WO2013054483A1 - 発光装置およびこれを用いた照明装置 - Google Patents
発光装置およびこれを用いた照明装置 Download PDFInfo
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- WO2013054483A1 WO2013054483A1 PCT/JP2012/006227 JP2012006227W WO2013054483A1 WO 2013054483 A1 WO2013054483 A1 WO 2013054483A1 JP 2012006227 W JP2012006227 W JP 2012006227W WO 2013054483 A1 WO2013054483 A1 WO 2013054483A1
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- light emitting
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- emitting device
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Definitions
- a plurality of LEDs 520 are arranged in a row on a substrate 510 formed in an elongated rectangular plate shape, and electrodes are arranged on both sides in the short direction of the substrate 510 with respect to each element row.
- a light emitting device 501a having a configuration in which pads 541a and 542a are disposed and the electrode pads 541a and 542a and the LEDs 520 are electrically connected by wires 595 is conceivable.
- the electrode pad 541a constitutes a part of the first wiring 541
- the electrode pad 542a constitutes a part of the second wiring 542
- the LED 520 includes the first wiring 541, the second wiring 542, and the like.
- the wires 595 are connected in parallel to each other.
- the LED 520 and the electrode pads 541a and 542a are sealed with a sealing member 530 in order to prevent oxidation and corrosion.
- the configuration shown in FIG. 18B solves this problem.
- the electrode pads 541a and 542a are disposed close to the LED 520, the length of the sealing member 530 in the short direction of the substrate 510 can be shortened.
- an insulating film having a high light reflectivity is formed on the surface of the substrate 510 on which the LED 520 is mounted in order to reflect the light emitted from the LED 520.
- the wirings 541 and 542 have lower light reflectance in the visible light region than the insulating film formed over the substrate 510. Therefore, in the light emitting device 501b, the electrode pads 541a and 542a which are part of the wirings 541 and 542 are close to the LED 520, and light emitted from the LED 520 is absorbed by the electrode pads 541a and 542a, so that light extraction efficiency is low.
- FIGS. 19A and 19B are diagrams showing the positional relationship between the intensity distribution of light emitted from the LED 520 and the electrode pads 541a and 542a.
- FIG. 19A corresponds to the configuration of FIG. 18C
- FIG. 19B corresponds to the configuration of FIG. 18B.
- a region surrounded by an alternate long and short dash line is a region where the intensity distribution of light emitted from the LED 520 is 1 / e or more of the maximum light intensity (hereinafter referred to as “effective region”). ).
- the light emitting device 501c in FIG. 18C has a longer distance WW between the electrode pads 541a and 542a than the light emitting device 501b in FIG. 18B, and the average light reflection in the entire effective region. Since the rate is high, the extraction efficiency of the light emitted from the LED 520 is good.
- a protection element for preventing an overvoltage (for example, surge voltage) larger than a rated voltage from being applied to each LED is generally provided.
- An example of this protective element is a Zener diode.
- This Zener diode also needs to be sealed with a sealing member in order to prevent corrosion and the like, similar to an LED.
- the Zener diode 560 is provided in the light-emitting device 501c as illustrated in FIG.
- the Zener diode 560 in order to provide the Zener diode 560, the distance between the electrode pads is short, so it is necessary to widen the distance only by this portion.
- the Zener diode 560 is disposed by shortening the distance between the electrode pads 541a and 542a for a part of the plurality of LEDs 520 (fourth and fifth LEDs 520 from the left end in FIG. 18D).
- a space is provided, and a Zener diode 560 is disposed in the space.
- the interval WZ between the electrode pads 541a and 542a, one of which is electrically connected to the Zener diode 560, is shorter than the interval WW between the other electrode pads 541a and 542a.
- the present invention has been made in view of the above-described problems, and an object thereof is to provide a light-emitting device capable of suppressing luminance unevenness.
