TWI579121B - End effector device - Google Patents

End effector device Download PDF

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Publication number
TWI579121B
TWI579121B TW103144467A TW103144467A TWI579121B TW I579121 B TWI579121 B TW I579121B TW 103144467 A TW103144467 A TW 103144467A TW 103144467 A TW103144467 A TW 103144467A TW I579121 B TWI579121 B TW I579121B
Authority
TW
Taiwan
Prior art keywords
substrates
detector
slider
holding
semiconductor wafer
Prior art date
Application number
TW103144467A
Other languages
English (en)
Chinese (zh)
Other versions
TW201532764A (zh
Inventor
Takayuki Fukushima
Ryosuke Kanamaru
Daiki Miyagawa
Original Assignee
Kawasaki Heavy Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawasaki Heavy Ind Ltd filed Critical Kawasaki Heavy Ind Ltd
Publication of TW201532764A publication Critical patent/TW201532764A/zh
Application granted granted Critical
Publication of TWI579121B publication Critical patent/TWI579121B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/02—Sensing devices
    • B25J19/021—Optical sensing devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
TW103144467A 2013-12-26 2014-12-19 End effector device TWI579121B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013268302A JP6309756B2 (ja) 2013-12-26 2013-12-26 エンドエフェクタ装置

Publications (2)

Publication Number Publication Date
TW201532764A TW201532764A (zh) 2015-09-01
TWI579121B true TWI579121B (zh) 2017-04-21

Family

ID=53477989

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103144467A TWI579121B (zh) 2013-12-26 2014-12-19 End effector device

Country Status (7)

Country Link
US (1) US10062594B2 (de)
EP (1) EP3089204A4 (de)
JP (1) JP6309756B2 (de)
KR (1) KR101911156B1 (de)
CN (1) CN106104787B (de)
TW (1) TWI579121B (de)
WO (1) WO2015098093A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6858041B2 (ja) * 2017-03-16 2021-04-14 川崎重工業株式会社 基板搬送装置
CN108695217B (zh) * 2017-04-07 2021-06-29 台湾积体电路制造股份有限公司 衬底传送装置及其端缘作用器
JP2019067948A (ja) * 2017-10-02 2019-04-25 川崎重工業株式会社 基板搬送装置
CN109244022B (zh) * 2018-09-07 2023-10-03 宁波润华全芯微电子设备有限公司 一种机械手末端执行器
CN110426921A (zh) * 2019-07-17 2019-11-08 深圳市华星光电半导体显示技术有限公司 一种曝光机
TWI746014B (zh) * 2020-06-16 2021-11-11 大立鈺科技有限公司 晶圓存取總成及其晶圓存取裝置與晶圓載具
JP2022116807A (ja) * 2021-01-29 2022-08-10 日本電産サンキョー株式会社 産業用ロボット
CN113752284A (zh) * 2021-08-30 2021-12-07 上海广川科技有限公司 半导体机器人上多层等间距可变的晶圆搬送机械手结构
CN115148651B (zh) * 2022-08-01 2023-05-02 弥费科技(上海)股份有限公司 晶圆盒交换传输设备及其驱动装置、存储库

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11220003A (ja) * 1998-02-03 1999-08-10 Shin Meiwa Ind Co Ltd ウエハ把持装置
US6216883B1 (en) * 1998-07-24 2001-04-17 Mitsubishi Denki Kabushiki Kaisha Wafer holding hand
JP2006313865A (ja) * 2005-05-09 2006-11-16 Tatsumo Kk 基板保持装置
TW201043417A (en) * 2009-03-13 2010-12-16 Kawasaki Heavy Ind Ltd Robot having end effector and method of operating the same
TW201104779A (en) * 2009-03-19 2011-02-01 Shibaura Mechatronics Corp Substrate transfer device and substrate transfer method

