JP5933996B2 - 多層フレキシブル配線板の製造方法 - Google Patents

多層フレキシブル配線板の製造方法 Download PDF

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Publication number
JP5933996B2
JP5933996B2 JP2012053398A JP2012053398A JP5933996B2 JP 5933996 B2 JP5933996 B2 JP 5933996B2 JP 2012053398 A JP2012053398 A JP 2012053398A JP 2012053398 A JP2012053398 A JP 2012053398A JP 5933996 B2 JP5933996 B2 JP 5933996B2
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pattern
outer layer
wiring board
circuit pattern
flexible wiring
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JP2012053398A
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Japanese (ja)
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JP2013187486A (ja
JP2013187486A5 (enExample
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想 川添
想 川添
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Nippon Mektron KK
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Nippon Mektron KK
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Priority to JP2012053398A priority Critical patent/JP5933996B2/ja
Priority to CN201310073854.8A priority patent/CN103313533B/zh
Priority to TW102108249A priority patent/TWI581687B/zh
Publication of JP2013187486A publication Critical patent/JP2013187486A/ja
Publication of JP2013187486A5 publication Critical patent/JP2013187486A5/ja
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JP2012053398A 2012-03-09 2012-03-09 多層フレキシブル配線板の製造方法 Active JP5933996B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012053398A JP5933996B2 (ja) 2012-03-09 2012-03-09 多層フレキシブル配線板の製造方法
CN201310073854.8A CN103313533B (zh) 2012-03-09 2013-03-08 多层柔性配线板的制造方法
TW102108249A TWI581687B (zh) 2012-03-09 2013-03-08 Method for manufacturing multi - layer flexible patch panel

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JP2012053398A JP5933996B2 (ja) 2012-03-09 2012-03-09 多層フレキシブル配線板の製造方法

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JP2013187486A JP2013187486A (ja) 2013-09-19
JP2013187486A5 JP2013187486A5 (enExample) 2015-04-23
JP5933996B2 true JP5933996B2 (ja) 2016-06-15

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CN (1) CN103313533B (enExample)
TW (1) TWI581687B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110545636B (zh) * 2018-05-29 2022-02-22 鹏鼎控股(深圳)股份有限公司 电路板及其制作方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4431170B2 (ja) * 2006-12-04 2010-03-10 日本特殊陶業株式会社 積層基板及びその製造方法
JP2009272444A (ja) * 2008-05-08 2009-11-19 Sony Chemical & Information Device Corp フレックスリジッド配線基板とその製造方法
JP5267487B2 (ja) * 2010-03-10 2013-08-21 住友電気工業株式会社 プリント配線板用基板、プリント配線板用基板の製造方法
CN102804935A (zh) * 2009-06-03 2012-11-28 夏普株式会社 电路基板、电路基板的连接结构和显示面板组装体

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JP2013187486A (ja) 2013-09-19
TWI581687B (zh) 2017-05-01
TW201343037A (zh) 2013-10-16
CN103313533B (zh) 2017-05-31
CN103313533A (zh) 2013-09-18

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