- a light-emitting device includes a substrate, a plurality of light-emitting elements arranged in a row on the substrate, and a light-emitting element formed on the substrate along the column direction.
- a pair of electrode pads provided on both sides of each light emitting element, one for each group of unit light emitting elements continuous in the column direction, and between any two adjacent light emitting elements in the group
- a protective element disposed between the two electrode pads positioned, and a sealing member provided on the substrate in a form for sealing the light emitting element, the electrode pad, and the protective element.
- the distance between the pair of electrode pads provided on both sides along the column direction is other than the position where the distance between the pair of electrode pads provided at the closest position to the protective element is the shortest and closest to the protective element.
- a pair of power supplies provided at two locations Interval of the pad with each other are different from each other.
- a pair of electrode pads provided on both sides along the column direction for each light emitting element is a pair provided at two places other than the position closest to the protective element.
- the electrode pads have different intervals.
- FIG. 1 is a perspective view showing a part of a light emitting device 1 according to Embodiment 1.
- FIG. 1 shows a part of a light-emitting device 1 according to Embodiment 1, wherein (a) is a cross-sectional view taken along line AA in FIG. 1, and (b) is a cross-sectional view taken along line BB in FIG. It is. 1 shows a light-emitting device 1 according to Embodiment 1, wherein (a) is a plan view and (b) is an enlarged view of a portion surrounded by a one-dot chain line in (a).
- 1 is a circuit diagram of a light emitting device 1 according to Embodiment 1.
- FIG. 1 shows a part of a light-emitting device 1 according to Embodiment 1, wherein (a) is a cross-sectional view taken along line AA in FIG. 1, and (b) is a cross-sectional view taken along line BB in FIG. It is. 1 shows a light
- FIG. 6 is a diagram for explaining a method of manufacturing the light-emitting device 1 according to Embodiment 1.
- FIG. 6 is a perspective view showing a part of a light emitting device 2 according to Embodiment 2.
- FIG. The light-emitting device 2 which concerns on Embodiment 2 is shown, (a) is a top view, (b) is the figure which expanded the part enclosed with the dashed-dotted line in (a).
- FIG. 10 is an exploded perspective view of lighting device 1001 according to Embodiment 3.
- 10 is a schematic cross-sectional view of a liquid crystal display device 2001 according to Embodiment 4.
- FIG. About the light-emitting device which concerns on a modification (a) is a schematic plan view which shows a part, (b) is the position of each circuit U1 thru
- About the light-emitting device which concerns on a modification (a) is a schematic plan view which shows a part, (b) is the position of each circuit U1 thru
- (A) is the figure which showed the relationship between the position of each circuit U1 thru
- (b) is other It is the figure which showed the relationship between the position of each circuit U1 thru
- (A) is the figure which showed the relationship between the position of each circuit U1 thru
- (b) is other It is the figure which showed the relationship between the position of each circuit U1 thru
- interval of electrode pads in the light-emitting device which concerns on this modification. It is a figure for demonstrating the illuminating device which concerns on a modification. It is a schematic plan view of the light-emitting device which concerns on a modification. It is a schematic plan view of the illuminating device which concerns on a modification. 1 is a schematic plan view of a light emitting device for explaining a problem to be solved by the invention. It is a figure for demonstrating the subject which invention will solve.
- FIG. 1 is a perspective view showing a part of a light emitting device 1 according to the present embodiment.
- 2A is a view of the cross section taken along the line AA ′ in FIG. 1 as viewed from the direction of the arrow
- FIG. 2B is a cross-sectional view taken along the line BB ′ in FIG.
- FIG. 3A is a diagram showing the entire light emitting device 1
- FIG. 3B is an enlarged view of a part of the light emitting device 1.
- the light emitting device 1 includes a substrate 110, a plurality of LEDs (light emitting elements) 120, a first wiring 140a, a second wiring 140b, a Zener diode 160, and a sealing member 130. .
