TWI578859B - 印刷電路板及印刷電路板的製造方法 - Google Patents

印刷電路板及印刷電路板的製造方法 Download PDF

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Publication number
TWI578859B
TWI578859B TW101125234A TW101125234A TWI578859B TW I578859 B TWI578859 B TW I578859B TW 101125234 A TW101125234 A TW 101125234A TW 101125234 A TW101125234 A TW 101125234A TW I578859 B TWI578859 B TW I578859B
Authority
TW
Taiwan
Prior art keywords
reinforcing member
nickel
layer
printed circuit
circuit board
Prior art date
Application number
TW101125234A
Other languages
English (en)
Chinese (zh)
Other versions
TW201315302A (zh
Inventor
田島宏
渡邊正博
Original Assignee
大自達電線股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大自達電線股份有限公司 filed Critical 大自達電線股份有限公司
Publication of TW201315302A publication Critical patent/TW201315302A/zh
Application granted granted Critical
Publication of TWI578859B publication Critical patent/TWI578859B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Structure Of Printed Boards (AREA)
TW101125234A 2011-08-11 2012-07-13 印刷電路板及印刷電路板的製造方法 TWI578859B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011175969A JP5395854B2 (ja) 2011-08-11 2011-08-11 プリント配線板及びプリント配線板の製造方法

Publications (2)

Publication Number Publication Date
TW201315302A TW201315302A (zh) 2013-04-01
TWI578859B true TWI578859B (zh) 2017-04-11

Family

ID=47647668

Family Applications (2)

Application Number Title Priority Date Filing Date
TW101125234A TWI578859B (zh) 2011-08-11 2012-07-13 印刷電路板及印刷電路板的製造方法
TW106103208A TWI642336B (zh) 2011-08-11 2012-07-13 附帶導電性粘合劑層的加強部件

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW106103208A TWI642336B (zh) 2011-08-11 2012-07-13 附帶導電性粘合劑層的加強部件

Country Status (4)

Country Link
JP (1) JP5395854B2 (ko)
KR (1) KR101912214B1 (ko)
CN (2) CN102933024B (ko)
TW (2) TWI578859B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
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TWI642336B (zh) * 2011-08-11 2018-11-21 大自達電線股份有限公司 附帶導電性粘合劑層的加強部件

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WO2015008671A1 (ja) * 2013-07-16 2015-01-22 住友電気工業株式会社 電子部品及び電子部品の製造方法
JP6239884B2 (ja) * 2013-07-16 2017-11-29 住友電工プリントサーキット株式会社 電子部品及びその製造方法
CN103775880A (zh) * 2014-01-28 2014-05-07 陈霞 热管表面带有机led发光体的玻璃热管led灯具
JP6781631B2 (ja) * 2014-08-29 2020-11-04 タツタ電線株式会社 フレキシブルプリント配線板用補強部材、及びそれを備えたフレキシブルプリント配線板
JP5659379B1 (ja) * 2014-09-04 2015-01-28 東洋インキＳｃホールディングス株式会社 プリント配線板
CN104532307A (zh) * 2014-12-22 2015-04-22 泰州市博泰电子有限公司 一种微波高频板电镀哑镍的方法
JP6499925B2 (ja) 2015-06-02 2019-04-10 タツタ電線株式会社 フレキシブルプリント配線板、フレキシブルプリント配線板用補強部材、及びフレキシブルプリント基板
JP5871098B1 (ja) * 2015-07-16 2016-03-01 東洋インキＳｃホールディングス株式会社 導電性接着剤層、導電性接着シートおよびプリント配線板
CN105682343B (zh) * 2016-02-25 2019-04-02 Oppo广东移动通信有限公司 软硬结合板及终端
JP6135815B1 (ja) 2016-09-29 2017-05-31 東洋インキＳｃホールディングス株式会社 プリント配線板および電子機器
US20190373716A1 (en) * 2017-02-13 2019-12-05 Tatsuta Electric Wire & Cable Co., Ltd. Printed Wiring Board
CN107995791B (zh) * 2018-01-08 2020-09-18 奈电软性科技电子(珠海)有限公司 一种蚀刻钢片的贴合方法
CN110461086B (zh) * 2019-08-30 2021-01-08 维沃移动通信有限公司 一种电路板、电路板制作方法及终端
CN114830843B (zh) 2020-07-31 2024-06-18 拓自达电线株式会社 导电性胶粘剂
TW202237716A (zh) 2021-03-26 2022-10-01 日商拓自達電線股份有限公司 導電性接著劑層

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TW545093B (en) * 2001-09-06 2003-08-01 Olin Corp Copper foil with low profile bond enhancement
JP2009218443A (ja) * 2008-03-11 2009-09-24 Sumitomo Electric Ind Ltd 金属補強板を備えたフレキシブルプリント配線板

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CN102316664B (zh) * 2010-07-02 2013-08-28 富葵精密组件(深圳)有限公司 柔性电路板及其制作方法
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JP5308465B2 (ja) * 2011-01-28 2013-10-09 タツタ電線株式会社 シールドプリント配線板
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW545093B (en) * 2001-09-06 2003-08-01 Olin Corp Copper foil with low profile bond enhancement
JP2009218443A (ja) * 2008-03-11 2009-09-24 Sumitomo Electric Ind Ltd 金属補強板を備えたフレキシブルプリント配線板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI642336B (zh) * 2011-08-11 2018-11-21 大自達電線股份有限公司 附帶導電性粘合劑層的加強部件

Also Published As

Publication number Publication date
CN102933024B (zh) 2017-06-16
JP2013041869A (ja) 2013-02-28
JP5395854B2 (ja) 2014-01-22
CN102933024A (zh) 2013-02-13
TW201315302A (zh) 2013-04-01
TWI642336B (zh) 2018-11-21
KR20130018131A (ko) 2013-02-20
TW201720243A (zh) 2017-06-01
KR101912214B1 (ko) 2018-10-26
CN203057677U (zh) 2013-07-10

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