TWI575775B - 發光裝置及發光裝置封裝 - Google Patents

發光裝置及發光裝置封裝 Download PDF

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Publication number
TWI575775B
TWI575775B TW101139757A TW101139757A TWI575775B TW I575775 B TWI575775 B TW I575775B TW 101139757 A TW101139757 A TW 101139757A TW 101139757 A TW101139757 A TW 101139757A TW I575775 B TWI575775 B TW I575775B
Authority
TW
Taiwan
Prior art keywords
light
layer
disposed
emitting
light emitting
Prior art date
Application number
TW101139757A
Other languages
English (en)
Chinese (zh)
Other versions
TW201318214A (zh
Inventor
金省均
朱炫承
洪奇錫
Original Assignee
Ｌｇ伊諾特股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｌｇ伊諾特股份有限公司 filed Critical Ｌｇ伊諾特股份有限公司
Publication of TW201318214A publication Critical patent/TW201318214A/zh
Application granted granted Critical
Publication of TWI575775B publication Critical patent/TWI575775B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H10H20/8312—Electrodes characterised by their shape extending at least partially through the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
TW101139757A 2011-10-28 2012-10-26 發光裝置及發光裝置封裝 TWI575775B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110111308A KR101888604B1 (ko) 2011-10-28 2011-10-28 발광 소자 및 발광 소자 패키지

Publications (2)

Publication Number Publication Date
TW201318214A TW201318214A (zh) 2013-05-01
TWI575775B true TWI575775B (zh) 2017-03-21

Family

ID=47115528

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101139757A TWI575775B (zh) 2011-10-28 2012-10-26 發光裝置及發光裝置封裝

Country Status (6)

Country Link
US (1) US9165977B2 (https=)
EP (1) EP2587542B1 (https=)
JP (1) JP6133040B2 (https=)
KR (1) KR101888604B1 (https=)
CN (1) CN103094435B (https=)
TW (1) TWI575775B (https=)

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KR102550007B1 (ko) * 2016-11-30 2023-07-03 서울바이오시스 주식회사 복수의 발광셀들을 가지는 발광 다이오드
KR20180073866A (ko) * 2016-12-23 2018-07-03 엘지이노텍 주식회사 반도체 소자
KR102737500B1 (ko) * 2016-12-27 2024-12-04 삼성전자주식회사 발광소자 패키지
CN109256446B (zh) * 2017-07-13 2022-02-08 晶元光电股份有限公司 发光元件
US11552057B2 (en) 2017-12-20 2023-01-10 Seoul Viosys Co., Ltd. LED unit for display and display apparatus having the same
US11355549B2 (en) 2017-12-29 2022-06-07 Lumileds Llc High density interconnect for segmented LEDs
DE102018101393A1 (de) * 2018-01-23 2019-07-25 Osram Opto Semiconductors Gmbh Optoelektronischer halbleiterchip und verfahren zur herstellung eines optoelektronischen halbleiterchips
JP6717324B2 (ja) * 2018-02-27 2020-07-01 日亜化学工業株式会社 発光素子
TWI818070B (zh) * 2019-08-30 2023-10-11 晶元光電股份有限公司 發光元件及其製造方法
JP7339559B2 (ja) * 2021-05-20 2023-09-06 日亜化学工業株式会社 発光素子
JP7784328B2 (ja) * 2022-03-08 2025-12-11 スタンレー電気株式会社 半導体発光素子、半導体発光装置及び半導体発光装置モジュール
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Also Published As

Publication number Publication date
JP2013098562A (ja) 2013-05-20
US9165977B2 (en) 2015-10-20
US20130105845A1 (en) 2013-05-02
CN103094435B (zh) 2017-04-26
EP2587542B1 (en) 2018-02-28
TW201318214A (zh) 2013-05-01
JP6133040B2 (ja) 2017-05-24
KR101888604B1 (ko) 2018-08-14
KR20130046754A (ko) 2013-05-08
CN103094435A (zh) 2013-05-08
EP2587542A1 (en) 2013-05-01

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