- the substrate 110 is formed in a long rectangular plate shape, and is viewed from a direction orthogonal to the surface 110a on which the LEDs 120 are provided (hereinafter referred to as the following). , Referred to as “plan view”), the length in the short direction (the X direction in FIGS. 1 and 3A) is about 15 mm, and the long direction (the Y direction in FIGS. 1 and 3A). Is approximately 300 mm long. Further, as shown in FIGS. 2A and 2B, the substrate 110 is formed on the entire surface of the plate material 111 made of a metal such as aluminum and the white polycarbonate resin, and is emitted from the LED 120. And an insulating film 112 that reflects light.
- the material used for the substrate 110 and the shape of the substrate 110 are not particularly limited.
- the material used for the substrate 110 is preferably a material that has high reflectivity with respect to light emitted from the LED 120 and good heat dissipation. Examples of such a material include ceramics such as alumina.
- the substrate 110 may be formed in any shape that can be formed by combining a line and a curvature. Specifically, there are polygons such as squares and hexagons, circles and ellipses.
- Each LED 120 is a GaN-based LED that emits blue light. As shown in FIG. 1, the LEDs 120 are arranged in a row on the substrate 110. Here, each LED 120 is mounted on the substrate 110 with a surface on which an electrode (not shown) is provided on a side opposite to the side in contact with the substrate 110 (in a so-called face-up state). Further, as shown in FIGS. 2A and 2B, the LED 120 is electrically connected to a pair of electrode pads 141 a and 142 a provided on both sides in the column direction of the LED 120 via wires 195.
- the wire 195 is made of, for example, gold, and has one end bonded to the electrode pads 141a and 142a and the other end bonded to the electrode of the LED 120 by a well-known wire bonding method.
- the extending direction of each wire 195 is along the column direction of the element column composed of the plurality of LEDs 120.
- the force along the column direction of the element row is applied to the wire 195 by the expansion and contraction in the longitudinal direction of the sealing member 130
- the wire 195 is not easily twisted even if the is added.
- the electrode pad 141a constitutes a part of the first wiring 140a
- the electrode pad 142a constitutes a part of the second wiring 140b.
- the LED 120 has a rectangular shape in plan view, and the length CS1 in the short side direction and the length CS2 in the long side direction in the plan view are 0.3 to 0.3 respectively.
- 1.0 mm, and thickness CS3 is 0.08 to 0.30 mm.
- 72 LEDs 120 are arranged in a row on the substrate 110.
- the number of LEDs 120 is not limited to 72, and may be more than 72 or less than 72.
- the first wiring 140 a and the second wiring 140 b are formed on the substrate 110 along the longitudinal direction of the substrate 110.
- the wirings 140a and 140b are made of a metal material such as Ag or Cu, for example.
- the material of the wirings 140a and 140b is not limited to a metal material, and may be formed from a semiconductor material such as silicon or other conductive material, for example.
- the first wiring 140a is composed of eight first partial wirings 141, 143, 145, 147, 149, 151, 153, and 155 arranged in the longitudinal direction of the substrate 110.
- the second wiring 140 b includes eight second partial wirings 142, 144, 146, 148, 150, 152, 154, 156 arranged in the longitudinal direction of the substrate 110.
- Each of the first partial wirings 141 and 155 has connector mounting pads 190 and 191 for mounting two connectors (not shown).
- the two connectors are for electrically connecting two lead wires (not shown) derived from a power supply circuit (not shown) and the first partial wirings 141 and 155, respectively. is there.
- FIG. 4 shows a circuit block diagram of the light emitting device 1 according to this embodiment.
- the first partial wiring 141, the second partial wiring 142, and a group of nine LEDs 120 constitute a first circuit U1 in which nine LEDs 120 are connected in parallel. .
- a group consisting of nine LEDs 120 from the first partial wirings 143, 145, 147, 149, 151, 153, 155 and the second partial wirings 144, 146, 148, 150, 152, 154, 156, respectively. are connected in parallel to form a second circuit U2, a third circuit U3, a fourth circuit U4, a fifth circuit U5, a sixth circuit U6, a seventh circuit U7, and an eighth circuit U8.
