TWI573508B - Printed circuit board manufacturing method and printed circuit board - Google Patents

Printed circuit board manufacturing method and printed circuit board Download PDF

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Publication number
TWI573508B
TWI573508B TW102131205A TW102131205A TWI573508B TW I573508 B TWI573508 B TW I573508B TW 102131205 A TW102131205 A TW 102131205A TW 102131205 A TW102131205 A TW 102131205A TW I573508 B TWI573508 B TW I573508B
Authority
TW
Taiwan
Prior art keywords
layer
foil
metal
carrier foil
clad laminate
Prior art date
Application number
TW102131205A
Other languages
English (en)
Chinese (zh)
Other versions
TW201436682A (zh
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW201436682A publication Critical patent/TW201436682A/zh
Application granted granted Critical
Publication of TWI573508B publication Critical patent/TWI573508B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Laminated Bodies (AREA)
TW102131205A 2012-09-05 2013-08-30 Printed circuit board manufacturing method and printed circuit board TWI573508B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012194738A JP2014053342A (ja) 2012-09-05 2012-09-05 プリント配線板の製造方法及びプリント配線板

Publications (2)

Publication Number Publication Date
TW201436682A TW201436682A (zh) 2014-09-16
TWI573508B true TWI573508B (zh) 2017-03-01

Family

ID=50237100

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102131205A TWI573508B (zh) 2012-09-05 2013-08-30 Printed circuit board manufacturing method and printed circuit board

Country Status (5)

Country Link
JP (1) JP2014053342A (ja)
KR (2) KR102090353B1 (ja)
CN (1) CN104737631B (ja)
TW (1) TWI573508B (ja)
WO (1) WO2014038488A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106103082B (zh) * 2014-03-31 2019-04-26 三井金属矿业株式会社 带有载体箔的铜箔、覆铜层压板及印刷线路板
KR102043689B1 (ko) * 2018-05-08 2019-11-12 충남대학교산학협력단 바디 일체형 배선 제조장치 및 이를 이용한 제조방법
JPWO2022137443A1 (ja) * 2020-12-24 2022-06-30

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6476796A (en) * 1987-09-17 1989-03-22 Nec Corp Manufacture of multilayer printed wiring board
JPH0399490A (ja) * 1989-09-12 1991-04-24 Fujitsu Ltd プリント基板の孔加工前表面処理方法
JP2008078487A (ja) * 2006-09-22 2008-04-03 Samsung Electro Mech Co Ltd Ｖｏｐ用銅張積層板の製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6199596A (ja) * 1984-10-22 1986-05-17 Hitachi Ltd 基板の穴あけ方法
DE69926939T2 (de) * 1998-04-01 2006-07-13 Mitsui Mining & Smelting Co., Ltd. Verfahren zur Herstellung einer mehrschichtigen gedruckten Leiterplatte
JP3142270B2 (ja) * 1998-04-01 2001-03-07 三井金属鉱業株式会社 プリント配線板の製造方法
US6163957A (en) * 1998-11-13 2000-12-26 Fujitsu Limited Multilayer laminated substrates with high density interconnects and methods of making the same
US6203652B1 (en) * 1999-06-30 2001-03-20 International Business Machines Corporation Method of forming a via in a substrate
JP2001068816A (ja) * 1999-08-24 2001-03-16 Mitsui Mining & Smelting Co Ltd 銅張積層板及びその銅張積層板を用いたレーザー加工方法
JP2001144411A (ja) * 1999-09-03 2001-05-25 Mec Kk プリント配線板の孔あけ法およびそれに用いる表面処理剤
JP3670196B2 (ja) * 2000-04-26 2005-07-13 三井金属鉱業株式会社 プリント配線板の製造法
JP2002019017A (ja) * 2000-07-12 2002-01-22 Hitachi Metals Ltd レーザ穴あけ加工用樹脂付き銅箔及びその製造方法
JP2002292788A (ja) * 2001-03-30 2002-10-09 Nippon Denkai Kk 複合銅箔及び該複合銅箔の製造方法
JP2003008203A (ja) 2001-06-27 2003-01-10 Mitsubishi Gas Chem Co Inc 炭酸ガスレーザーによる両面板へのブラインドビア孔の形成方法
EP1289354B1 (de) * 2001-09-01 2005-11-30 TRUMPF LASERTECHNIK GmbH Verfahren zum Herstellen von Löchern in einer Mehrlagenleiterplatte
JP2004006612A (ja) * 2002-04-12 2004-01-08 Mitsui Mining & Smelting Co Ltd キャリア箔付銅箔及びそのキャリア箔付銅箔の製造方法並びにそのキャリア箔付銅箔を用いた銅張積層板
JP2004087697A (ja) * 2002-08-26 2004-03-18 Shinko Electric Ind Co Ltd 配線基板の製造方法
JP4595284B2 (ja) * 2003-01-28 2010-12-08 三菱瓦斯化学株式会社 炭酸ガスレーザーによる孔あけ用補助シート
JP2007129180A (ja) * 2005-10-03 2007-05-24 Cmk Corp プリント配線板、多層プリント配線板及びその製造方法
TW200810637A (en) * 2006-08-10 2008-02-16 Nan Ya Printed Circuit Board Corp Method for forming micro blind via on a copper clad laminate substrate utilizing laser drilling technique
US20100230142A1 (en) * 2007-10-23 2010-09-16 Ube Industries, Ltd. Method for manufacturing printed wiring board
KR101044787B1 (ko) * 2008-06-30 2011-06-29 삼성전기주식회사 인쇄회로기판 제조방법
KR101019150B1 (ko) * 2008-06-30 2011-03-04 삼성전기주식회사 비아-온-패드 구조를 갖는 인쇄회로기판 제조방법
JP6203652B2 (ja) * 2014-01-31 2017-09-27 三菱重工業株式会社 冷却装置の制御装置、冷却装置、ガスタービン、冷却装置の制御方法、及びガスタービンの制御方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6476796A (en) * 1987-09-17 1989-03-22 Nec Corp Manufacture of multilayer printed wiring board
JPH0399490A (ja) * 1989-09-12 1991-04-24 Fujitsu Ltd プリント基板の孔加工前表面処理方法
JP2008078487A (ja) * 2006-09-22 2008-04-03 Samsung Electro Mech Co Ltd Ｖｏｐ用銅張積層板の製造方法

Also Published As

Publication number Publication date
KR102090353B1 (ko) 2020-03-17
JP2014053342A (ja) 2014-03-20
KR102046738B1 (ko) 2019-11-19
KR20150052051A (ko) 2015-05-13
KR20180108880A (ko) 2018-10-04
TW201436682A (zh) 2014-09-16
CN104737631B (zh) 2018-05-08
CN104737631A (zh) 2015-06-24
WO2014038488A1 (ja) 2014-03-13

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