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2889657B2 (ja) * 1990-05-28 1999-05-10 東京エレクトロン株式会社 板状体搬送装置
KR0155172B1 (ko) * 1990-10-31 1998-12-01 이노우에 다케시 판형상체 반송장치
US5423503A (en) * 1990-10-31 1995-06-13 Tokyo Electron Sagami Limited Plate-like member conveying apparatus
JPH05235147A (ja) 1992-02-24 1993-09-10 Dainippon Screen Mfg Co Ltd 基板移載装置
US5590996A (en) 1994-10-13 1997-01-07 Semitherm Wafer transfer apparatus
JPH11163096A (ja) 1997-11-21 1999-06-18 Kokusai Electric Co Ltd 基板移載機のピッチ可変機構
JP4096213B2 (ja) 1998-07-17 2008-06-04 株式会社安川電機 ウェハ搬送装置
JP2000091255A (ja) * 1998-07-17 2000-03-31 Asahi Glass Co Ltd ダミ―ウエハの移載方法
US6444974B1 (en) * 1998-07-17 2002-09-03 Asahi Glass Company Ltd. Method for transferring a dummy wafer
US6188323B1 (en) * 1998-10-15 2001-02-13 Asyst Technologies, Inc. Wafer mapping system
US6256555B1 (en) 1998-12-02 2001-07-03 Newport Corporation Robot arm with specimen edge gripping end effector
JP2001118909A (ja) 1999-10-21 2001-04-27 Zenkyo Kasei Kogyo Kk ピッチ変換装置
US20010048867A1 (en) * 2000-03-29 2001-12-06 Lebar Technology, Inc. Method and apparatus for processing semiconductor wafers
JP4278275B2 (ja) 2000-04-07 2009-06-10 三菱電機株式会社 配列ピッチ変換装置
JP2002076097A (ja) 2000-08-30 2002-03-15 Hirata Corp ウェハ転送装置およびウェハアライメント方法
US20030035711A1 (en) * 2001-07-14 2003-02-20 Ulysses Gilchrist Centering double side edge grip end effector with integrated mapping sensor
JP2003309166A (ja) 2002-04-15 2003-10-31 Sharp Corp 半導体ウェハの移載装置
US20040013503A1 (en) * 2002-07-22 2004-01-22 Jaswant Sandhu Robotic hand with multi-wafer end effector
JP2004311781A (ja) * 2003-04-08 2004-11-04 Tokyo Electron Ltd 処理装置
KR100923263B1 (ko) * 2003-09-25 2009-10-23 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치, 반도체 디바이스의 제조 방법 및 기판의 이동 적재 방법
JP3999723B2 (ja) * 2003-10-08 2007-10-31 川崎重工業株式会社 基板保持装置
JP3998662B2 (ja) 2004-05-31 2007-10-31 株式会社東京興業貿易商会 ウエハピッチ変換機
US7596456B2 (en) * 2005-11-18 2009-09-29 Texas Instruments Incorporated Method and apparatus for cassette integrity testing using a wafer sorter
DE102008037419A1 (de) * 2008-10-07 2010-04-08 Vistec Semiconductor Systems Jena Gmbh Vorrichtung und Verfahren zur Bestimmung der Position eines scheibenförmigen Objekts
JP5303301B2 (ja) * 2009-02-06 2013-10-02 日本電産サンキョー株式会社 産業用ロボット
JP2010283334A (ja) * 2009-05-01 2010-12-16 Hitachi Kokusai Electric Inc 基板処理装置及び半導体装置の製造方法
EP2743975A4 (de) * 2011-08-10 2015-06-03 Kawasaki Heavy Ind Ltd Endeffektorvorrichtung und substrattransportroboter mit dieser endeffektorvorrichtung
WO2014103300A1 (ja) * 2012-12-27 2014-07-03 川崎重工業株式会社 エンドエフェクタ装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11220003A (ja) * 1998-02-03 1999-08-10 Shin Meiwa Ind Co Ltd ウエハ把持装置
US6216883B1 (en) * 1998-07-24 2001-04-17 Mitsubishi Denki Kabushiki Kaisha Wafer holding hand
JP2006313865A (ja) * 2005-05-09 2006-11-16 Tatsumo Kk 基板保持装置
TW201043417A (en) * 2009-03-13 2010-12-16 Kawasaki Heavy Ind Ltd Robot having end effector and method of operating the same
TW201104779A (en) * 2009-03-19 2011-02-01 Shibaura Mechatronics Corp Substrate transfer device and substrate transfer method

Also Published As

Publication number Publication date
KR101911156B1 (ko) 2018-10-24
JP6309756B2 (ja) 2018-04-11
CN106104787A (zh) 2016-11-09
WO2015098093A1 (ja) 2015-07-02
US10062594B2 (en) 2018-08-28
JP2015126045A (ja) 2015-07-06
EP3089204A4 (de) 2017-08-02
KR20160118237A (ko) 2016-10-11
TW201532764A (zh) 2015-09-01
CN106104787B (zh) 2019-09-06
US20160322246A1 (en) 2016-11-03
EP3089204A1 (de) 2016-11-02

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