KR20120003390A - 반도체 장치 - Google Patents

반도체 장치 Download PDF

Info

Publication number
KR20120003390A
KR20120003390A KR1020110064841A KR20110064841A KR20120003390A KR 20120003390 A KR20120003390 A KR 20120003390A KR 1020110064841 A KR1020110064841 A KR 1020110064841A KR 20110064841 A KR20110064841 A KR 20110064841A KR 20120003390 A KR20120003390 A KR 20120003390A
Authority
KR
South Korea
Prior art keywords
oxide
oxide semiconductor
insulating layer
electrode
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020110064841A
Other languages
English (en)
Korean (ko)
Inventor
순페이 야마자키
마사히로 타카하시
타쿠야 히로하시
카츠아키 토치바야시
야스타카 나카자와
마사토시 요코야마
Original Assignee
가부시키가이샤 한도오따이 에네루기 켄큐쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 한도오따이 에네루기 켄큐쇼 filed Critical 가부시키가이샤 한도오따이 에네루기 켄큐쇼
Publication of KR20120003390A publication Critical patent/KR20120003390A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/62Electrodes ohmically coupled to a semiconductor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6704Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6733Multi-gate TFTs
    • H10D30/6734Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/6737Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
    • H10D30/6739Conductor-insulator-semiconductor electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • H10D30/6756Amorphous oxide semiconductors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/66Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/68Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
    • H10D64/691Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator comprising metallic compounds, e.g. metal oxides or metal silicates 

Landscapes

  • Thin Film Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Bipolar Transistors (AREA)
  • Noodles (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020110064841A 2010-07-02 2011-06-30 반도체 장치 Ceased KR20120003390A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010152179 2010-07-02
JPJP-P-2010-152179 2010-07-02
JPJP-P-2011-100534 2011-04-28
JP2011100534 2011-04-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020190001032A Division KR20190003856A (ko) 2010-07-02 2019-01-04 반도체 장치

Publications (1)

Publication Number Publication Date
KR20120003390A true KR20120003390A (ko) 2012-01-10

Family

ID=45399022

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020110064841A Ceased KR20120003390A (ko) 2010-07-02 2011-06-30 반도체 장치
KR1020190001032A Ceased KR20190003856A (ko) 2010-07-02 2019-01-04 반도체 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020190001032A Ceased KR20190003856A (ko) 2010-07-02 2019-01-04 반도체 장치

Country Status (4)

Country Link
US (2) US20120001179A1 (enExample)
JP (7) JP5856395B2 (enExample)
KR (2) KR20120003390A (enExample)
TW (5) TWI600156B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013109071A1 (ko) * 2012-01-20 2013-07-25 경희대학교 산학협력단 산화물 반도체 박막 트랜지스터 제조방법 및 이를 이용한 능동구동 디스플레이 장치, 능동구동 센서장치

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6059968B2 (ja) * 2011-11-25 2017-01-11 株式会社半導体エネルギー研究所 半導体装置、及び液晶表示装置
KR20130085859A (ko) * 2012-01-20 2013-07-30 삼성디스플레이 주식회사 액정 표시 장치 및 그 제조 방법
US20140299873A1 (en) * 2013-04-05 2014-10-09 Semiconductor Energy Laboratory Co., Ltd. Single-crystal oxide semiconductor, thin film, oxide stack, and formation method thereof
KR102479472B1 (ko) 2013-04-15 2022-12-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치
KR102304824B1 (ko) * 2013-08-09 2021-09-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
CN106409686A (zh) * 2015-08-03 2017-02-15 中华映管股份有限公司 制造氧化物半导体薄膜电晶体的方法
DE102015220034A1 (de) 2015-10-15 2017-04-20 Benecke-Kaliko Ag Folienlaminat und Innenverkleidungsteil für Kraftfahrzeuge
TWI721026B (zh) 2015-10-30 2021-03-11 日商半導體能源研究所股份有限公司 電容器、半導體裝置、模組以及電子裝置的製造方法
WO2019102314A1 (ja) * 2017-11-24 2019-05-31 株式会社半導体エネルギー研究所 半導体材料、および半導体装置

