TWI570824B - 半導體晶粒的拾取裝置以及拾取方法 - Google Patents

半導體晶粒的拾取裝置以及拾取方法 Download PDF

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Publication number
TWI570824B
TWI570824B TW104100134A TW104100134A TWI570824B TW I570824 B TWI570824 B TW I570824B TW 104100134 A TW104100134 A TW 104100134A TW 104100134 A TW104100134 A TW 104100134A TW I570824 B TWI570824 B TW I570824B
Authority
TW
Taiwan
Prior art keywords
pressure
adsorption
opening
semiconductor die
switched
Prior art date
Application number
TW104100134A
Other languages
English (en)
Chinese (zh)
Other versions
TW201533823A (zh
Inventor
長野一昭
片山善文
豊田宏樹
石塚武
福本真介
Original Assignee
新川股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新川股份有限公司 filed Critical 新川股份有限公司
Publication of TW201533823A publication Critical patent/TW201533823A/zh
Application granted granted Critical
Publication of TWI570824B publication Critical patent/TWI570824B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
TW104100134A 2014-02-26 2015-01-06 半導體晶粒的拾取裝置以及拾取方法 TWI570824B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014035138 2014-02-26
JP2014225728A JP5717910B1 (ja) 2014-02-26 2014-11-06 半導体ダイのピックアップ装置及びピックアップ方法

Publications (2)

Publication Number Publication Date
TW201533823A TW201533823A (zh) 2015-09-01
TWI570824B true TWI570824B (zh) 2017-02-11

Family

ID=53277415

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104100134A TWI570824B (zh) 2014-02-26 2015-01-06 半導體晶粒的拾取裝置以及拾取方法

Country Status (6)

Country Link
JP (1) JP5717910B1 (ja)
KR (2) KR20180031828A (ja)
CN (1) CN106030776B (ja)
SG (1) SG11201607122VA (ja)
TW (1) TWI570824B (ja)
WO (1) WO2015129105A1 (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6797569B2 (ja) * 2016-06-13 2020-12-09 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP6643197B2 (ja) * 2016-07-13 2020-02-12 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP6653273B2 (ja) * 2017-01-26 2020-02-26 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP6685245B2 (ja) * 2017-02-08 2020-04-22 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
TWI685046B (zh) * 2017-03-24 2020-02-11 日商新川股份有限公司 拾取裝置以及拾取方法
TWI716925B (zh) * 2018-07-06 2021-01-21 日商新川股份有限公司 半導體晶粒的拾取系統
TWI745710B (zh) * 2018-07-06 2021-11-11 日商新川股份有限公司 半導體晶粒的拾取系統
JP7102305B2 (ja) * 2018-09-19 2022-07-19 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP7217605B2 (ja) 2018-09-21 2023-02-03 ファスフォードテクノロジ株式会社 半導体製造装置、突上げ治具および半導体装置の製造方法
CH715447B1 (de) * 2018-10-15 2022-01-14 Besi Switzerland Ag Chip-Auswerfer.
JP7154106B2 (ja) * 2018-10-29 2022-10-17 芝浦メカトロニクス株式会社 電子部品のピックアップ装置及び実装装置
KR102220340B1 (ko) * 2019-06-11 2021-02-25 세메스 주식회사 다이 이젝팅 장치
JP7184006B2 (ja) * 2019-10-01 2022-12-06 三菱電機株式会社 半導体チップのピックアップ治具、半導体チップのピックアップ装置およびピックアップ治具の調節方法
JP7458773B2 (ja) * 2019-12-19 2024-04-01 芝浦メカトロニクス株式会社 電子部品のピックアップ装置及び実装装置
KR102177863B1 (ko) * 2020-08-07 2020-11-11 변영기 칩 필름 단계적 박리장치
US11764098B2 (en) * 2021-04-16 2023-09-19 Asmpt Singapore Pte. Ltd. Detaching a die from an adhesive tape by air ejection

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030075271A1 (en) * 2001-10-23 2003-04-24 Fujitsu Limited Method and device of peeling semiconductor device using annular contact members
TW201025483A (en) * 2008-11-05 2010-07-01 Esec Ag Die ejector
US20130255889A1 (en) * 2012-03-30 2013-10-03 Besi Switzerland Ag Method For Detaching A Semiconductor Chip From A Foil

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4945339A (ja) 1972-09-08 1974-04-30
JPS62210635A (ja) * 1986-03-12 1987-09-16 Hitachi Yonezawa Denshi Kk 物体の分離方法及び装置
JP2004228513A (ja) * 2003-01-27 2004-08-12 Matsushita Electric Ind Co Ltd 電子部品の搬送装置
JP4945339B2 (ja) * 2007-06-22 2012-06-06 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
TWI463580B (zh) * 2007-06-19 2014-12-01 Renesas Electronics Corp Manufacturing method of semiconductor integrated circuit device
JP2009064937A (ja) * 2007-09-06 2009-03-26 Shinkawa Ltd 半導体ダイのピックアップ装置及びピックアップ方法
KR101394390B1 (ko) * 2008-07-24 2014-05-14 세메스 주식회사 반도체 소자를 픽업하기 위한 장치
US8092645B2 (en) * 2010-02-05 2012-01-10 Asm Assembly Automation Ltd Control and monitoring system for thin die detachment and pick-up

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030075271A1 (en) * 2001-10-23 2003-04-24 Fujitsu Limited Method and device of peeling semiconductor device using annular contact members
TW201025483A (en) * 2008-11-05 2010-07-01 Esec Ag Die ejector
US20130255889A1 (en) * 2012-03-30 2013-10-03 Besi Switzerland Ag Method For Detaching A Semiconductor Chip From A Foil

Also Published As

Publication number Publication date
CN106030776B (zh) 2018-12-14
SG11201607122VA (en) 2016-10-28
WO2015129105A1 (ja) 2015-09-03
KR102043117B1 (ko) 2019-11-12
CN106030776A (zh) 2016-10-12
JP5717910B1 (ja) 2015-05-13
JP2015179813A (ja) 2015-10-08
TW201533823A (zh) 2015-09-01
KR20180031828A (ko) 2018-03-28
KR20150144786A (ko) 2015-12-28

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