TWI568323B - 金屬覆蓋積層板，印刷佈線基板，半導體封裝及半導體裝置 - Google Patents

金屬覆蓋積層板，印刷佈線基板，半導體封裝及半導體裝置 Download PDF

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Publication number
TWI568323B
TWI568323B TW102108794A TW102108794A TWI568323B TW I568323 B TWI568323 B TW I568323B TW 102108794 A TW102108794 A TW 102108794A TW 102108794 A TW102108794 A TW 102108794A TW I568323 B TWI568323 B TW I568323B
Authority
TW
Taiwan
Prior art keywords
resin
metal
clad laminate
less
ppm
Prior art date
Application number
TW102108794A
Other languages
English (en)
Chinese (zh)
Other versions
TW201352083A (zh
Inventor
大東範行
Original Assignee
住友電木股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友電木股份有限公司 filed Critical 住友電木股份有限公司
Publication of TW201352083A publication Critical patent/TW201352083A/zh
Application granted granted Critical
Publication of TWI568323B publication Critical patent/TWI568323B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
TW102108794A 2012-03-14 2013-03-13 金屬覆蓋積層板，印刷佈線基板，半導體封裝及半導體裝置 TWI568323B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012056785 2012-03-14

Publications (2)

Publication Number Publication Date
TW201352083A TW201352083A (zh) 2013-12-16
TWI568323B true TWI568323B (zh) 2017-01-21

Family

ID=49160657

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102108794A TWI568323B (zh) 2012-03-14 2013-03-13 金屬覆蓋積層板，印刷佈線基板，半導體封裝及半導體裝置

Country Status (4)

Country Link
JP (1) JP6281184B2 (ko)
KR (1) KR20140144177A (ko)
TW (1) TWI568323B (ko)
WO (1) WO2013136722A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI748505B (zh) * 2020-06-08 2021-12-01 日商旭化成股份有限公司 玻璃布、預浸體、及印刷佈線板

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6428638B2 (ja) * 2013-11-12 2018-11-28 住友ベークライト株式会社 金属張積層板、回路基板、および電子装置
JP2016074871A (ja) * 2014-03-04 2016-05-12 四国化成工業株式会社 ビスマレイミド樹脂組成物およびその利用
KR20210128376A (ko) * 2019-02-21 2021-10-26 에이지씨 가부시키가이샤 적층체 및 적층체의 제조 방법
JP7320388B2 (ja) * 2019-06-26 2023-08-03 旭化成株式会社 ガラスクロス、プリプレグ、及びプリント配線板
CN114340171B (zh) * 2021-12-31 2024-09-03 广州广合科技股份有限公司 一种pcb的翘曲控制方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008087342A (ja) * 2006-10-02 2008-04-17 Sumitomo Bakelite Co Ltd 積層板
CN101343362A (zh) * 2008-09-03 2009-01-14 中国科学院化学研究所 一种聚酰亚胺树脂及其中间体与它们的制备方法与应用
TW201105712A (en) * 2009-05-12 2011-02-16 Kaneka Corp Process for producing polyamic acid solution, and polyimide film
JP2012001583A (ja) * 2010-06-15 2012-01-05 Sumitomo Bakelite Co Ltd プリント配線板用樹脂組成物、プリプレグ、積層板、樹脂シート、プリント配線板及び半導体装置

Family Cites Families (10)

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JP5046350B2 (ja) * 2001-03-29 2012-10-10 大日本印刷株式会社 ウェットエッチングを採用した電子部品の製造方法、電子部品及びハードディスク用サスペンション
JP2003033991A (ja) * 2001-07-25 2003-02-04 Sumitomo Bakelite Co Ltd 表示素子用プラスチック基板
JP2004158648A (ja) * 2002-11-06 2004-06-03 Asahi Kasei Electronics Co Ltd 配線板の製造方法
JP2007050599A (ja) * 2005-08-18 2007-03-01 Kaneka Corp 寸法安定性に優れるフレキシブル金属張積層板およびその製造方法
KR101337168B1 (ko) * 2006-03-03 2013-12-05 스미토모 베이클리트 컴퍼니 리미티드 중간층 재료 및 복합 적층판
CN100426750C (zh) * 2006-04-23 2008-10-15 华为技术有限公司 一种生成两套网管系统的方法
WO2008032620A1 (fr) * 2006-09-13 2008-03-20 Sumitomo Bakelite Co., Ltd. Dispositif à semi-conducteurs
CN101678609B (zh) * 2007-03-20 2015-04-22 住友电木株式会社 制造层压板的方法以及层压板
MY153947A (en) * 2008-09-26 2015-04-15 Sumitomo Bakelite Co Laminate, circuit board and semiconductor device
JP2012049423A (ja) * 2010-08-30 2012-03-08 Sumitomo Bakelite Co Ltd 回路基板、半導体装置、回路基板の製造方法および半導体装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008087342A (ja) * 2006-10-02 2008-04-17 Sumitomo Bakelite Co Ltd 積層板
CN101343362A (zh) * 2008-09-03 2009-01-14 中国科学院化学研究所 一种聚酰亚胺树脂及其中间体与它们的制备方法与应用
TW201105712A (en) * 2009-05-12 2011-02-16 Kaneka Corp Process for producing polyamic acid solution, and polyimide film
JP2012001583A (ja) * 2010-06-15 2012-01-05 Sumitomo Bakelite Co Ltd プリント配線板用樹脂組成物、プリプレグ、積層板、樹脂シート、プリント配線板及び半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI748505B (zh) * 2020-06-08 2021-12-01 日商旭化成股份有限公司 玻璃布、預浸體、及印刷佈線板

Also Published As

Publication number Publication date
JP6281184B2 (ja) 2018-02-21
KR20140144177A (ko) 2014-12-18
WO2013136722A1 (ja) 2013-09-19
TW201352083A (zh) 2013-12-16
JP2013216086A (ja) 2013-10-24

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