- the first partial wiring 141 constituting a part of the first circuit U1 is electrically connected to one terminal C1 of the two connectors via the connector mounting pad 190, and one of the eighth circuits U8.
- the first partial wiring 155 constituting the part is electrically connected to the terminal C2 of the other connector via the connector mounting pad 191.
- the first partial wiring 143 is formed in an elongated rectangular shape in plan view and extends in the longitudinal direction of the substrate 110, and is elongated in plan view.
- leg portions 143b which are continuous with the main portion 143c at one end and the other end portion is disposed on the LED 120 side in the short side direction of the substrate 110, and each leg portion is formed in a rectangular shape in plan view.
- Electrode pad 143a arranged in a continuous manner with the other end of 143b.
- the first partial wiring 143 is continuous with the main portion of the first partial wiring 145 at one end portion in the longitudinal direction of the main portion 143c, and the other end portion on the opposite side to the one end portion in the longitudinal direction of the main portion 143c.
- the inspection pad 173 is arranged in a continuous manner.
- the inspection pad 173 corresponds to a second electrode pad different from the first electrode pad when the electrode pad 143a is the first electrode pad.
- the first electrode pad and the second electrode pad have different uses.
- the first partial wirings 145, 147, 149, 151, and 153 have the same configuration as the first partial wiring 143, and have inspection pads 175, 177, 179, 181, and 183. Note that the first partial wirings 145, 147, 149, 151, and 153 have the same configuration as the first partial wiring 143, and thus description thereof is omitted.
- the first partial wiring 141 includes a first main portion 141c1, a second main portion 141c2, two first sub portions 141c3, and a second The sub-portion 141c4, two extending portions 141c5, nine leg portions 141b, and nine electrode pads 141a are included.
- the first main portion 141c1 and the second main portion 141c2 are formed in an elongated rectangular shape in plan view, and both extend along the longitudinal direction of the substrate 110.
- the two first sub-portions 141c3 extend from the opposite ends of the first main portion 141c1 and the second main portion 141c2 to the opposite side of the LED 120 in the short direction of the substrate 110.
- the second sub-portion 141c4 is formed in a rectangular shape in plan view, extends along the longitudinal direction of the substrate 110, and is continuous with the first main portion 141c1 and the second main portion 141c2 in the two sub-portions 141c3. Connects the opposite ends.
- the two extending portions 141c5 extend from the second sub portion 141c4 to both sides in the short direction.
- the nine leg parts 141b are formed in an elongated rectangular shape in plan view, and are continuous with the first main part 141c1 or the second main part 141c2 at one end and extended in the short direction of the substrate 110.
- the nine electrode pads 141a are formed in a rectangular shape in plan view, and are arranged so as to be continuous with the other end portions of the leg portions 141b.
- the second main portion 141c2 is located closer to the first partial wiring 143 than the second main portion 141c1, and an inspection pad 171 is continuously provided at an end facing the first partial wiring 143. is doing.
- the inspection pad 171 is a member that supplies power to the LED 120, but is not an electrode pad that is used when the LED 120 is constantly lit, but an electrode pad that is used to check whether there is any problem in the lighting condition of the LED 120.
- the extending portion 141c5 disposed on the side close to the LED 120 is located inside the region surrounded by the first sub-portion 141c3 and the second sub-portion 141c4.
- a connector mounting pad having a rectangular shape in plan view for mounting a connector (not shown) is provided at the tip of each of the extending portions 141c1 and the end of the second sub-portion 141c4 on the side close to the inspection pad 171. 190 is formed.
- the first partial wiring 155 has the same configuration as the first partial wiring 141, and includes an inspection pad 185 and a connector mounting pad 191.
