesives).
• the thickness of the releasable pressure-sensitive adhesive layer is not particularly limited, but is usually 1 to 50 ⁇ m, preferably 3 to 20 ⁇ m.
• the thickness of the support sheet is usually 10 to 500 ⁇ m, preferably 15 to 300 ⁇ m, particularly preferably 20 to 250 ⁇ m.
• the thickness of the resin film forming layer is preferably 20 to 60 ⁇ m, more preferably 25 to 50 ⁇ m, and particularly preferably 30 to 45 ⁇ m.
• the thickness of the resin film forming layer is preferably 2 to 5 ⁇ m larger than the average particle diameter of the disturbing particles (C2).
• a light peelable release film is laminated on the upper surface of the resin film forming layer separately from the support sheet. May be.
• the resin film forming layer of such a resin film forming sheet for chips can function as a film adhesive.
• a film adhesive is usually applied to any surface of a semiconductor wafer, cut into individual chips through a dicing process, and then placed on a substrate (die bond), and a semiconductor chip is bonded and fixed through a curing process. Used for Such a film adhesive is sometimes referred to as a die attachment film. Since the semiconductor device using the resin film forming layer in the present invention as a film adhesive is excellent in heat dissipation characteristics, it is possible to suppress a decrease in reliability. *
• the resin film forming layer of the chip resin film forming sheet can be a protective film.
• the resin film forming layer is affixed to the back surface of the face-down chip semiconductor wafer or semiconductor chip, and has a function of protecting the semiconductor chip as an alternative to the sealing resin by being cured by an appropriate means.
• the protective film has a function of reinforcing the wafer, so that damage to the wafer can be prevented.
• the semiconductor device which used the resin film formation layer in this invention as the protective film is excellent in the thermal radiation characteristic, it can suppress the fall of the reliability.
• a method of manufacturing a semiconductor device is a semiconductor device in which a resin film forming layer of the resin film forming sheet for a chip is pasted on the back surface of a semiconductor wafer having a circuit formed on the surface, and then the resin film is formed on the back surface. It is preferable to obtain a chip.
• the resin film is preferably a protective film for a semiconductor wafer or a semiconductor chip.
• the semiconductor chip manufacturing method according to the present invention preferably further includes the following steps (1) to (3), wherein the steps (1) to (3) are performed in an arbitrary order. Step (1): peeling the resin film forming layer or resin film and the support sheet, Step (2): The resin film forming layer is cured to obtain a resin film. Step (3): dicing the semiconductor wafer and the resin film forming layer or resin film.
• the semiconductor wafer may be a silicon wafer or a compound semiconductor wafer such as gallium / arsenic. Formation of a circuit on the wafer surface can be performed by various methods including conventionally used methods such as an etching method and a lift-off method. Next, the opposite surface (back surface) of the circuit surface of the semiconductor wafer is ground.
• the grinding method is not particularly limited, and grinding may be performed by a known means using a grinder or the like. At the time of back surface grinding, an adhesive sheet called a surface protection sheet is attached to the circuit surface in order to protect the circuit on the surface.
• the circuit surface side (that is, the surface protection sheet side) of the wafer is fixed by a chuck table or the like, and the back surface side on which no circuit is formed is ground by a grinder.
• the thickness of the wafer after grinding is not particularly limited, but is usually about 20 to 500 ⁇ m.
• the crushed layer generated during back grinding is removed.
• the crushed layer is removed by chemical etching, plasma etching, or the like.
• steps (1) to (3) are performed in an arbitrary order. Details of this process are described in detail in JP-A-2002-280329. As an example, the case where it performs in order of process (1), (2), (3) is demonstrated.
• the resin film forming layer of the above-mentioned resin film forming sheet for chips is attached to the back surface of a semiconductor wafer having a circuit formed on the front surface.
• the support sheet is peeled from the resin film forming layer to obtain a laminate of the semiconductor wafer and the resin film forming layer.
• the resin film forming layer is cured to form a resin film on the entire surface of the wafer.
• a thermosetting component and a thermosetting agent are used as the curable component (B) in the resin film forming layer
• the resin film forming layer is cured by thermosetting.
• the resin film forming layer can be cured by irradiation with energy rays, and the thermosetting component, the thermosetting agent, energy
• the linear polymerizable compound is used in combination, curing by heating and energy beam irradiation may be performed simultaneously or sequentially.
• the energy rays to be irradiated include ultraviolet rays (UV) and electron beams (EB), and preferably ultraviolet rays are used.
• the outstanding heat dissipation characteristic is provided by forming the resin film with a high thermal diffusivity. Further, compared with a coating method in which a coating solution for a resin film is directly applied to the back surface of a wafer or chip, the thickness of the resin film is excellent.
• the laminated body of the semiconductor wafer and the resin film is diced for each circuit formed on the wafer surface. Dicing is performed so as to cut both the wafer and the resin film.
• the wafer is diced by a conventional method using a dicing sheet. As a result, a semiconductor chip having a resin film on the back surface is obtained.
• the semiconductor device can be manufactured by mounting the semiconductor chip on a predetermined base by the face-down method.
• a semiconductor device can be manufactured by bonding a semiconductor chip having a resin film on the back surface to another member (on a chip mounting portion) such as a die pad portion or another semiconductor chip.
• the resin film forming layer of the sheet is bonded to a semiconductor wafer, and the semiconductor wafer is diced into a semiconductor chip.
• the resin film forming layer is fixedly left on either side of the semiconductor chip and peeled off from the support sheet, and the semiconductor chip is mounted on the die pad portion or another semiconductor chip via the resin film forming layer. It is preferable to include a step of placing. As an example, a manufacturing method for attaching a resin film forming layer to the back surface of a chip will be described below.
