TWI588513B - 梯度聚合物結構及方法 - Google Patents
梯度聚合物結構及方法 Download PDFInfo
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
- C08L2205/18—Spheres
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0362—Manufacture or treatment of packages of encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
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- Chemical & Material Sciences (AREA)
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| US201261596959P | 2012-02-09 | 2012-02-09 |
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| TW201344232A TW201344232A (zh) | 2013-11-01 |
| TWI588513B true TWI588513B (zh) | 2017-06-21 |
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| TW102105170A TWI588513B (zh) | 2012-02-09 | 2013-02-08 | 梯度聚合物結構及方法 |
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| EP (1) | EP2812738B1 (OSRAM) |
| JP (1) | JP6358960B2 (OSRAM) |
| KR (1) | KR102001403B1 (OSRAM) |
| CN (1) | CN104220902B (OSRAM) |
| TW (1) | TWI588513B (OSRAM) |
| WO (1) | WO2013119796A1 (OSRAM) |
Families Citing this family (18)
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| JP6358960B2 (ja) | 2012-02-09 | 2018-07-18 | ダウ シリコーンズ コーポレーション | 勾配ポリマー構造及び方法 |
| JP6387355B2 (ja) | 2012-12-21 | 2018-09-05 | ダウ シリコーンズ コーポレーション | 層状ポリマー構造及び方法 |
| KR20150132380A (ko) * | 2013-03-15 | 2015-11-25 | 다우 코닝 코포레이션 | 수지-선형 유기실록산 블록 공중합체의 조성물 |
| US20160032148A1 (en) * | 2013-03-15 | 2016-02-04 | Dow Corning Corporation | A method for making an optical assembly comprising depositing a solid silicone-containing hot melt composition in powder form and forming an encapsulant thereof |
| WO2014197617A1 (en) * | 2013-06-05 | 2014-12-11 | Dow Corning Corporation | Compositions of resin-linear organosiloxane block copolymers |
| CN105705599B (zh) | 2013-09-18 | 2018-10-23 | 美国陶氏有机硅公司 | 树脂-线性有机硅氧烷嵌段共聚物的组合物 |
| EP3161881A4 (en) * | 2014-06-25 | 2018-02-21 | Dow Corning Corporation | Layered polymer structures and methods |
| US9930750B2 (en) * | 2014-08-20 | 2018-03-27 | Lumens Co., Ltd. | Method for manufacturing light-emitting device packages, light-emitting device package strip, and light-emitting device package |
| KR20170058999A (ko) * | 2014-09-23 | 2017-05-29 | 다우 코닝 코포레이션 | 접착제 조성물 및 이의 용도 |
| FR3038710B1 (fr) * | 2015-07-10 | 2021-05-28 | Cpc Tech | Capteur d'une caracteristique physique, comportant de preference une structure multicouches |
| KR20180050418A (ko) * | 2015-09-30 | 2018-05-14 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 유리-유사 층을 포함하는 복합 구조체 및 형성 방법 |
| DE102016114921A1 (de) * | 2016-08-11 | 2018-02-15 | Osram Opto Semiconductors Gmbh | Silikonzusammensetzung |
| US10940105B2 (en) * | 2016-10-04 | 2021-03-09 | Dow Silicones Corporation | Resin-linear organopolysiloxane block copolymer, use of same, and method for producing same |
| EP3658639A1 (en) | 2017-07-27 | 2020-06-03 | Dow Silicones Corporation | Hydrosilylation curable polysiloxane |
| JP6562044B2 (ja) * | 2017-07-28 | 2019-08-21 | セイコーエプソン株式会社 | 電気光学装置、電子機器、及び電気光学装置の製造方法 |
| WO2019091328A1 (zh) * | 2017-11-08 | 2019-05-16 | 厦门市三安光电科技有限公司 | 一种紫外led封装结构 |
| WO2025170712A1 (en) | 2024-02-07 | 2025-08-14 | Dow Silicones Corporation | Epoxy-functional resin-linear polyorganosiloxane copolymer, composition containing the copolymer, and methods for their preparation and use |
| WO2025178717A1 (en) | 2024-02-20 | 2025-08-28 | Dow Silicones Corporation | Alkenyl ester – functional resin – linear polyorganosiloxane block copolymer, composition containing the copolymer, and methods for their preparation and use |
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- 2013-02-07 KR KR1020147025160A patent/KR102001403B1/ko not_active Expired - Fee Related
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2013119796A1 (en) | 2013-08-15 |
| KR20140125843A (ko) | 2014-10-29 |
| US20150207047A1 (en) | 2015-07-23 |
| EP2812738A1 (en) | 2014-12-17 |
| CN104220902B (zh) | 2018-06-26 |
| JP6358960B2 (ja) | 2018-07-18 |
| JP2015511332A (ja) | 2015-04-16 |
| US9705056B2 (en) | 2017-07-11 |
| EP2812738B1 (en) | 2016-10-12 |
| TW201344232A (zh) | 2013-11-01 |
| KR102001403B1 (ko) | 2019-07-18 |
| CN104220902A (zh) | 2014-12-17 |
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