- the first partial wiring 155 and the connector mounting pad 191 have the same configuration as the first partial wiring 141 and the connector mounting pad 190, and thus description thereof is omitted.
- the connector is electrically connected to each of two lead wires (not shown) derived from a power supply circuit (not shown), and the two connectors are connected to the connector mounting pads 190 and 191 respectively. When mounted, the connector mounting pads 190 and 191 and the lead wires of the power supply circuit can be electrically connected. Then, DC power is supplied between the two connector mounting pads 190 and 191 from the power supply circuit.
- the second partial wiring 142 has a main portion 142c that is formed in an elongated rectangular shape in plan view and extends in the longitudinal direction of the substrate 110, and in plan view. And 9 leg portions 142b arranged on the LED 120 side in the short side direction of the substrate 110 and formed in a rectangular shape in plan view.
- the electrode pad 142a is arranged continuously with the other end of the leg 142b.
- the second partial wiring 142 is connected to the main portion 144c of the second partial wiring 144 at one end in the longitudinal direction of the main portion 142c, and the other end opposite to the one end in the longitudinal direction of the main portion 142c.
- An inspection pad 172 is disposed in a continuous manner with the portion.
- the second partial wirings 144, 146, 148, 150, 152, 154, 156 also have the same configuration as the second partial wiring 142, and the inspection pads 174, 176, 178, 180, 182, 184, 186.
- the second partial wirings 144, 146, 148, 150, 152, 154, and 156 have the same configuration as the second partial wiring 142, and thus the description thereof is omitted.
- the connector mounting pad 191 to the connector mounting pad are connected during wiring from the connector mounting pad 190 to the connector mounting pad 191.
- the configuration is such that there is no wiring extended in the direction returning to 190 (so-called return wiring). Accordingly, since the number of wirings arranged in the short direction of the substrate 110 can be reduced, the length of the substrate 110 in the short direction can be reduced correspondingly, and the light emitting device 1 can be downsized. be able to.
- the first partial wirings 141, 143, 145, 147, 149, 151, 153, 155 and the second partial wirings 142, 144, 146, 148, 150, 152, 154, 156 are electrode pads, test pads, and The portions excluding the connector mounting pad are covered with a protective film (not shown) made of glass. Thereby, corrosion of the first partial wiring and the second partial wiring is suppressed, and adhesion to the substrate is improved.
- the test pads 171 to 186 of this embodiment are for measuring the resistance value between both ends of the first circuit U1 to the eighth circuit U8. For example, it is possible to detect a leakage failure of the nine LEDs 120 constituting the first circuit U1 by inspecting a change in resistance value between both ends of the first circuit U1. For example, if the leakage current of any one LED 120 increases and the resistance value decreases, the resistance value of the entire first circuit U1 decreases accordingly, so that the occurrence of a failure can be detected. Further, the inspection pads 171 to 186 are provided in each circuit of the first circuit U1 to the eighth circuit U8. Thereby, the failure of the LED 120 can be detected with higher accuracy than in the configuration in which a pair of test pads is provided for all the LEDs 120 constituting the first circuit U1 to the eighth circuit U8.
- the inspection pads 171 to 186 are not arranged on the current path from the connector mounting pad 190 to the connector mounting pad 191 via each LED 120. Therefore, for example, when an inspection is performed using an inspection apparatus, the inspection apparatus probes 171 to 186 are partly shaved by the probe of the inspection apparatus being in pressure contact with the inspection pads 171 to 186, so that the inspection pads 171 to 186 are removed. Even if the portion has a high resistance, the above-described current path is not affected. That is, even when a part of the inspection pads 171 to 186 is scraped by a probe or the like of the inspection apparatus at the time of inspection, the luminance performance or the like of the light emitting device 1 is not affected.
