TWI584426B - A baking treatment system, and an organic EL film of an organic EL element - Google Patents

A baking treatment system, and an organic EL film of an organic EL element Download PDF

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Publication number
TWI584426B
TWI584426B TW102126466A TW102126466A TWI584426B TW I584426 B TWI584426 B TW I584426B TW 102126466 A TW102126466 A TW 102126466A TW 102126466 A TW102126466 A TW 102126466A TW I584426 B TWI584426 B TW I584426B
Authority
TW
Taiwan
Prior art keywords
substrate
baking
cooling
cooling plate
vacuum drying
Prior art date
Application number
TW102126466A
Other languages
English (en)
Chinese (zh)
Other versions
TW201419467A (zh
Inventor
Masaki Narushima
Teruyuki Hayashi
Fumio Shimo
Kenjiro Koizumi
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201419467A publication Critical patent/TW201419467A/zh
Application granted granted Critical
Publication of TWI584426B publication Critical patent/TWI584426B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
TW102126466A 2012-07-25 2013-07-24 A baking treatment system, and an organic EL film of an organic EL element TWI584426B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012164541A JP6181358B2 (ja) 2012-07-25 2012-07-25 ベーク処理システム及び有機ｅｌ素子の有機機能膜の積層体の製造方法

Publications (2)

Publication Number Publication Date
TW201419467A TW201419467A (zh) 2014-05-16
TWI584426B true TWI584426B (zh) 2017-05-21

Family

ID=49997011

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102126466A TWI584426B (zh) 2012-07-25 2013-07-24 A baking treatment system, and an organic EL film of an organic EL element

Country Status (5)

Country Link
JP (1) JP6181358B2 (ja)
KR (1) KR101663005B1 (ja)
CN (2) CN106206378B (ja)
TW (1) TWI584426B (ja)
WO (1) WO2014017194A1 (ja)

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EP3087623B1 (en) 2013-12-26 2021-09-22 Kateeva, Inc. Thermal treatment of electronic devices
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JP6189780B2 (ja) * 2014-04-01 2017-08-30 東京エレクトロン株式会社 基板処理システム
JP6189781B2 (ja) * 2014-04-01 2017-08-30 東京エレクトロン株式会社 熱処理装置、熱処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム
US20170162831A1 (en) * 2014-04-22 2017-06-08 Joled Inc. Method for manufacturing organic el display panel and system for manufacturing organic el display panel
US9586226B2 (en) 2014-04-30 2017-03-07 Kateeva, Inc. Gas cushion apparatus and techniques for substrate coating
JP6639175B2 (ja) * 2015-09-29 2020-02-05 東京エレクトロン株式会社 乾燥装置及び乾燥処理方法
EP3377234A4 (en) * 2015-11-16 2019-08-07 Kateeva, Inc. SYSTEMS AND METHOD FOR THE THERMAL PROCESSING OF A SUBSTRATE
KR102525361B1 (ko) 2016-04-27 2023-04-25 삼성디스플레이 주식회사 감압 건조 장치 및 이를 이용한 막 제조 방법
JP6675931B2 (ja) * 2016-05-23 2020-04-08 東京エレクトロン株式会社 基板処理システム、基板処理方法及び正孔注入層形成装置
JP6918461B2 (ja) * 2016-09-23 2021-08-11 東京エレクトロン株式会社 減圧乾燥システム、および減圧乾燥方法
US10861731B2 (en) * 2017-01-19 2020-12-08 Axcelis Technologies, Inc. Radiant heating presoak
KR102041318B1 (ko) * 2017-10-17 2019-11-06 세메스 주식회사 기판 처리 방법 및 장치
CN109166966A (zh) * 2018-08-10 2019-01-08 深圳市华星光电半导体显示技术有限公司 一种显示器件的制备方法及有机发光显示器件
CN111384310A (zh) * 2018-12-29 2020-07-07 广东聚华印刷显示技术有限公司 有机薄膜的成膜方法及其应用
TWI755659B (zh) * 2019-12-09 2022-02-21 天虹科技股份有限公司 降低氮化鋁的表面氧化物生成的方法與設備
JP6878557B2 (ja) * 2019-12-24 2021-05-26 東京エレクトロン株式会社 乾燥装置及び乾燥処理方法

Citations (1)

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Also Published As

Publication number Publication date
WO2014017194A1 (ja) 2014-01-30
TW201419467A (zh) 2014-05-16
CN104488358B (zh) 2016-08-17
CN104488358A (zh) 2015-04-01
KR101663005B1 (ko) 2016-10-06
CN106206378B (zh) 2020-12-01
CN106206378A (zh) 2016-12-07
JP2014026764A (ja) 2014-02-06
JP6181358B2 (ja) 2017-08-16
KR20150038252A (ko) 2015-04-08

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