CN102237483B - 发光装置 - Google Patents

发光装置 Download PDF

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Publication number
CN102237483B
CN102237483B CN201110097631.6A CN201110097631A CN102237483B CN 102237483 B CN102237483 B CN 102237483B CN 201110097631 A CN201110097631 A CN 201110097631A CN 102237483 B CN102237483 B CN 102237483B
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CN
China
Prior art keywords
light
wiring part
installation region
emitting
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201110097631.6A
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English (en)
Chinese (zh)
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CN102237483A (zh
Inventor
笹野玄明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Chemical Industries Ltd
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Nichia Chemical Industries Ltd
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Filing date
Publication date
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Publication of CN102237483A publication Critical patent/CN102237483A/zh
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Publication of CN102237483B publication Critical patent/CN102237483B/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
CN201110097631.6A 2010-04-16 2011-04-15 发光装置 Active CN102237483B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010-094718 2010-04-16
JP2010094718 2010-04-16
JP2011069193A JP5768435B2 (ja) 2010-04-16 2011-03-28 発光装置
JP2011-069193 2011-03-28

Publications (2)

Publication Number Publication Date
CN102237483A CN102237483A (zh) 2011-11-09
CN102237483B true CN102237483B (zh) 2016-04-27

Family

ID=44787584

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110097631.6A Active CN102237483B (zh) 2010-04-16 2011-04-15 发光装置

Country Status (4)

