TWI585222B - Film forming device - Google Patents

Film forming device Download PDF

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Publication number
TWI585222B
TWI585222B TW100134788A TW100134788A TWI585222B TW I585222 B TWI585222 B TW I585222B TW 100134788 A TW100134788 A TW 100134788A TW 100134788 A TW100134788 A TW 100134788A TW I585222 B TWI585222 B TW I585222B
Authority
TW
Taiwan
Prior art keywords
base portion
vacuum chamber
mask
calibration
upper side
Prior art date
Application number
TW100134788A
Other languages
English (en)
Chinese (zh)
Other versions
TW201229260A (en
Inventor
Miyuki Tajima
Keiji Uchida
Takashi Shibuya
Teiji Takahashi
Masanao Fujitsuka
Original Assignee
Tokki Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokki Kk filed Critical Tokki Kk
Publication of TW201229260A publication Critical patent/TW201229260A/zh
Application granted granted Critical
Publication of TWI585222B publication Critical patent/TWI585222B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
TW100134788A 2010-09-30 2011-09-27 Film forming device TWI585222B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010220263A JP5639431B2 (ja) 2010-09-30 2010-09-30 成膜装置

Publications (2)

Publication Number Publication Date
TW201229260A TW201229260A (en) 2012-07-16
TWI585222B true TWI585222B (zh) 2017-06-01

Family

ID=45892623

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100134788A TWI585222B (zh) 2010-09-30 2011-09-27 Film forming device

Country Status (5)

Country Link
JP (1) JP5639431B2 (ja)
KR (1) KR101846982B1 (ja)
CN (1) CN103154304B (ja)
TW (1) TWI585222B (ja)
WO (1) WO2012043150A1 (ja)

Families Citing this family (31)

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JP2014015633A (ja) * 2012-07-05 2014-01-30 Sumitomo Heavy Ind Ltd 成膜装置、及び成膜装置用搬送トレイ
JP2014077170A (ja) * 2012-10-10 2014-05-01 Sumitomo Heavy Ind Ltd 成膜装置
CN103132016B (zh) * 2013-02-22 2015-05-13 京东方科技集团股份有限公司 一种膜边调整器
CN104018117A (zh) * 2013-03-01 2014-09-03 昆山允升吉光电科技有限公司 一种掩模框架及其对应的掩模组件
JP2014177683A (ja) * 2013-03-15 2014-09-25 Sumitomo Heavy Ind Ltd 基板搬送トレイ、及び成膜装置
JP6250999B2 (ja) * 2013-09-27 2017-12-20 キヤノントッキ株式会社 アライメント方法並びにアライメント装置
CN107002219B (zh) * 2014-12-10 2021-09-03 应用材料公司 掩模布置、在基板上沉积层的设备和对准掩模布置的方法
CN104404466A (zh) 2014-12-26 2015-03-11 合肥京东方光电科技有限公司 磁控溅射镀膜方法及系统
WO2016112951A1 (en) * 2015-01-12 2016-07-21 Applied Materials, Inc. Holding arrangement for supporting a substrate carrier and a mask carrier during layer deposition in a processing chamber, apparatus for depositing a layer on a substrate, and method for aligning a substrate carrier supporting a substrate and a mask carrier
TWI576302B (zh) * 2015-05-28 2017-04-01 友達光電股份有限公司 板體分離設備及板體分離方法
KR101965370B1 (ko) * 2016-05-18 2019-04-03 어플라이드 머티어리얼스, 인코포레이티드 캐리어 또는 기판의 운송을 위한 장치 및 방법
KR20180056990A (ko) * 2016-11-21 2018-05-30 한국알박(주) 막 증착 장치 및 방법
KR102359244B1 (ko) * 2016-11-21 2022-02-08 한국알박(주) 막 증착 방법
KR20180056989A (ko) * 2016-11-21 2018-05-30 한국알박(주) 막 증착 장치 및 방법
US20190368024A1 (en) * 2017-02-24 2019-12-05 Applied Materials, Inc. Positioning arrangement for a substrate carrier and a mask carrier, transportation system for a substrate carrier and a mask carrier, and methods therefor
KR102111722B1 (ko) * 2017-03-17 2020-05-15 어플라이드 머티어리얼스, 인코포레이티드 기판의 진공 프로세싱을 위한 장치, 기판의 진공 프로세싱을 위한 시스템, 및 진공 챔버 내에서의 기판 캐리어 및 마스크 캐리어의 이송을 위한 방법
EP3394881A1 (en) * 2017-03-17 2018-10-31 Applied Materials, Inc. Methods of handling a mask device in a vacuum system, mask handling apparatus, and vacuum system
CN106987798B (zh) * 2017-04-17 2020-02-11 京东方科技集团股份有限公司 一种镀膜装置
CN109642309B (zh) * 2017-05-17 2021-08-17 埃马金公司 高精准度蔽荫掩模沉积系统及其方法
WO2019004359A1 (ja) * 2017-06-29 2019-01-03 株式会社アルバック 成膜装置
CN109429499A (zh) * 2017-06-30 2019-03-05 株式会社爱发科 成膜装置、掩模框架及对准方法
WO2019070031A1 (ja) * 2017-10-05 2019-04-11 株式会社アルバック スパッタリング装置
JP6662840B2 (ja) * 2017-12-11 2020-03-11 株式会社アルバック 蒸着装置
JP6662841B2 (ja) * 2017-12-21 2020-03-11 株式会社アルバック 蒸着装置
WO2019192676A1 (en) * 2018-04-03 2019-10-10 Applied Materials, Inc. Arrangement for clamping a carrier to a device
JP2020518122A (ja) * 2018-04-03 2020-06-18 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 真空チャンバ内でキャリアを操作するための装置、真空堆積システム、および真空チャンバ内でキャリアを操作する方法
WO2019192678A1 (en) * 2018-04-03 2019-10-10 Applied Materials, Inc. Apparatus and vacuum system for carrier alignment in a vacuum chamber, and method of aligning a carrier
WO2020030252A1 (en) * 2018-08-07 2020-02-13 Applied Materials, Inc. Material deposition apparatus, vacuum deposition system and method of processing a large area substrate
JP7222073B2 (ja) * 2018-08-29 2023-02-14 アプライド マテリアルズ インコーポレイテッド 第１のキャリア及び第２のキャリアを搬送するための装置、基板を垂直に処理するための処理システム、及びそれらの方法
KR20230155654A (ko) * 2022-05-03 2023-11-13 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법
KR20230155655A (ko) * 2022-05-03 2023-11-13 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법