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6858898B1 (en) * 1999-03-23 2005-02-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US6461899B1 (en) * 1999-04-30 2002-10-08 Semiconductor Energy Laboratory, Co., Ltd. Oxynitride laminate “blocking layer” for thin film semiconductor devices
JP2001358342A (ja) * 2000-06-14 2001-12-26 Sharp Corp アクティブマトリクス基板
TWI313059B (enExample) * 2000-12-08 2009-08-01 Sony Corporatio
JP2003264192A (ja) * 2002-03-07 2003-09-19 Sanyo Electric Co Ltd 配線構造、その製造方法、および光学装置
JP4128396B2 (ja) * 2002-06-07 2008-07-30 株式会社ルネサステクノロジ 半導体装置の製造方法
JP2004193446A (ja) * 2002-12-13 2004-07-08 Sanyo Electric Co Ltd 半導体装置の製造方法および薄膜トランジスタの製造方法
EP1649501B1 (en) * 2003-07-30 2007-01-03 Infineon Technologies AG High-k dielectric film, method of forming the same and related semiconductor device
US7026713B2 (en) * 2003-12-17 2006-04-11 Hewlett-Packard Development Company, L.P. Transistor device having a delafossite material
US7211825B2 (en) * 2004-06-14 2007-05-01 Yi-Chi Shih Indium oxide-based thin film transistors and circuits
JP5126729B2 (ja) * 2004-11-10 2013-01-23 キヤノン株式会社 画像表示装置
US20060197089A1 (en) * 2005-03-03 2006-09-07 Chunghwa Picture Tubes., Ltd. Semiconductor device and its manufacturing method
JP2006351844A (ja) * 2005-06-16 2006-12-28 Mitsubishi Electric Corp 電気光学表示装置およびその製造方法
JP5232360B2 (ja) * 2006-01-05 2013-07-10 株式会社ジャパンディスプレイイースト 半導体装置及びその製造方法
JP4932415B2 (ja) * 2006-09-29 2012-05-16 株式会社半導体エネルギー研究所 半導体装置
JP2008140984A (ja) * 2006-12-01 2008-06-19 Sharp Corp 半導体素子、半導体素子の製造方法、及び表示装置
KR101312259B1 (ko) * 2007-02-09 2013-09-25 삼성전자주식회사 박막 트랜지스터 및 그 제조방법
KR101402102B1 (ko) * 2007-03-23 2014-05-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치의 제작 방법
JP4727684B2 (ja) * 2007-03-27 2011-07-20 富士フイルム株式会社 薄膜電界効果型トランジスタおよびそれを用いた表示装置
KR101334182B1 (ko) * 2007-05-28 2013-11-28 삼성전자주식회사 ZnO 계 박막 트랜지스터의 제조방법
JP5241143B2 (ja) * 2007-05-30 2013-07-17 キヤノン株式会社 電界効果型トランジスタ
JP2009021540A (ja) * 2007-06-13 2009-01-29 Rohm Co Ltd ZnO系薄膜及びZnO系半導体素子
US8354674B2 (en) * 2007-06-29 2013-01-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device wherein a property of a first semiconductor layer is different from a property of a second semiconductor layer
JP5232425B2 (ja) * 2007-09-10 2013-07-10 ルネサスエレクトロニクス株式会社 不揮発性半導体記憶装置およびその製造方法
KR20090041506A (ko) * 2007-10-24 2009-04-29 엘지전자 주식회사 박막 트랜지스터 및 이를 포함하는 표시장치
WO2009093625A1 (ja) * 2008-01-23 2009-07-30 Idemitsu Kosan Co., Ltd. 電界効果型トランジスタ及びその製造方法、それを用いた表示装置、並びに半導体装置
