TWI581060B - A photosensitive resin composition and a cured product thereof, and a hardened product thereof, a printed circuit board having a solder resist layer - Google Patents

A photosensitive resin composition and a cured product thereof, and a hardened product thereof, a printed circuit board having a solder resist layer Download PDF

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Publication number
TWI581060B
TWI581060B TW103122640A TW103122640A TWI581060B TW I581060 B TWI581060 B TW I581060B TW 103122640 A TW103122640 A TW 103122640A TW 103122640 A TW103122640 A TW 103122640A TW I581060 B TWI581060 B TW I581060B
Authority
TW
Taiwan
Prior art keywords
photosensitive resin
coloring agent
pigment
resin composition
manufactured
Prior art date
Application number
TW103122640A
Other languages
English (en)
Chinese (zh)
Other versions
TW201439677A (zh
Inventor
Yoko Shibasaki
Masao Arima
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Publication of TW201439677A publication Critical patent/TW201439677A/zh
Application granted granted Critical
Publication of TWI581060B publication Critical patent/TWI581060B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW103122640A 2008-03-26 2009-03-25 A photosensitive resin composition and a cured product thereof, and a hardened product thereof, a printed circuit board having a solder resist layer TWI581060B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008081099 2008-03-26
JP2008261985A JP5352175B2 (ja) 2008-03-26 2008-10-08 感光性樹脂組成物及びその硬化物、並びにその硬化物からなるソルダーレジスト層を有するプリント配線基板

Publications (2)

Publication Number Publication Date
TW201439677A TW201439677A (zh) 2014-10-16
TWI581060B true TWI581060B (zh) 2017-05-01

Family

ID=41193320

Family Applications (2)

Application Number Title Priority Date Filing Date
TW103122640A TWI581060B (zh) 2008-03-26 2009-03-25 A photosensitive resin composition and a cured product thereof, and a hardened product thereof, a printed circuit board having a solder resist layer
TW098109741A TWI522735B (zh) 2008-03-26 2009-03-25 A photosensitive resin composition and a cured product thereof, and a hardened product thereof, a printed circuit board having a solder resist layer

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW098109741A TWI522735B (zh) 2008-03-26 2009-03-25 A photosensitive resin composition and a cured product thereof, and a hardened product thereof, a printed circuit board having a solder resist layer

Country Status (4)

Country Link
JP (2) JP5352175B2 (ja)
KR (1) KR101442393B1 (ja)
CN (1) CN101546123B (ja)
TW (2) TWI581060B (ja)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5352175B2 (ja) * 2008-03-26 2013-11-27 太陽ホールディングス株式会社 感光性樹脂組成物及びその硬化物、並びにその硬化物からなるソルダーレジスト層を有するプリント配線基板
JP5306952B2 (ja) * 2009-09-29 2013-10-02 太陽ホールディングス株式会社 感光性樹脂組成物及びその硬化物、並びにプリント配線板
JP5007453B2 (ja) * 2010-06-11 2012-08-22 株式会社タムラ製作所 黒色硬化性樹脂組成物
JP5867090B2 (ja) * 2011-02-25 2016-02-24 コニカミノルタ株式会社 静電荷像現像用グリーントナー
KR20140018280A (ko) * 2011-04-13 2014-02-12 다이요 잉키 세이조 가부시키가이샤 광 경화성 수지 조성물, 드라이 필름, 경화물 및 인쇄 배선판
JP5583091B2 (ja) * 2011-08-31 2014-09-03 株式会社タムラ製作所 黒色硬化性樹脂組成物
CN103975274B (zh) * 2011-12-06 2016-10-26 株式会社钟化 黑色感光性树脂组合物及其利用
TW201423272A (zh) * 2012-11-27 2014-06-16 Jsr Corp 感光性組成物、著色劑分散液、濾光片及光感應器
KR101587360B1 (ko) * 2013-09-27 2016-01-20 다이요 잉키 세이조 가부시키가이샤 경화성 수지 조성물, 드라이 필름, 경화물 및 디스플레이 부재
KR101619614B1 (ko) 2013-09-27 2016-05-10 다이요 잉키 세이조 가부시키가이샤 경화성 수지 조성물, 드라이 필름, 경화물 및 디스플레이 부재
JP6761224B2 (ja) 2014-02-19 2020-09-23 味の素株式会社 プリント配線板、半導体装置及び樹脂シートセット
JP6383621B2 (ja) 2014-09-24 2018-08-29 太陽インキ製造株式会社 硬化性組成物、ドライフィルム、硬化物、プリント配線板およびプリント配線板の製造方法
JP6626275B2 (ja) 2014-09-30 2019-12-25 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板
WO2017078152A1 (ja) 2015-11-06 2017-05-11 株式会社カネカ 黒色樹脂組成物、黒色樹脂硬化膜付きポリイミドとその製造方法および黒色樹脂硬化膜を用いたフレキシブルプリント配線基板
CN110062972B (zh) * 2016-12-02 2022-07-01 日产化学株式会社 薄膜和储能器件电极用底涂箔
KR101992009B1 (ko) * 2017-02-03 2019-06-21 동우 화인켐 주식회사 자발광 감광성 수지 조성물, 이를 이용한 색변환층을 포함하는 컬러필터 및 화상표시장치
JP6902056B2 (ja) 2017-02-07 2021-07-14 株式会社有沢製作所 ドライフィルム、ソルダーレジストフィルム、フレキシブルプリント配線板及び画像表示装置
KR102444761B1 (ko) 2017-02-07 2022-09-20 가부시키가이샤 아리사와 세이사쿠쇼 감광성 수지 조성물, 해당 감광성 수지 조성물을 사용한 솔더 레지스트 필름, 플렉시블 프린트 배선판 및 화상 표시 장치

