TWI581687B - Method for manufacturing multi - layer flexible patch panel - Google Patents
Method for manufacturing multi - layer flexible patch panel Download PDFInfo
- Publication number
- TWI581687B TWI581687B TW102108249A TW102108249A TWI581687B TW I581687 B TWI581687 B TW I581687B TW 102108249 A TW102108249 A TW 102108249A TW 102108249 A TW102108249 A TW 102108249A TW I581687 B TWI581687 B TW I581687B
- Authority
- TW
- Taiwan
- Prior art keywords
- pattern
- layer
- circuit pattern
- layer circuit
- wiring board
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 238000000034 method Methods 0.000 title description 19
- 239000010410 layer Substances 0.000 claims description 124
- 239000000758 substrate Substances 0.000 claims description 85
- 238000007747 plating Methods 0.000 claims description 44
- 238000005530 etching Methods 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 20
- 239000011229 interlayer Substances 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 29
- 239000011889 copper foil Substances 0.000 description 15
- 239000000853 adhesive Substances 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 14
- 239000010949 copper Substances 0.000 description 14
- 239000007787 solid Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- -1 polyamidoximine Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001955 polyphenylene ether Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007849 furan resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000006188 syrup Substances 0.000 description 1
- 235000020357 syrup Nutrition 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012053398A JP5933996B2 (ja) | 2012-03-09 | 2012-03-09 | 多層フレキシブル配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201343037A TW201343037A (zh) | 2013-10-16 |
| TWI581687B true TWI581687B (zh) | 2017-05-01 |
Family
ID=49138178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102108249A TWI581687B (zh) | 2012-03-09 | 2013-03-08 | Method for manufacturing multi - layer flexible patch panel |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5933996B2 (enExample) |
| CN (1) | CN103313533B (enExample) |
| TW (1) | TWI581687B (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110545636B (zh) * | 2018-05-29 | 2022-02-22 | 鹏鼎控股(深圳)股份有限公司 | 电路板及其制作方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200838375A (en) * | 2006-12-04 | 2008-09-16 | Ngk Spark Plug Co | Laminated substrate and the producing method thereof |
| TW200950635A (en) * | 2008-05-08 | 2009-12-01 | Sony Chem & Inf Device Corp | Flex-rigid wiring board and method for manufacturing the same |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5267487B2 (ja) * | 2010-03-10 | 2013-08-21 | 住友電気工業株式会社 | プリント配線板用基板、プリント配線板用基板の製造方法 |
| CN102804935A (zh) * | 2009-06-03 | 2012-11-28 | 夏普株式会社 | 电路基板、电路基板的连接结构和显示面板组装体 |
-
2012
- 2012-03-09 JP JP2012053398A patent/JP5933996B2/ja active Active
-
2013
- 2013-03-08 TW TW102108249A patent/TWI581687B/zh active
- 2013-03-08 CN CN201310073854.8A patent/CN103313533B/zh active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200838375A (en) * | 2006-12-04 | 2008-09-16 | Ngk Spark Plug Co | Laminated substrate and the producing method thereof |
| TW200950635A (en) * | 2008-05-08 | 2009-12-01 | Sony Chem & Inf Device Corp | Flex-rigid wiring board and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013187486A (ja) | 2013-09-19 |
| JP5933996B2 (ja) | 2016-06-15 |
| TW201343037A (zh) | 2013-10-16 |
| CN103313533B (zh) | 2017-05-31 |
| CN103313533A (zh) | 2013-09-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4646968B2 (ja) | 回路転写用キャリア部材の製造方法 | |
| US7459202B2 (en) | Printed circuit board | |
| US8238114B2 (en) | Printed wiring board and method for manufacturing same | |
| JP5226055B2 (ja) | 多層硬軟性印刷回路基板及びその製造方法 | |
| TWI479973B (zh) | 多層配線基板之製造方法 | |
| US9860978B1 (en) | Rigid-flex board structure | |
| JP2009088464A (ja) | 基板製造方法 | |
| JP3993211B2 (ja) | 多層プリント配線板およびその製造方法 | |
| US20100147559A1 (en) | Carrier used in the manufacture of substrate and method of manufacturing substrate using the carrier | |
| TWI459879B (zh) | Method for manufacturing multilayer flexible printed wiring board | |
| JP4460013B2 (ja) | 配線基板の製造方法 | |
| JP2006229115A (ja) | 配線基板製造用金属部材と、それを用いた配線基板の製造方法 | |
| KR20070021631A (ko) | 다층 인쇄 회로 기판 및 그 제조 방법 | |
| JP2010016335A (ja) | 金属積層板及びその製造方法 | |
| TWI581687B (zh) | Method for manufacturing multi - layer flexible patch panel | |
| TWI384923B (zh) | A multilayer circuit board having a wiring portion, and a method of manufacturing the same | |
| CN106328625A (zh) | 封装基板及其制作方法 | |
| JP5302927B2 (ja) | 多層配線基板の製造方法 | |
| KR20130039749A (ko) | 알루미늄 재질의 캐리어층을 갖는 동박 적층판 제조용 동박 필름의 제조방법 | |
| CN103002677B (zh) | 线路板及其制作方法 | |
| US20160073505A1 (en) | Manufacturing method of multilayer flexible circuit structure | |
| JP3712105B2 (ja) | フレキシブルビルドアップ多層プリント配線板の製造方法 | |
| TWI517775B (zh) | 印刷電路板及其製法 | |
| JP4304117B2 (ja) | 多層回路基板およびその製造方法 | |
| JP2012209322A (ja) | 配線基板の製造方法 |