TWI565099B - 發光裝置 - Google Patents

發光裝置 Download PDF

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Publication number
TWI565099B
TWI565099B TW100113288A TW100113288A TWI565099B TW I565099 B TWI565099 B TW I565099B TW 100113288 A TW100113288 A TW 100113288A TW 100113288 A TW100113288 A TW 100113288A TW I565099 B TWI565099 B TW I565099B
Authority
TW
Taiwan
Prior art keywords
light
wiring portion
mounting region
emitting device
electrode
Prior art date
Application number
TW100113288A
Other languages
English (en)
Chinese (zh)
Other versions
TW201205886A (en
Inventor
世野玄明
Original Assignee
日亞化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日亞化學工業股份有限公司 filed Critical 日亞化學工業股份有限公司
Publication of TW201205886A publication Critical patent/TW201205886A/zh
Application granted granted Critical
Publication of TWI565099B publication Critical patent/TWI565099B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
TW100113288A 2010-04-16 2011-04-15 發光裝置 TWI565099B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010094718 2010-04-16
JP2011069193A JP5768435B2 (ja) 2010-04-16 2011-03-28 発光装置

Publications (2)

Publication Number Publication Date
TW201205886A TW201205886A (en) 2012-02-01
TWI565099B true TWI565099B (zh) 2017-01-01

Family

ID=44787584

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100113288A TWI565099B (zh) 2010-04-16 2011-04-15 發光裝置

Country Status (4)

Country Link
US (3) US9245873B2 (enExample)
JP (1) JP5768435B2 (enExample)
CN (1) CN102237483B (enExample)
TW (1) TWI565099B (enExample)

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USD658601S1 (en) * 2010-06-15 2012-05-01 Toshiba Lighting & Technology Corporation Light emitting diode module
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USD658605S1 (en) * 2010-06-15 2012-05-01 Toshiba Lighting & Technology Corporation Light emitting diode module
USD658600S1 (en) * 2010-06-15 2012-05-01 Toshiba Lighting & Technology Corporation Light emitting diode module
JP5612991B2 (ja) * 2010-09-30 2014-10-22 シャープ株式会社 発光装置及びこれを備えた照明装置
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WO2013054483A1 (ja) * 2011-10-11 2013-04-18 パナソニック株式会社 発光装置およびこれを用いた照明装置
US10043960B2 (en) * 2011-11-15 2018-08-07 Cree, Inc. Light emitting diode (LED) packages and related methods
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WO2014024627A1 (ja) * 2012-08-06 2014-02-13 シャープ株式会社 発光装置および発光装置の製造方法
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US9171826B2 (en) 2012-09-04 2015-10-27 Micron Technology, Inc. High voltage solid-state transducers and solid-state transducer arrays having electrical cross-connections and associated systems and methods
CN204577466U (zh) * 2012-09-26 2015-08-19 松下知识产权经营株式会社 发光模块
TWI482311B (zh) 2012-10-19 2015-04-21 Univ Nat Sun Yat Sen 三族氮化物量子井結構及其製造方法
US20140167083A1 (en) * 2012-12-19 2014-06-19 Avago Technologies General Ip (Singapore) Pte. Ltd. Led package with integrated reflective shield on zener diode
JP2014187081A (ja) * 2013-03-22 2014-10-02 Nichia Chem Ind Ltd 発光装置
JP6476567B2 (ja) 2013-03-29 2019-03-06 日亜化学工業株式会社 発光装置
CN104425694A (zh) * 2013-08-29 2015-03-18 展晶科技(深圳)有限公司 发光二极管封装结构及其制造方法
JP6213428B2 (ja) 2014-03-12 2017-10-18 豊田合成株式会社 発光装置及びその製造方法
KR102145919B1 (ko) * 2014-05-30 2020-08-19 엘지이노텍 주식회사 발광 소자 패키지
CN109904147B (zh) * 2014-09-05 2023-04-11 光宝光电(常州)有限公司 基板及包含所述基板的发光装置
JP6583764B2 (ja) * 2014-09-12 2019-10-02 パナソニックＩｐマネジメント株式会社 発光装置、及び照明装置
USD770987S1 (en) 2014-10-17 2016-11-08 Panasonic Intellectual Property Management Co., Ltd. Light emitting diode
TW201631808A (zh) * 2015-02-25 2016-09-01 隆達電子股份有限公司 發光二極體晶片封裝體
JP6646969B2 (ja) * 2015-08-03 2020-02-14 シチズン電子株式会社 発光装置
JP6610866B2 (ja) 2015-08-31 2019-11-27 パナソニックＩｐマネジメント株式会社 発光装置、及び照明装置
USD815593S1 (en) * 2016-04-21 2018-04-17 Scosche Industries, Inc. Battery pack with magnetic attachment
US10290777B2 (en) 2016-07-26 2019-05-14 Cree, Inc. Light emitting diodes, components and related methods
CN106206669B (zh) * 2016-08-31 2018-12-07 昆山维信诺科技有限公司 用于异形oled产品的布线方法以及异形oled产品
KR102701861B1 (ko) 2016-11-15 2024-09-04 삼성디스플레이 주식회사 발광장치 및 그의 제조방법
DE102017106407B4 (de) 2017-03-24 2025-04-10 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung von optoelektronischen Halbleiterbauteilen
CN107248510A (zh) * 2017-06-14 2017-10-13 厦门煜明光电有限公司 一种带有齐纳二极管保护的cob封装结构
KR102342853B1 (ko) 2017-07-21 2021-12-23 삼성전자주식회사 수직형 메모리 소자를 구비한 집적회로 소자
US11121298B2 (en) 2018-05-25 2021-09-14 Creeled, Inc. Light-emitting diode packages with individually controllable light-emitting diode chips
EP3582263B1 (de) * 2018-06-15 2023-03-29 Arnold & Richter Cine Technik GmbH & Co. Betriebs KG Lichterzeugende baugruppe für einen scheinwerfer sowie scheinwerfer
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USD902448S1 (en) 2018-08-31 2020-11-17 Cree, Inc. Light emitting diode package
US11335833B2 (en) 2018-08-31 2022-05-17 Creeled, Inc. Light-emitting diodes, light-emitting diode arrays and related devices
KR102659254B1 (ko) 2018-12-26 2024-04-22 엘지전자 주식회사 반도체 발광소자를 이용한 램프
US11101411B2 (en) 2019-06-26 2021-08-24 Creeled, Inc. Solid-state light emitting devices including light emitting diodes in package structures
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WO2022131885A1 (ko) * 2020-12-18 2022-06-23 서울바이오시스주식회사 발광 다이오드 패키지
US12300972B2 (en) * 2021-01-21 2025-05-13 Nichia Corporation Light emitting device

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Also Published As

Publication number Publication date
JP2011238902A (ja) 2011-11-24
US10707188B2 (en) 2020-07-07
CN102237483A (zh) 2011-11-09
US20160111402A1 (en) 2016-04-21
CN102237483B (zh) 2016-04-27
US9245873B2 (en) 2016-01-26
US20110254022A1 (en) 2011-10-20
TW201205886A (en) 2012-02-01
US20180012875A1 (en) 2018-01-11
JP5768435B2 (ja) 2015-08-26
US9786637B2 (en) 2017-10-10

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