JP5264197B2 (ja) * 2008-01-23 2013-08-14 キヤノン株式会社 薄膜トランジスタ
JP5182993B2 (ja) * 2008-03-31 2013-04-17 株式会社半導体エネルギー研究所 表示装置及びその作製方法
CN102007586B (zh) * 2008-04-18 2013-09-25 株式会社半导体能源研究所 薄膜晶体管及其制造方法
EP2297778A1 (en) * 2008-05-23 2011-03-23 Semiconductor Energy Laboratory Co, Ltd. Semiconductor device
US8314765B2 (en) * 2008-06-17 2012-11-20 Semiconductor Energy Laboratory Co., Ltd. Driver circuit, display device, and electronic device
US7812346B2 (en) * 2008-07-16 2010-10-12 Cbrite, Inc. Metal oxide TFT with improved carrier mobility
TWI875442B (zh) * 2008-07-31 2025-03-01 日商半導體能源研究所股份有限公司 半導體裝置及半導體裝置的製造方法
US9000441B2 (en) * 2008-08-05 2015-04-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device
US8030718B2 (en) * 2008-09-12 2011-10-04 Taiwan Semiconductor Manufacturing Company, Ltd. Local charge and work function engineering on MOSFET
JP2010073880A (ja) * 2008-09-18 2010-04-02 Fujifilm Corp 薄膜電界効果型トランジスタ及びその製造方法
WO2010035627A1 (en) * 2008-09-25 2010-04-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2010035625A1 (en) * 2008-09-25 2010-04-01 Semiconductor Energy Laboratory Co., Ltd. Semi conductor device
JP5552753B2 (ja) * 2008-10-08 2014-07-16 ソニー株式会社 薄膜トランジスタおよび表示装置
JP5430113B2 (ja) * 2008-10-08 2014-02-26 キヤノン株式会社 電界効果型トランジスタ及びその製造方法
JP5595003B2 (ja) * 2008-10-23 2014-09-24 株式会社半導体エネルギー研究所 表示装置
CN102509736B (zh) * 2008-10-24 2015-08-19 株式会社半导体能源研究所 半导体器件和用于制造该半导体器件的方法
KR101634411B1 (ko) * 2008-10-31 2016-06-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 구동 회로, 표시 장치 및 전자 장치
KR20130138352A (ko) * 2008-11-07 2013-12-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
EP2184783B1 (en) * 2008-11-07 2012-10-03 Semiconductor Energy Laboratory Co, Ltd. Semiconductor device and method for manufacturing the same
KR101432764B1 (ko) * 2008-11-13 2014-08-21 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치의 제조방법
JP5489449B2 (ja) * 2008-12-10 2014-05-14 株式会社東芝 不揮発性半導体記憶装置及びその製造方法
US8247812B2 (en) * 2009-02-13 2012-08-21 Semiconductor Energy Laboratory Co., Ltd. Transistor, semiconductor device including the transistor, and manufacturing method of the transistor and the semiconductor device
KR102195170B1 (ko) * 2009-03-12 2020-12-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
EP2533293A4 (en) * 2010-02-01 2016-12-07 Nec Corp AMORPHIC OXID THIN LAYER, THIN FILM TRANSISTOR THEREWITH, AND METHOD FOR PRODUCING THE THIN-LAYER TRANSISTOR