Country Link
US (3) US9245873B2 (enExample)
JP (1) JP5768435B2 (enExample)
CN (1) CN102237483B (enExample)
TW (1) TWI565099B (enExample)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD677229S1 (en) * 2009-11-30 2013-03-05 Nichia Corporation Light emitting diode
USD677228S1 (en) * 2010-04-09 2013-03-05 Nichia Corporation Light emitting diode
USD658601S1 (en) * 2010-06-15 2012-05-01 Toshiba Lighting & Technology Corporation Light emitting diode module
USD658602S1 (en) * 2010-06-15 2012-05-01 Toshiba Lighting & Technology Corporation Light emitting diode module
USD658605S1 (en) * 2010-06-15 2012-05-01 Toshiba Lighting & Technology Corporation Light emitting diode module
USD658600S1 (en) * 2010-06-15 2012-05-01 Toshiba Lighting & Technology Corporation Light emitting diode module
JP5612991B2 (ja) * 2010-09-30 2014-10-22 シャープ株式会社 発光装置及びこれを備えた照明装置
EP2448028B1 (en) * 2010-10-29 2017-05-31 Nichia Corporation Light emitting apparatus and production method thereof
DE102011018921B4 (de) * 2011-04-28 2023-05-11 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Träger, optoelektronisches Bauelement mit Träger und Verfahren zur Herstellung dieser
WO2013054483A1 (ja) * 2011-10-11 2013-04-18 パナソニック株式会社 発光装置およびこれを用いた照明装置
US10043960B2 (en) * 2011-11-15 2018-08-07 Cree, Inc. Light emitting diode (LED) packages and related methods
JP2013118292A (ja) 2011-12-02 2013-06-13 Citizen Electronics Co Ltd Ｌｅｄ発光装置
KR101287544B1 (ko) 2012-01-27 2013-07-19 금호전기주식회사 씨오비형 엘이디 패키지
KR20140123976A (ko) * 2012-02-10 2014-10-23 크리,인코포레이티드 리드 상에 전극 마크를 갖는 발광장치, 패키지, 및 관련 방법
JPWO2013150882A1 (ja) * 2012-04-06 2015-12-17 シチズン電子株式会社 Ｌｅｄ発光装置
TWI475664B (zh) * 2012-06-04 2015-03-01 用於產生對稱性均勻混光光源的多晶片封裝結構
WO2014024627A1 (ja) * 2012-08-06 2014-02-13 シャープ株式会社 発光装置および発光装置の製造方法
US8872294B2 (en) * 2012-08-21 2014-10-28 Micron Technology, Inc. Method and apparatus for reducing signal loss in a photo detector
US9171826B2 (en) 2012-09-04 2015-10-27 Micron Technology, Inc. High voltage solid-state transducers and solid-state transducer arrays having electrical cross-connections and associated systems and methods
CN204577466U (zh) * 2012-09-26 2015-08-19 松下知识产权经营株式会社 发光模块
TWI482311B (zh) 2012-10-19 2015-04-21 Univ Nat Sun Yat Sen 三族氮化物量子井結構及其製造方法
US20140167083A1 (en) * 2012-12-19 2014-06-19 Avago Technologies General Ip (Singapore) Pte. Ltd. Led package with integrated reflective shield on zener diode
JP2014187081A (ja) * 2013-03-22 2014-10-02 Nichia Chem Ind Ltd 発光装置
JP6476567B2 (ja) 2013-03-29 2019-03-06 日亜化学工業株式会社 発光装置
CN104425694A (zh) * 2013-08-29 2015-03-18 展晶科技(深圳)有限公司 发光二极管封装结构及其制造方法
JP6213428B2 (ja) 2014-03-12 2017-10-18 豊田合成株式会社 発光装置及びその製造方法
KR102145919B1 (ko) * 2014-05-30 2020-08-19 엘지이노텍 주식회사 발광 소자 패키지
CN109904147B (zh) * 2014-09-05 2023-04-11 光宝光电(常州)有限公司 基板及包含所述基板的发光装置
JP6583764B2 (ja) * 2014-09-12 2019-10-02 パナソニックＩｐマネジメント株式会社 発光装置、及び照明装置
USD770987S1 (en) 2014-10-17 2016-11-08 Panasonic Intellectual Property Management Co., Ltd. Light emitting diode
TW201631808A (zh) * 2015-02-25 2016-09-01 隆達電子股份有限公司 發光二極體晶片封裝體
JP6646969B2 (ja) * 2015-08-03 2020-02-14 シチズン電子株式会社 発光装置
JP6610866B2 (ja) 2015-08-31 2019-11-27 パナソニックＩｐマネジメント株式会社 発光装置、及び照明装置
USD815593S1 (en) * 2016-04-21 2018-04-17 Scosche Industries, Inc. Battery pack with magnetic attachment
US10290777B2 (en) 2016-07-26 2019-05-14 Cree, Inc. Light emitting diodes, components and related methods
CN106206669B (zh) * 2016-08-31 2018-12-07 昆山维信诺科技有限公司 用于异形oled产品的布线方法以及异形oled产品
KR102701861B1 (ko) 2016-11-15 2024-09-04 삼성디스플레이 주식회사 발광장치 및 그의 제조방법