- the Zener diode 160 includes an electrode pad 141a that is continuous with the leg portion 141b1 located at the end of the first partial wiring 141 on the second circuit U2 side, and a second portion. In the wiring 142, it arrange
- the Zener diode 160 is electrically connected to the electrode pads 141a and 142a disposed at the tip portions of the leg portions 141b1 and 142b1 through wires 195. As shown in FIG. 4, one zener diode 160 is provided in each of the first circuit U1 to the eighth circuit U8 so as to be connected in parallel with the LED 120.
- the Zener diode 160 corresponding to the first circuit U1 is electrically connected to the electrode pad 141a that is continuous with the leg portion 141b1 disposed at the position closest to the second circuit U2 in the first partial wiring 141. Is arranged.
- the Zener diode 160 corresponding to the second circuit U2 is disposed in a state of being electrically connected to the electrode pad continuous with the leg portion 143b1 disposed at the position closest to the first circuit U1 in the first partial wiring 143. Yes.
- the Zener diode 160 corresponding to the third circuit U3 is disposed in a state of being electrically connected to the electrode pad continuous with the leg portion 145b1 disposed at the position closest to the fourth circuit U4 in the first partial wiring 145. Yes.
- the Zener diode 160 corresponding to the fourth circuit U4 is disposed in a state of being electrically connected to the electrode pad continuous to the leg portion 147b1 disposed in the first partial wiring 147 at the position closest to the third circuit U3. Yes.
- the Zener diode 160 corresponding to the fifth circuit U5 is disposed in a state of being electrically connected to the electrode pad continuous with the leg portion 149b1 disposed at the position closest to the sixth circuit U6 in the first partial wiring 149.
- the Zener diode 160 corresponding to the sixth circuit U6 is disposed in a state of being electrically connected to the electrode pad continuous with the leg portion 151b1 disposed at the position closest to the fifth circuit U5 in the first partial wiring 151. Yes.
- the Zener diode 160 corresponding to the seventh circuit U7 is disposed in a state of being electrically connected to the electrode pad continuous to the leg portion 153b1 disposed at the position closest to the eighth circuit U8 in the first partial wiring 153. Yes.
- the Zener diode 160 corresponding to the eighth circuit U8 is disposed in a state of being electrically connected to the electrode pad continuous to the leg portion 155b1 disposed in the first partial wiring 155 at the position closest to the seventh circuit U7. Yes.
- the sealing member 130 includes 72 LEDs 120, a pair of electrode pads provided for each LED 120, and between the LED 120 and the electrode pad. Are arranged along the longitudinal direction of the substrate 110 so as to cover all the wires 195 connecting the two.
- the sealing member 130 is formed of a translucent resin material containing a phosphor.
- this translucent resin material for example, silicone resin, fluorine resin, silicone-epoxy hybrid resin, urea resin, or the like can be used.
- the phosphor examples include YAG phosphor ((Y, Gd) 3 Al 5 O 12 : Ce 3+ ), silicate phosphor ((Sr, Ba) 2 SiO 4 : Eu 2+ ), and nitride.
- Phosphors ((Ca, Sr, Ba) AlSiN 3 : Eu 2+ ) and oxynitride phosphors (Ba 3 Si 6 O 12 N 2 : Eu 2+ ) can be used.
- white light is obtained by mixing the blue light emitted from each LED 120 and the yellow-green emitted by converting a part of the blue light by the phosphor.
- the sealing member 130 does not necessarily contain a phosphor.
- the LED 120, the electrode pad, and the wire 195 are sealed by the sealing member 130, so that the LED 120, the electrode pad, and the wire 195 can be prevented from being deteriorated.
- the sealing member 130 has a width FW of 0.8 mm to 3.0 mm in the short direction of the substrate 110 (X-axis direction in FIG. 2). Further, the maximum thickness (width in the Z-axis direction) T1 including the LED 120 of the sealing member 130 is 0.4 mm to 1.5 mm, and the maximum thickness T2 excluding the LED 120 is 0.2 mm to 1.3 mm. In order to ensure the sealing reliability of the sealing member 130, the width FW of the sealing member 130 is preferably 2 to 7 times the width CS1 of the LED 120.