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013109071A1 (ko) * 2012-01-20 2013-07-25 경희대학교 산학협력단 산화물 반도체 박막 트랜지스터 제조방법 및 이를 이용한 능동구동 디스플레이 장치, 능동구동 센서장치
KR101308809B1 (ko) * 2012-01-20 2013-09-13 경희대학교 산학협력단 산화물 반도체 박막 트랜지스터 제조방법 및 이를 이용한 능동구동 디스플레이 장치, 능동구동 센서장치

Also Published As

Publication number Publication date
TW202021135A (zh) 2020-06-01
US20120001179A1 (en) 2012-01-05
JP5856395B2 (ja) 2016-02-09
TWI600156B (zh) 2017-09-21
TW202218167A (zh) 2022-05-01
JP6818918B2 (ja) 2021-01-27
JP2019071485A (ja) 2019-05-09
TW202107716A (zh) 2021-02-16
KR20190003856A (ko) 2019-01-09
JP2012238826A (ja) 2012-12-06
JP7013559B2 (ja) 2022-01-31
JP2022044686A (ja) 2022-03-17
JP2018029196A (ja) 2018-02-22
JP2020107889A (ja) 2020-07-09
JP6657440B2 (ja) 2020-03-04
TWI772241B (zh) 2022-07-21
TWI713226B (zh) 2020-12-11
TW201703263A (zh) 2017-01-16
JP2021061433A (ja) 2021-04-15
TWI763085B (zh) 2022-05-01
TW201216471A (en) 2012-04-16
US20220123150A1 (en) 2022-04-21
JP6479921B2 (ja) 2019-03-06
TWI684279B (zh) 2020-02-01
JP2016086179A (ja) 2016-05-19

Similar Documents

Publication Publication Date Title
KR102011259B1 (ko) 반도체 장치
TWI539527B (zh) 半導體裝置的製造方法
TWI541904B (zh) 半導體裝置的製造方法
TWI573272B (zh) 半導體裝置
KR102128972B1 (ko) 반도체 장치 및 반도체 장치의 제작 방법
TWI557806B (zh) 半導體裝置及半導體裝置的製造方法
TWI521612B (zh) 半導體裝置的製造方法
TWI527222B (zh) 半導體裝置及其製造方法
TWI575752B (zh) 電晶體的製造方法
TWI557908B (zh) 半導體裝置的製造方法
JP7013559B2 (ja) 半導体装置
KR101971289B1 (ko) 반도체 장치의 제작 방법
KR20130030296A (ko) 반도체 장치
KR20130114078A (ko) 반도체 장치
TW201401514A (zh) 半導體裝置
TWI534904B (zh) 半導體裝置的製造方法

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20110630

PG1501 Laying open of application
A201 Request for examination
AMND Amendment
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20160622

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 20110630

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20180129

Patent event code: PE09021S01D

AMND Amendment
E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20180720

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20180129

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

AMND Amendment
PX0901 Re-examination

Patent event code: PX09011S01I

Patent event date: 20180720

Comment text: Decision to Refuse Application

Patent event code: PX09012R01I

Patent event date: 20180328

Comment text: Amendment to Specification, etc.

Patent event code: PX09012R01I

Patent event date: 20160622

Comment text: Amendment to Specification, etc.

PX0601 Decision of rejection after re-examination

Comment text: Decision to Refuse Application

Patent event code: PX06014S01D

Patent event date: 20181008

Comment text: Amendment to Specification, etc.

Patent event code: PX06012R01I

Patent event date: 20180912

Comment text: Decision to Refuse Application

Patent event code: PX06011S01I

Patent event date: 20180720

Comment text: Amendment to Specification, etc.

Patent event code: PX06012R01I

Patent event date: 20180328

Comment text: Notification of reason for refusal

Patent event code: PX06013S01I

Patent event date: 20180129

Comment text: Amendment to Specification, etc.

Patent event code: PX06012R01I

Patent event date: 20160622

A107 Divisional application of patent
J201 Request for trial against refusal decision
PA0107 Divisional application

Comment text: Divisional Application of Patent

Patent event date: 20190104

Patent event code: PA01071R01D

PJ0201 Trial against decision of rejection

Patent event date: 20190104

Comment text: Request for Trial against Decision on Refusal

Patent event code: PJ02012R01D

Patent event date: 20181008

Comment text: Decision to Refuse Application

Patent event code: PJ02011S01I

Patent event date: 20180720

Comment text: Decision to Refuse Application

Patent event code: PJ02011S01I

Appeal kind category: Appeal against decision to decline refusal

Appeal identifier: 2019101000028

Request date: 20190104

J301 Trial decision

Free format text: TRIAL NUMBER: 2019101000028; TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20190104

Effective date: 20191028

PJ1301 Trial decision

Patent event code: PJ13011S01D

Patent event date: 20191028

Comment text: Trial Decision on Objection to Decision on Refusal

Appeal kind category: Appeal against decision to decline refusal

Request date: 20190104

Decision date: 20191028

Appeal identifier: 2019101000028