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JP2001324801A (ja) * 2000-03-06 2001-11-22 Goo Chemical Co Ltd ソルダーレジストインク
JP2005202196A (ja) * 2004-01-16 2005-07-28 Toyo Ink Mfg Co Ltd カラーフィルタ用赤色着色組成物およびカラーフィルタ
CN1928714A (zh) * 2005-09-05 2007-03-14 东京应化工业株式会社 黑色感光性树脂组合物
CN101128774A (zh) * 2005-02-24 2008-02-20 东京应化工业株式会社 遮光层形成用感光性树脂组合物以及遮光层及滤色片

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JP4502427B2 (ja) * 1998-12-09 2010-07-14 互応化学工業株式会社 フォトソルダーレジストインク
KR20010111360A (ko) * 2000-06-10 2001-12-17 성재갑 평판 디스플레이용 감광성 수지 조성물
JP4481445B2 (ja) * 2000-07-07 2010-06-16 サカタインクス株式会社 カラーフィルター用赤色系顔料分散物
ATE530951T1 (de) * 2001-07-26 2011-11-15 Basf Se Lichtempfindliche harzzusammensetzung
JP4245510B2 (ja) * 2004-05-10 2009-03-25 日本合成化学工業株式会社 感光性樹脂組成物及びそれを用いたフォトレジストフィルム
CN101075091B (zh) * 2006-05-18 2010-12-29 财团法人工业技术研究院 感光可溶性有机半导体材料
JP5352175B2 (ja) * 2008-03-26 2013-11-27 太陽ホールディングス株式会社 感光性樹脂組成物及びその硬化物、並びにその硬化物からなるソルダーレジスト層を有するプリント配線基板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001324801A (ja) * 2000-03-06 2001-11-22 Goo Chemical Co Ltd ソルダーレジストインク
JP2005202196A (ja) * 2004-01-16 2005-07-28 Toyo Ink Mfg Co Ltd カラーフィルタ用赤色着色組成物およびカラーフィルタ
CN101128774A (zh) * 2005-02-24 2008-02-20 东京应化工业株式会社 遮光层形成用感光性树脂组合物以及遮光层及滤色片
CN1928714A (zh) * 2005-09-05 2007-03-14 东京应化工业株式会社 黑色感光性树脂组合物

Also Published As

Publication number Publication date
KR101442393B1 (ko) 2014-09-22
TWI522735B (zh) 2016-02-21
CN101546123B (zh) 2013-02-13
TW201439677A (zh) 2014-10-16
JP5352175B2 (ja) 2013-11-27
JP5586729B2 (ja) 2014-09-10
TW201003309A (en) 2010-01-16
KR20130029794A (ko) 2013-03-25
JP2009258613A (ja) 2009-11-05
JP2013137573A (ja) 2013-07-11
CN101546123A (zh) 2009-09-30

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