CN103313533B - 多层柔性配线板的制造方法 - Google Patents

多层柔性配线板的制造方法 Download PDF

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Publication number
CN103313533B
CN103313533B CN201310073854.8A CN201310073854A CN103313533B CN 103313533 B CN103313533 B CN 103313533B CN 201310073854 A CN201310073854 A CN 201310073854A CN 103313533 B CN103313533 B CN 103313533B
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pattern
layer
cable
coating
circuit pattern
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CN103313533A (zh
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川添想
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Meikeda Co ltd
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Nippon Mektron KK
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  • Production Of Multi-Layered Print Wiring Board (AREA)
CN201310073854.8A 2012-03-09 2013-03-08 多层柔性配线板的制造方法 Active CN103313533B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-053398 2012-03-09
JP2012053398A JP5933996B2 (ja) 2012-03-09 2012-03-09 多層フレキシブル配線板の製造方法

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CN103313533A CN103313533A (zh) 2013-09-18
CN103313533B true CN103313533B (zh) 2017-05-31

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JP (1) JP5933996B2 (enExample)
CN (1) CN103313533B (enExample)
TW (1) TWI581687B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110545636B (zh) * 2018-05-29 2022-02-22 鹏鼎控股(深圳)股份有限公司 电路板及其制作方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008166741A (ja) * 2006-12-04 2008-07-17 Ngk Spark Plug Co Ltd 積層基板及びその製造方法
CN101999257A (zh) * 2008-05-08 2011-03-30 新力化工与资讯产品股份有限公司 刚柔结合电路板及其制造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5267487B2 (ja) * 2010-03-10 2013-08-21 住友電気工業株式会社 プリント配線板用基板、プリント配線板用基板の製造方法
CN102804935A (zh) * 2009-06-03 2012-11-28 夏普株式会社 电路基板、电路基板的连接结构和显示面板组装体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008166741A (ja) * 2006-12-04 2008-07-17 Ngk Spark Plug Co Ltd 積層基板及びその製造方法
CN101999257A (zh) * 2008-05-08 2011-03-30 新力化工与资讯产品股份有限公司 刚柔结合电路板及其制造方法

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JP2013187486A (ja) 2013-09-19
JP5933996B2 (ja) 2016-06-15
TWI581687B (zh) 2017-05-01
TW201343037A (zh) 2013-10-16
CN103313533A (zh) 2013-09-18

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Address after: Tokyo, Japan, the port district, Zhi Zhi, Ding Ding, No. 12, No. 15

Patentee after: Meikeda Co.,Ltd.

Country or region after: Japan

Address before: Tokyo, Japan, the port district, Zhi Zhi, Ding Ding, No. 12, No. 15

Patentee before: NIPPON MEKTRON, Ltd.

Country or region before: Japan