TWI576667B - A partially hydrolyzed condensate, a dialing agent, a negative photosensitive resin composition, a hardened film, a partition wall, and an optical element - Google Patents

A partially hydrolyzed condensate, a dialing agent, a negative photosensitive resin composition, a hardened film, a partition wall, and an optical element Download PDF

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Publication number
TWI576667B
TWI576667B TW102115078A TW102115078A TWI576667B TW I576667 B TWI576667 B TW I576667B TW 102115078 A TW102115078 A TW 102115078A TW 102115078 A TW102115078 A TW 102115078A TW I576667 B TWI576667 B TW I576667B
Authority
TW
Taiwan
Prior art keywords
group
resin composition
photosensitive resin
compound
hydrolyzable
Prior art date
Application number
TW102115078A
Other languages
English (en)
Chinese (zh)
Other versions
TW201348883A (zh
Inventor
Hideyuki Takahashi
Masayuki Kawashima
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of TW201348883A publication Critical patent/TW201348883A/zh
Application granted granted Critical
Publication of TWI576667B publication Critical patent/TWI576667B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/28—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen sulfur-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Silicon Polymers (AREA)
  • Materials Applied To Surfaces To Minimize Adherence Of Mist Or Water (AREA)
  • Paints Or Removers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW102115078A 2012-04-27 2013-04-26 A partially hydrolyzed condensate, a dialing agent, a negative photosensitive resin composition, a hardened film, a partition wall, and an optical element TWI576667B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012102984 2012-04-27

Publications (2)

Publication Number Publication Date
TW201348883A TW201348883A (zh) 2013-12-01
TWI576667B true TWI576667B (zh) 2017-04-01

Family

ID=49483138

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102115078A TWI576667B (zh) 2012-04-27 2013-04-26 A partially hydrolyzed condensate, a dialing agent, a negative photosensitive resin composition, a hardened film, a partition wall, and an optical element

Country Status (5)

Country Link
JP (1) JP6020557B2 (ja)
KR (1) KR102021745B1 (ja)
CN (1) CN104271642B (ja)
TW (1) TWI576667B (ja)
WO (1) WO2013161829A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102372956B1 (ko) * 2013-12-17 2022-03-10 에이지씨 가부시키가이샤 네거티브형 감광성 수지 조성물, 수지 경화막, 격벽 및 광학 소자
WO2015125787A1 (ja) * 2014-02-18 2015-08-27 旭硝子株式会社 ネガ型感光性樹脂組成物、樹脂硬化膜、隔壁および光学素子
CN106462069B (zh) * 2014-04-25 2019-10-18 Ａｇｃ株式会社 负型感光性树脂组合物、分隔壁及光学元件
JP6647780B2 (ja) * 2014-10-27 2020-02-14 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 有機金属材料および方法
KR102636177B1 (ko) 2018-01-26 2024-02-14 미쯔비시 케미컬 주식회사 감광성 수지 조성물, 격벽, 유기 전계 발광 소자, 화상 표시 장치 및 조명
KR102709353B1 (ko) * 2018-02-08 2024-09-25 닛산 가가쿠 가부시키가이샤 감광성 수지 조성물
JP7156638B2 (ja) * 2018-08-28 2022-10-19 株式会社豊田自動織機 コーティング剤、樹脂部材及びその製造方法
TW202124538A (zh) 2019-10-18 2021-07-01 美商摩曼帝夫特性材料公司 反應性聚(氟烷基-官能性矽氧烷)寡聚物、其形成方法及使用其之組合物

Citations (2)

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Publication number Priority date Publication date Assignee Title
TW200804541A (en) * 2006-04-13 2008-01-16 Nissan Chemical Ind Ltd Phosphoric ester containing coating fluid and antireflection coatings
TW200909542A (en) * 2007-04-10 2009-03-01 Nissan Chemical Ind Ltd Coating solution for forming antireflective coating film comprising polysiloxane modified with mercapto group

Family Cites Families (11)

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ES2153951T3 (es) * 1995-03-01 2001-03-16 Bosch Gmbh Robert Elastomeros con revestimiento antifriccion.
JP2002122987A (ja) * 2000-10-16 2002-04-26 Kansai Paint Co Ltd ネガ型感光性樹脂組成物、ネガ型感光性ドライフィルム、その組成物を使用して得られる材料及びパターン形成方法
JP2004277493A (ja) * 2003-03-13 2004-10-07 Asahi Glass Co Ltd 含シリコン樹脂および感光性樹脂組成物
JP4189657B2 (ja) * 2003-05-09 2008-12-03 信越化学工業株式会社 エラストマー用水性接着剤組成物及びエラストマーの接着方法
JP2006111734A (ja) * 2004-10-15 2006-04-27 Shin Etsu Chem Co Ltd 含フッ素オルガノポリシロキサン
KR20080084551A (ko) * 2007-03-15 2008-09-19 후지필름 가부시키가이샤 감광성 수지막의 형성 방법, 감광성 전사 재료, 화소격벽이 형성된 기판, 컬러필터 및 그 제조 방법, 그리고표시 장치
CN101481598A (zh) * 2008-01-10 2009-07-15 中国科学院化学研究所 一种减反射抗雾薄膜及其制备方法、专用涂液与应用
WO2010013816A1 (ja) * 2008-08-01 2010-02-04 旭硝子株式会社 ネガ型感光性組成物、それを用いた光学素子用隔壁および該隔壁を有する光学素子
SI23002A (sl) * 2009-03-30 2010-09-30 Kemijski@inštitut Postopek za sol gel pripravo korozijsko zaščitnih prevlek za sončne zbiralnike
JP6201280B2 (ja) * 2011-03-30 2017-09-27 東レ株式会社 シロキサン系樹脂組成物の製造方法、それを用いた硬化膜、光学物品および固体撮像素子の製造方法
JP2012251035A (ja) * 2011-06-01 2012-12-20 Yokohama Rubber Co Ltd:The 硬化性樹脂組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200804541A (en) * 2006-04-13 2008-01-16 Nissan Chemical Ind Ltd Phosphoric ester containing coating fluid and antireflection coatings
TW200909542A (en) * 2007-04-10 2009-03-01 Nissan Chemical Ind Ltd Coating solution for forming antireflective coating film comprising polysiloxane modified with mercapto group

Also Published As

Publication number Publication date
CN104271642B (zh) 2016-06-22
TW201348883A (zh) 2013-12-01
KR102021745B1 (ko) 2019-09-17
JP6020557B2 (ja) 2016-11-02
KR20150005524A (ko) 2015-01-14
CN104271642A (zh) 2015-01-07
JPWO2013161829A1 (ja) 2015-12-24
WO2013161829A1 (ja) 2013-10-31

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