- the sealing member 130 has a substantially semi-elliptical cross-sectional shape along the short direction of the substrate 110. Moreover, the end part 130a in the longitudinal direction of the sealing member 130 is formed in a curved surface shape. This makes it difficult for stress concentration to occur at the end portion 130 a of the sealing member 130, and facilitates extraction of light emitted from the LED 120 to the outside of the sealing member 130.
- the method of forming the sealing member 130 having the curved end 130a as described above is not particularly limited.
- the sealing member 130 can be easily formed by applying a paste-like sealing member precursor to a desired coating target (for example, the LED 120) using a dispenser.
- a desired coating target for example, the LED 120
- a method for forming the sealing member 130 using a dispenser will be described in detail later.
- a Zener diode 160 is provided at the end of the first partial wiring 141 on the second circuit U2 side.
- the electrode pad 141a that is continuous to the leg portion 141b1 that is positioned and the electrode pad 142a that is continuous to the leg portion 142b1 of the second partial wiring 142 that is positioned closest to the leg portion 141b1 are disposed.
- an electrode pad 141a constituting a part of the first partial wiring 141 and an electrode pad constituting a part of the second partial wiring 142, as shown in FIG. 142 a are alternately arranged in a line along the longitudinal direction of the substrate 110.
- the electrode pad 141a and the electrode pad 142a adjacent to the electrode pad 141a form one pair.
- each LED120 is arrange
- each circuit U1, U2,..., U8 electrode pads (for example, electrode pads 141a and 142a in the circuit U1) provided on both sides of each LED 120 are connected to each other.
- the intervals W1 to W9 are shortened as they approach the position where the Zener diode 160 is disposed. Specifically, the intervals W1, W2,..., W9 are shortened by a certain length in order.
- the electrodes provided on both sides of the LED 120A disposed at the position farthest from the second circuit U2 The distance W1 between the pads 141a and 142a is the longest, and the distance W9 between the electrode pads 141a and 142a provided on both sides of the LED 120H disposed at the position closest to the second circuit U2 is the shortest.
- interval of electrode pad 141a, 142a is decreasing gradually in order of LED120B, 120C, ..., 120I. That is, gradation is given to the interval between the electrode pads 141a and 142a.
- each LED 120 is disposed at a substantially central portion between the electrode pads 141a and 142a, the Zener diode 160 is disposed according to the interval between the electrode pads 141a and 142a. The closer it is, the shorter it is.
- each LED 120 is disposed at the center of the pair of electrode pads. And the space
- FIG. 5B shows the relationship between the positions of the circuits U1 to U8, the positions of the electrode pads in the circuits U1 to U8, and the distance between the electrode pads in the light emitting device 1 according to the present embodiment.
- the vertical axis indicates the length of the interval between the electrode pads
- the horizontal axis indicates the positions of the circuits U1 to U8 and the positions of the electrode pads in each circuit.
- FIGS. 3A and 3B for the positions of the circuits U1 to U8 on the horizontal axis and the positions of the electrode pads in the circuits U1 to U8.
- the light emitting device 1 reflecting the position of the Zener diode 160, between the first circuit U1 and the second circuit U2, between the third circuit U3 and the fourth circuit U4, The distances W1 to W9 between the electrode pads are shorter between the fifth circuit U5 and the sixth circuit U6 and closer to the seventh circuit U7 and the eighth circuit U8.
- 72 LEDs 120 are divided into eight circuits U1 to U8, and gradations are given to the lengths of the intervals between the electrode pads for each of the circuits U1 to U8.
- gradation can be given to the luminance of the portions corresponding to the circuits U1 to U8 in the light emitting device 1, so that luminance unevenness is less noticeable compared to a configuration having a portion where the luminance is locally reduced. Can do.