Citations (1)

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Publication number Priority date Publication date Assignee Title
CN101783397A (zh) * 2008-12-15 2010-07-21 株式会社日立高新技术 有机el器件制造装置、成膜装置及其成膜方法、液晶显示基板制造、定位装置及定位方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3789857B2 (ja) * 2002-06-25 2006-06-28 トッキ株式会社 蒸着装置
JP4463492B2 (ja) * 2003-04-10 2010-05-19 株式会社半導体エネルギー研究所 製造装置
JP4596794B2 (ja) * 2004-02-27 2010-12-15 日立造船株式会社 真空蒸着用アライメント装置
JP4609756B2 (ja) 2005-02-23 2011-01-12 三井造船株式会社 成膜装置のマスク位置合わせ機構および成膜装置
WO2007023552A1 (ja) * 2005-08-25 2007-03-01 Hitachi Zosen Corporation 真空蒸着用アライメント装置
JP5074368B2 (ja) * 2008-12-15 2012-11-14 株式会社日立ハイテクノロジーズ 成膜装置
JP2011096393A (ja) * 2009-10-27 2011-05-12 Hitachi High-Technologies Corp 有機ｅｌデバイス製造装置及びその製造方法並びに成膜装置及び成膜方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101783397A (zh) * 2008-12-15 2010-07-21 株式会社日立高新技术 有机el器件制造装置、成膜装置及其成膜方法、液晶显示基板制造、定位装置及定位方法

Also Published As

Publication number Publication date
JP5639431B2 (ja) 2014-12-10
CN103154304A (zh) 2013-06-12
KR20130139867A (ko) 2013-12-23
WO2012043150A1 (ja) 2012-04-05
KR101846982B1 (ko) 2018-04-10
TW201229260A (en) 2012-07-16
CN103154304B (zh) 2015-06-03
JP2012072478A (ja) 2012-04-12

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