KR102021745B1 - 부분 가수 분해 축합물, 발잉크제, 네거티브형 감광성 수지 조성물, 경화막, 격벽 및 광학 소자 - Google Patents

부분 가수 분해 축합물, 발잉크제, 네거티브형 감광성 수지 조성물, 경화막, 격벽 및 광학 소자 Download PDF

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KR102021745B1
KR102021745B1 KR1020147026610A KR20147026610A KR102021745B1 KR 102021745 B1 KR102021745 B1 KR 102021745B1 KR 1020147026610 A KR1020147026610 A KR 1020147026610A KR 20147026610 A KR20147026610 A KR 20147026610A KR 102021745 B1 KR102021745 B1 KR 102021745B1
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South Korea
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group
resin composition
photosensitive resin
negative photosensitive
compound
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KR1020147026610A
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Korean (ko)
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KR20150005524A (ko
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히데유키 다카하시
마사유키 가와시마
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에이지씨 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/28—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen sulfur-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Silicon Polymers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials Applied To Surfaces To Minimize Adherence Of Mist Or Water (AREA)
  • Paints Or Removers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
KR1020147026610A 2012-04-27 2013-04-23 부분 가수 분해 축합물, 발잉크제, 네거티브형 감광성 수지 조성물, 경화막, 격벽 및 광학 소자 KR102021745B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012102984 2012-04-27
JPJP-P-2012-102984 2012-04-27
PCT/JP2013/061949 WO2013161829A1 (ja) 2012-04-27 2013-04-23 部分加水分解縮合物、撥インク剤、ネガ型感光性樹脂組成物、硬化膜、隔壁および光学素子

Publications (2)

Publication Number Publication Date
KR20150005524A KR20150005524A (ko) 2015-01-14
KR102021745B1 true KR102021745B1 (ko) 2019-09-17

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KR1020147026610A KR102021745B1 (ko) 2012-04-27 2013-04-23 부분 가수 분해 축합물, 발잉크제, 네거티브형 감광성 수지 조성물, 경화막, 격벽 및 광학 소자

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Country Link
JP (1) JP6020557B2 (ja)
KR (1) KR102021745B1 (ja)
CN (1) CN104271642B (ja)
TW (1) TWI576667B (ja)
WO (1) WO2013161829A1 (ja)

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WO2015093415A1 (ja) * 2013-12-17 2015-06-25 旭硝子株式会社 ネガ型感光性樹脂組成物、樹脂硬化膜、隔壁および光学素子
JP6398774B2 (ja) * 2014-02-18 2018-10-03 Ａｇｃ株式会社 ネガ型感光性樹脂組成物、樹脂硬化膜、隔壁および光学素子
CN106462069B (zh) * 2014-04-25 2019-10-18 Ａｇｃ株式会社 负型感光性树脂组合物、分隔壁及光学元件
JP6647780B2 (ja) * 2014-10-27 2020-02-14 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 有機金属材料および方法
CN111566560A (zh) 2018-01-26 2020-08-21 三菱化学株式会社 感光性树脂组合物、间隔壁、有机场致发光元件、图像显示装置及照明
JP7406181B2 (ja) * 2018-02-08 2023-12-27 日産化学株式会社 感光性樹脂組成物
JP7156638B2 (ja) * 2018-08-28 2022-10-19 株式会社豊田自動織機 コーティング剤、樹脂部材及びその製造方法
US11702511B2 (en) 2019-10-18 2023-07-18 Momentive Performance Materials Inc. Reactive poly(fluoroalkyl-functional siloxane) oligomers, process for forming the same, and compositions using the same

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US5766771A (en) * 1995-03-01 1998-06-16 Robert Bosch Gmbh Elastomers having a friction-reducing coating
JP2002122987A (ja) * 2000-10-16 2002-04-26 Kansai Paint Co Ltd ネガ型感光性樹脂組成物、ネガ型感光性ドライフィルム、その組成物を使用して得られる材料及びパターン形成方法
JP2004277493A (ja) * 2003-03-13 2004-10-07 Asahi Glass Co Ltd 含シリコン樹脂および感光性樹脂組成物
JP4189657B2 (ja) * 2003-05-09 2008-12-03 信越化学工業株式会社 エラストマー用水性接着剤組成物及びエラストマーの接着方法
JP2006111734A (ja) * 2004-10-15 2006-04-27 Shin Etsu Chem Co Ltd 含フッ素オルガノポリシロキサン
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KR20080084551A (ko) * 2007-03-15 2008-09-19 후지필름 가부시키가이샤 감광성 수지막의 형성 방법, 감광성 전사 재료, 화소격벽이 형성된 기판, 컬러필터 및 그 제조 방법, 그리고표시 장치
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Also Published As

Publication number Publication date
CN104271642A (zh) 2015-01-07
CN104271642B (zh) 2016-06-22
KR20150005524A (ko) 2015-01-14
TW201348883A (zh) 2013-12-01
JP6020557B2 (ja) 2016-11-02
JPWO2013161829A1 (ja) 2015-12-24
WO2013161829A1 (ja) 2013-10-31
TWI576667B (zh) 2017-04-01

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