DE102017106407B4 (de) 2017-03-24 2025-04-10 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung von optoelektronischen Halbleiterbauteilen
CN107248510A (zh) * 2017-06-14 2017-10-13 厦门煜明光电有限公司 一种带有齐纳二极管保护的cob封装结构
KR102342853B1 (ko) 2017-07-21 2021-12-23 삼성전자주식회사 수직형 메모리 소자를 구비한 집적회로 소자
US11121298B2 (en) 2018-05-25 2021-09-14 Creeled, Inc. Light-emitting diode packages with individually controllable light-emitting diode chips
EP3582263B1 (de) * 2018-06-15 2023-03-29 Arnold & Richter Cine Technik GmbH & Co. Betriebs KG Lichterzeugende baugruppe für einen scheinwerfer sowie scheinwerfer
US11233183B2 (en) 2018-08-31 2022-01-25 Creeled, Inc. Light-emitting diodes, light-emitting diode arrays and related devices
USD902448S1 (en) 2018-08-31 2020-11-17 Cree, Inc. Light emitting diode package
US11335833B2 (en) 2018-08-31 2022-05-17 Creeled, Inc. Light-emitting diodes, light-emitting diode arrays and related devices
KR102659254B1 (ko) 2018-12-26 2024-04-22 엘지전자 주식회사 반도체 발광소자를 이용한 램프
US11101411B2 (en) 2019-06-26 2021-08-24 Creeled, Inc. Solid-state light emitting devices including light emitting diodes in package structures
US11083059B2 (en) * 2019-10-03 2021-08-03 Creeled, Inc. Lumiphoric arrangements for light emitting diode packages
WO2022131885A1 (ko) * 2020-12-18 2022-06-23 서울바이오시스주식회사 발광 다이오드 패키지
US12300972B2 (en) * 2021-01-21 2025-05-13 Nichia Corporation Light emitting device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100401601C (zh) * 2003-10-21 2008-07-09 夏普株式会社 半导体激光器件
JP4981342B2 (ja) * 2006-04-04 2012-07-18 日立協和エンジニアリング株式会社 サブマウントおよびその製造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002261333A (ja) 2001-03-05 2002-09-13 Toyoda Gosei Co Ltd 発光装置
JP4124638B2 (ja) * 2002-12-16 2008-07-23 順一 島田 Ｌｅｄ照明システム
US7717589B2 (en) 2003-11-25 2010-05-18 Panasonic Electric Works Co., Ltd. Light emitting device using light emitting diode chip
US7081667B2 (en) * 2004-09-24 2006-07-25 Gelcore, Llc Power LED package
JP4241658B2 (ja) 2005-04-14 2009-03-18 シチズン電子株式会社 発光ダイオード光源ユニット及びそれを用いて形成した発光ダイオード光源
CN2814677Y (zh) * 2005-06-03 2006-09-06 明达光电(厦门)有限公司 带凹槽式基板的发光二极管
JP5214128B2 (ja) * 2005-11-22 2013-06-19 シャープ株式会社 発光素子及び発光素子を備えたバックライトユニット
TWI284433B (en) 2006-02-23 2007-07-21 Novalite Optronics Corp Light emitting diode package and fabricating method thereof
JP5192672B2 (ja) * 2006-08-28 2013-05-08 パナソニック株式会社 Ｌｅｄユニット
TW200837925A (en) * 2007-01-11 2008-09-16 Matsushita Electric Industrial Co Ltd Light source
JP4879794B2 (ja) * 2007-03-27 2012-02-22 シャープ株式会社 発光装置
JP5286585B2 (ja) * 2007-10-05 2013-09-11 シャープ株式会社 発光装置
JP5119917B2 (ja) * 2007-12-28 2013-01-16 日亜化学工業株式会社 発光装置
US8049237B2 (en) * 2007-12-28 2011-11-01 Nichia Corporation Light emitting device
JP2009289810A (ja) * 2008-05-27 2009-12-10 Toshiba Lighting & Technology Corp 照明装置
JP5345363B2 (ja) 2008-06-24 2013-11-20 シャープ株式会社 発光装置
JP5404009B2 (ja) * 2008-11-20 2014-01-29 シャープ株式会社 発光装置
JP2010244977A (ja) * 2009-04-09 2010-10-28 Renesas Electronics Corp 半導体装置
JP5623062B2 (ja) * 2009-11-13 2014-11-12 シャープ株式会社 発光装置およびその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100401601C (zh) * 2003-10-21 2008-07-09 夏普株式会社 半导体激光器件
JP4981342B2 (ja) * 2006-04-04 2012-07-18 日立協和エンジニアリング株式会社 サブマウントおよびその製造方法

Also Published As

Publication number Publication date
JP2011238902A (ja) 2011-11-24
US10707188B2 (en) 2020-07-07
CN102237483A (zh) 2011-11-09
US20160111402A1 (en) 2016-04-21
US9245873B2 (en) 2016-01-26
US20110254022A1 (en) 2011-10-20
TW201205886A (en) 2012-02-01
US20180012875A1 (en) 2018-01-11
JP5768435B2 (ja) 2015-08-26
US9786637B2 (en) 2017-10-10
TWI565099B (zh) 2017-01-01

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