• the ring frame and the back side of the semiconductor wafer are placed on the resin film forming layer of the chip resin film forming sheet according to the present invention, and lightly pressed to fix the semiconductor wafer. At that time, if it does not have tackiness at room temperature, it may be appropriately heated (although it is not limited, it is preferably 40 to 80 ° C.).
• the resin film forming layer is irradiated with energy rays from the support sheet side, and the resin layer forming layer is preliminarily formed. It may be hardened to increase the cohesive force of the resin film forming layer and decrease the adhesive force between the resin film forming layer and the support sheet.
• the cutting depth at this time is a depth that takes into account the sum of the thickness of the semiconductor wafer and the thickness of the resin film forming layer and the amount of wear of the dicing saw.
• the energy beam irradiation may be performed at any stage after the semiconductor wafer is pasted and before the semiconductor chip is peeled off (pickup). For example, the irradiation may be performed after dicing or after the following expanding step. Good. Further, the energy beam irradiation may be performed in a plurality of times.
• the resin film forming sheet for chips is expanded, the interval between the semiconductor chips is expanded, and the semiconductor chips can be picked up more easily. At this time, a deviation occurs between the resin film forming layer and the support sheet, the adhesive force between the resin film forming layer and the support sheet is reduced, and the pick-up property of the semiconductor chip is improved. When the semiconductor chip is picked up in this manner, the cut resin film forming layer can be adhered to the back surface of the semiconductor chip and peeled off from the support sheet.
• the semiconductor chip is placed on the die pad of the lead frame or on the surface of another semiconductor chip (lower chip) through the resin film forming layer (hereinafter, the die pad or lower chip surface on which the chip is mounted is referred to as “chip mounting portion”. ).
• the chip mounting portion is heated before or after the semiconductor chip is placed.
• the heating temperature is usually 80 to 200 ° C., preferably 100 to 180 ° C.
• the heating time is usually 0.1 seconds to 5 minutes, preferably 0.5 seconds to 3 minutes.
• the pressure is usually 1 kPa to 200 MPa.
• the heating conditions at this time are in the above heating temperature range, and the heating time is usually 1 to 180 minutes, preferably 10 to 120 minutes.
• the resin film forming layer may be cured by using a heat in resin sealing that is normally performed in package manufacturing, without temporarily performing the heat treatment after placement.
• the resin film formation layer hardens
• the resin film forming layer is fluidized under die bonding conditions, the resin film forming layer is sufficiently embedded in the unevenness of the chip mounting portion, and generation of voids can be prevented and the reliability of the semiconductor device is improved.
• the thermal diffusivity of the resin film forming layer is high, the semiconductor device has excellent heat dissipation characteristics, and it is possible to suppress a decrease in reliability.
• the resin film-forming sheet for chips of the present invention can be used for bonding semiconductor compounds, glass, ceramics, metals, etc., in addition to the above-described usage methods.
• the resin film forming layer (thickness: 40 ⁇ m) was cut to obtain a square sample with each piece being 1 cm. Next, the sample was heated and cured (130 ° C., 2 hours), and then the thermal conductivity of the sample was measured using a thermal conductivity measuring device (eye phase mobile 1u manufactured by ai-phase). . Thereafter, the thermal diffusivity of the sample was calculated from the specific heat and specific gravity of the sample, and was used as the thermal diffusivity of the resin film. The case where the thermal diffusivity was 2 ⁇ 10 ⁇ 6 m 2 / s or more was judged as “good”, and the case where it was less than 2 ⁇ 10 ⁇ 6 m 2 / s was judged as “bad”.
• Binder polymer component copolymer of 85 parts by weight of methyl methacrylate and 15 parts by weight of 2-hydroxyethyl acrylate (weight average molecular weight: 400,000, glass transition temperature: 6 ° C.)
• Curing component (B1) Bisphenol A type epoxy resin (epoxy equivalent 180 to 200 g / eq)
• B2) Dicyclopentadiene type epoxy resin (Epicron HP-7200HH, manufactured by Dainippon Ink & Chemicals, Inc.)
• B3 Dicyandiamide Adeka Hardener 3636AS manufactured by Asahi Denka
• Inorganic filler (C1) Boron nitride particles (UHP-2, manufactured by Showa Denko KK, shape: plate, average particle diameter 11.8 ⁇ m, aspect ratio 11.2, major axis thermal conductivity 200 W / m ⁇ K, specific gravity 2
• Examples and Comparative Examples The above components were blended in the amounts shown in Table 1 to obtain a resin film forming composition.
• a methyl ethyl ketone solution (solid concentration 61% by weight) of the obtained composition was dried on the release-treated surface of a support sheet (SP-PET 381031, thickness 38 ⁇ m manufactured by Lintec Co., Ltd.) that had been subjected to a release treatment with silicone, and then 40 ⁇ m (Comparative Example). 3 is applied to a thickness of 60 ⁇ m) and dried (drying conditions: 110 ° C. for 1 minute in an oven) to form a resin film forming layer on the support sheet, thereby obtaining a resin film forming sheet for chips. It was.
• the resin film-forming layer of the chip resin film-forming sheet of the example exhibited an excellent thermal diffusivity. Therefore, it has a support sheet and a resin film forming layer formed on the support sheet, and the resin film forming layer contains a binder polymer component (A), a curable component (B), and an inorganic filler (C).
• the resin film forming layer contains a binder polymer component (A), a curable component (B), and an inorganic filler (C).
• a highly reliable semiconductor device can be obtained by using a resin film forming sheet for a chip in which the thermal diffusivity of the resin film forming layer is 2 ⁇ 10 ⁇ 6 m 2 / s or more.

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