TWI600156B - 半導體裝置 - Google Patents
半導體裝置 Download PDFInfo
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- TWI600156B TWI600156B TW100123345A TW100123345A TWI600156B TW I600156 B TWI600156 B TW I600156B TW 100123345 A TW100123345 A TW 100123345A TW 100123345 A TW100123345 A TW 100123345A TW I600156 B TWI600156 B TW I600156B
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- Taiwan
- Prior art keywords
- oxide semiconductor
- oxide
- electrode
- insulating layer
- film
- Prior art date
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- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/62—Electrodes ohmically coupled to a semiconductor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6733—Multi-gate TFTs
- H10D30/6734—Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
- H10D30/6739—Conductor-insulator-semiconductor electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
- H10D30/6756—Amorphous oxide semiconductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
- H10D64/691—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator comprising metallic compounds, e.g. metal oxides or metal silicates
Landscapes
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Bipolar Transistors (AREA)
- Noodles (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010152179 | 2010-07-02 | ||
| JP2011100534 | 2011-04-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201216471A TW201216471A (en) | 2012-04-16 |
| TWI600156B true TWI600156B (zh) | 2017-09-21 |
Family
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| TW100123345A TWI600156B (zh) | 2010-07-02 | 2011-07-01 | 半導體裝置 |
| TW105132071A TWI684279B (zh) | 2010-07-02 | 2011-07-01 | 半導體裝置 |
| TW111100135A TWI772241B (zh) | 2010-07-02 | 2011-07-01 | 半導體裝置 |
| TW109136305A TWI763085B (zh) | 2010-07-02 | 2011-07-01 | 半導體裝置 |
| TW109101096A TWI713226B (zh) | 2010-07-02 | 2011-07-01 | 半導體裝置 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW105132071A TWI684279B (zh) | 2010-07-02 | 2011-07-01 | 半導體裝置 |
| TW111100135A TWI772241B (zh) | 2010-07-02 | 2011-07-01 | 半導體裝置 |
| TW109136305A TWI763085B (zh) | 2010-07-02 | 2011-07-01 | 半導體裝置 |
| TW109101096A TWI713226B (zh) | 2010-07-02 | 2011-07-01 | 半導體裝置 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US20120001179A1 (enExample) |
| JP (7) | JP5856395B2 (enExample) |
| KR (2) | KR20120003390A (enExample) |
| TW (5) | TWI600156B (enExample) |
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| JP6059968B2 (ja) * | 2011-11-25 | 2017-01-11 | 株式会社半導体エネルギー研究所 | 半導体装置、及び液晶表示装置 |
| KR101308809B1 (ko) * | 2012-01-20 | 2013-09-13 | 경희대학교 산학협력단 | 산화물 반도체 박막 트랜지스터 제조방법 및 이를 이용한 능동구동 디스플레이 장치, 능동구동 센서장치 |
| KR20130085859A (ko) * | 2012-01-20 | 2013-07-30 | 삼성디스플레이 주식회사 | 액정 표시 장치 및 그 제조 방법 |
| US20140299873A1 (en) * | 2013-04-05 | 2014-10-09 | Semiconductor Energy Laboratory Co., Ltd. | Single-crystal oxide semiconductor, thin film, oxide stack, and formation method thereof |
| KR102479472B1 (ko) | 2013-04-15 | 2022-12-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 |
| KR102304824B1 (ko) * | 2013-08-09 | 2021-09-23 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| CN106409686A (zh) * | 2015-08-03 | 2017-02-15 | 中华映管股份有限公司 | 制造氧化物半导体薄膜电晶体的方法 |
