JPWO2022137443A1 - - Google Patents

Info

Publication number
JPWO2022137443A1
JPWO2022137443A1 JP2021532498A JP2021532498A JPWO2022137443A1 JP WO2022137443 A1 JPWO2022137443 A1 JP WO2022137443A1 JP 2021532498 A JP2021532498 A JP 2021532498A JP 2021532498 A JP2021532498 A JP 2021532498A JP WO2022137443 A1 JPWO2022137443 A1 JP WO2022137443A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021532498A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022137443A1 publication Critical patent/JPWO2022137443A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
JP2021532498A 2020-12-24 2020-12-24 Pending JPWO2022137443A1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/048477 WO2022137443A1 (ja) 2020-12-24 2020-12-24 プリント配線板の製造方法およびレーザ加工機

Publications (1)

Publication Number Publication Date
JPWO2022137443A1 true JPWO2022137443A1 (ja) 2022-06-30

Family

ID=82159267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021532498A Pending JPWO2022137443A1 (ja) 2020-12-24 2020-12-24

Country Status (3)

Country Link
JP (1) JPWO2022137443A1 (ja)
TW (1) TW202226918A (ja)
WO (1) WO2022137443A1 (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011210795A (ja) * 2010-03-29 2011-10-20 Sumitomo Bakelite Co Ltd 積層板、積層板の製造方法、プリント配線基板および半導体装置
WO2014038542A1 (ja) * 2012-09-07 2014-03-13 株式会社フジクラ 配線基板
JP2014053342A (ja) * 2012-09-05 2014-03-20 Mitsui Mining & Smelting Co Ltd プリント配線板の製造方法及びプリント配線板
JP2014150107A (ja) * 2013-01-31 2014-08-21 Kyocera Corp 電子素子搭載用基板および電子装置
JP2015177145A (ja) * 2014-03-18 2015-10-05 イビデン株式会社 プリント配線板の製造方法
JP2019067864A (ja) * 2017-09-29 2019-04-25 イビデン株式会社 プリント配線板の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4551730B2 (ja) * 2004-10-15 2010-09-29 イビデン株式会社 多層コア基板及びその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011210795A (ja) * 2010-03-29 2011-10-20 Sumitomo Bakelite Co Ltd 積層板、積層板の製造方法、プリント配線基板および半導体装置
JP2014053342A (ja) * 2012-09-05 2014-03-20 Mitsui Mining & Smelting Co Ltd プリント配線板の製造方法及びプリント配線板
WO2014038542A1 (ja) * 2012-09-07 2014-03-13 株式会社フジクラ 配線基板
JP2014150107A (ja) * 2013-01-31 2014-08-21 Kyocera Corp 電子素子搭載用基板および電子装置
JP2015177145A (ja) * 2014-03-18 2015-10-05 イビデン株式会社 プリント配線板の製造方法
JP2019067864A (ja) * 2017-09-29 2019-04-25 イビデン株式会社 プリント配線板の製造方法

Also Published As

Publication number Publication date
TW202226918A (zh) 2022-07-01
WO2022137443A1 (ja) 2022-06-30

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