| DE102015220034A1 (de) | 2015-10-15 | 2017-04-20 | Benecke-Kaliko Ag | Folienlaminat und Innenverkleidungsteil für Kraftfahrzeuge |
| TWI721026B (zh) | 2015-10-30 | 2021-03-11 | 日商半導體能源研究所股份有限公司 | 電容器、半導體裝置、模組以及電子裝置的製造方法 |
| WO2019102314A1 (ja) * | 2017-11-24 | 2019-05-31 | 株式会社半導体エネルギー研究所 | 半導体材料、および半導体装置 |
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| US6858898B1 (en) * | 1999-03-23 | 2005-02-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| US6461899B1 (en) * | 1999-04-30 | 2002-10-08 | Semiconductor Energy Laboratory, Co., Ltd. | Oxynitride laminate “blocking layer” for thin film semiconductor devices |
| JP2001358342A (ja) * | 2000-06-14 | 2001-12-26 | Sharp Corp | アクティブマトリクス基板 |
| TWI313059B (enExample) * | 2000-12-08 | 2009-08-01 | Sony Corporatio | |
| JP2003264192A (ja) * | 2002-03-07 | 2003-09-19 | Sanyo Electric Co Ltd | 配線構造、その製造方法、および光学装置 |
| JP4128396B2 (ja) * | 2002-06-07 | 2008-07-30 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
| JP2004193446A (ja) * | 2002-12-13 | 2004-07-08 | Sanyo Electric Co Ltd | 半導体装置の製造方法および薄膜トランジスタの製造方法 |
| EP1649501B1 (en) * | 2003-07-30 | 2007-01-03 | Infineon Technologies AG | High-k dielectric film, method of forming the same and related semiconductor device |
| US7026713B2 (en) * | 2003-12-17 | 2006-04-11 | Hewlett-Packard Development Company, L.P. | Transistor device having a delafossite material |
| US7211825B2 (en) * | 2004-06-14 | 2007-05-01 | Yi-Chi Shih | Indium oxide-based thin film transistors and circuits |
| JP5126729B2 (ja) * | 2004-11-10 | 2013-01-23 | キヤノン株式会社 | 画像表示装置 |
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| JP2008140984A (ja) * | 2006-12-01 | 2008-06-19 | Sharp Corp | 半導体素子、半導体素子の製造方法、及び表示装置 |
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| JP4727684B2 (ja) * | 2007-03-27 | 2011-07-20 | 富士フイルム株式会社 | 薄膜電界効果型トランジスタおよびそれを用いた表示装置 |
| KR101334182B1 (ko) * | 2007-05-28 | 2013-11-28 | 삼성전자주식회사 | ZnO 계 박막 트랜지스터의 제조방법 |
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| JP2009021540A (ja) * | 2007-06-13 | 2009-01-29 | Rohm Co Ltd | ZnO系薄膜及びZnO系半導体素子 |
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| KR20090041506A (ko) * | 2007-10-24 | 2009-04-29 | 엘지전자 주식회사 | 박막 트랜지스터 및 이를 포함하는 표시장치 |
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| JP5264197B2 (ja) * | 2008-01-23 | 2013-08-14 | キヤノン株式会社 | 薄膜トランジスタ |
| JP5182993B2 (ja) * | 2008-03-31 | 2013-04-17 | 株式会社半導体エネルギー研究所 | 表示装置及びその作製方法 |
| CN102007586B (zh) * | 2008-04-18 | 2013-09-25 | 株式会社半导体能源研究所 | 薄膜晶体管及其制造方法 |
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| TWI875442B (zh) * | 2008-07-31 | 2025-03-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置及半導體裝置的製造方法 |
| US9000441B2 (en) * | 2008-08-05 | 2015-04-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device |
| US8030718B2 (en) * | 2008-09-12 | 2011-10-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Local charge and work function engineering on MOSFET |
| JP2010073880A (ja) * | 2008-09-18 | 2010-04-02 | Fujifilm Corp | 薄膜電界効果型トランジスタ及びその製造方法 |
| WO2010035627A1 (en) * | 2008-09-25 | 2010-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| WO2010035625A1 (en) * | 2008-09-25 | 2010-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Semi conductor device |
| JP5552753B2 (ja) * | 2008-10-08 | 2014-07-16 | ソニー株式会社 | 薄膜トランジスタおよび表示装置 |
| JP5430113B2 (ja) * | 2008-10-08 | 2014-02-26 | キヤノン株式会社 | 電界効果型トランジスタ及びその製造方法 |
| JP5595003B2 (ja) * | 2008-10-23 | 2014-09-24 | 株式会社半導体エネルギー研究所 | 表示装置 |
| CN102509736B (zh) * | 2008-10-24 | 2015-08-19 | 株式会社半导体能源研究所 | 半导体器件和用于制造该半导体器件的方法 |
| KR101634411B1 (ko) * | 2008-10-31 | 2016-06-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 구동 회로, 표시 장치 및 전자 장치 |
| KR20130138352A (ko) * | 2008-11-07 | 2013-12-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| EP2184783B1 (en) * | 2008-11-07 | 2012-10-03 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device and method for manufacturing the same |
| KR101432764B1 (ko) * | 2008-11-13 | 2014-08-21 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치의 제조방법 |
| JP5489449B2 (ja) * | 2008-12-10 | 2014-05-14 | 株式会社東芝 | 不揮発性半導体記憶装置及びその製造方法 |
| US8247812B2 (en) * | 2009-02-13 | 2012-08-21 | Semiconductor Energy Laboratory Co., Ltd. | Transistor, semiconductor device including the transistor, and manufacturing method of the transistor and the semiconductor device |
| KR102195170B1 (ko) * | 2009-03-12 | 2020-12-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| EP2533293A4 (en) * | 2010-02-01 | 2016-12-07 | Nec Corp | AMORPHIC OXID THIN LAYER, THIN FILM TRANSISTOR THEREWITH, AND METHOD FOR PRODUCING THE THIN-LAYER TRANSISTOR |
-
2011
- 2011-06-22 US US13/166,073 patent/US20120001179A1/en not_active Abandoned
- 2011-06-28 JP JP2011142780A patent/JP5856395B2/ja active Active
- 2011-06-30 KR KR1020110064841A patent/KR20120003390A/ko not_active Ceased
- 2011-07-01 TW TW100123345A patent/TWI600156B/zh active
- 2011-07-01 TW TW105132071A patent/TWI684279B/zh active
- 2011-07-01 TW TW111100135A patent/TWI772241B/zh not_active IP Right Cessation
- 2011-07-01 TW TW109136305A patent/TWI763085B/zh active
- 2011-07-01 TW TW109101096A patent/TWI713226B/zh active
-
2015
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2017
- 2017-10-03 JP JP2017193380A patent/JP6479921B2/ja active Active
-
2019
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2020
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2022
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- 2022-01-19 JP JP2022006493A patent/JP2022044686A/ja not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| TW202021135A (zh) | 2020-06-01 |
| US20120001179A1 (en) | 2012-01-05 |
| JP5856395B2 (ja) | 2016-02-09 |
| TW202218167A (zh) | 2022-05-01 |
| JP6818918B2 (ja) | 2021-01-27 |
| JP2019071485A (ja) | 2019-05-09 |
| KR20120003390A (ko) | 2012-01-10 |
| TW202107716A (zh) | 2021-02-16 |
| KR20190003856A (ko) | 2019-01-09 |
| JP2012238826A (ja) | 2012-12-06 |
| JP7013559B2 (ja) | 2022-01-31 |
| JP2022044686A (ja) | 2022-03-17 |
| JP2018029196A (ja) | 2018-02-22 |
| JP2020107889A (ja) | 2020-07-09 |
| JP6657440B2 (ja) | 2020-03-04 |
| TWI772241B (zh) | 2022-07-21 |
| TWI713226B (zh) | 2020-12-11 |
| TW201703263A (zh) | 2017-01-16 |
| JP2021061433A (ja) | 2021-04-15 |
| TWI763085B (zh) | 2022-05-01 |
| TW201216471A (en) | 2012-04-16 |
| US20220123150A1 (en) | 2022-04-21 |
| JP6479921B2 (ja) | 2019-03-06 |
| TWI684279B (zh) | 2020-02-01 |
| JP2016086179A (ja) | 2016-05-19 |
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