- a resin film made of polycarbonate which is a base of an insulating film, is attached to the plate material 111 by heat fusion or the like. Thereby, the substrate 110 composed of the plate material 111 and the insulating film 112 formed on the surface of the plate material 111 is formed. (See FIG. 6 (a)).
- the wirings 140a and 140b are formed by using a photolithography technique and an etching technique (FIG. 6). 6 (c)). Subsequently, a glass film (not shown) is formed so as to cover the entire substrate 110 and the wirings 140a and 140b, and further, electrode pads and connector mountings of the wirings 140a and 140b are formed by using a photolithography technique and an etching technique.
- the electrode pads and the connector mounting pads 190 are formed. , 191 and the part corresponding to the inspection pad are removed by etching. As a result, a protective film that covers the entire portion of the wirings 140a and 140b excluding the portion corresponding to the electrode pad, the connector mounting pads 190 and 191 and the inspection pad and the portion where the LED 120 is disposed is formed.
- the LED 120 is disposed on the substrate 110 (see FIG. 6D). At this time, LED120 is adhere
- the resin paste 135 is applied in a line shape along the element row including the 72 LEDs 120 (see arrow AR in FIG. 6F), and then the resin paste 135 is solidified.
- the sealing member 130 is formed (see FIG. 6G).
- the position of the two LEDs 120 at both ends in the column direction among the element columns composed of 72 LEDs 120 is grasped, and the center position in the short direction of the substrate 110 of each LED 120 is calculated. Then, the straight line passing through the calculated two center positions is recognized as the array axis of the element array composed of 72 LEDs 120, and dispensing is performed on the array axis.
- the method for sealing the element array in the present invention is not particularly limited. However, if the dispenser method is employed in this way, the LED 120, the electrode pad, the wire 195, which are arranged close to the substrate 110, are provided. Further, the Zener diode 160 is easily sealed in a lump, so that productivity can be improved, which is preferable.
- the viscosity of the resin paste 135 is preferably in the range of 20 to 60 Pa ⁇ sec. If it is smaller than this range, the shape of the resin paste 135 is broken immediately after the resin paste 135 is applied, and it is difficult to form the sealing member 130 having the shape as designed. If the shape of the sealing member 130 is not as designed, the emitted light may be uneven in color, and the wire 195 may be exposed from the sealing member 130 and the sealing reliability may not be maintained.
- the resin paste 135 relatively high viscosity of 20 to 60 Pa ⁇ sec, the end portion 130 a in the longitudinal direction of the sealing member 130 is formed into a curved shape, or the cross section along the short direction of the substrate 110.
- the shape can be made substantially semi-elliptical.
- the resin paste 135 is made to have a high viscosity, there is an advantage that the phosphor contained in the resin paste 135 is less likely to settle and color unevenness is less likely to occur in the emitted light.
- the resin paste 135 preferably contains 5 wt% or more of filler or phosphor.
- this filler for example, a white one can be used.
- the Shore A hardness of the sealing member 130 is 20 or more.
- the distance between the pair of electrode pads provided at the position closest to the Zener diode 160 is the shortest, and each LED 120 is disposed at the center of the pair of electrode pads.
- the density of the LEDs 120 in the vicinity of the Zener diode 160 is inevitably increased, and a decrease in luminance in the vicinity of the Zener diode 160 can be suppressed accordingly.
- gradation is given to the interval between the electrode pads 141a and 142a.
- the light extraction efficiency of the LED 120A disposed at the position farthest from the Zener diode 160 is the highest, and the light extraction efficiency of the LED 120H disposed at the position closest to the Zener diode 160 is obtained. Is the lowest.
- the light extraction efficiency gradually decreases in the order of the LEDs 120B, 120C,..., 120I, and the luminance gradually decreases accordingly.
- gradation is given to the luminance in each of the circuits U1, U2,..., U8, so that the reduction in luminance near the Zener diode 160 can be made less noticeable.
- each of the circuits U1, U2,..., U8 the light extraction efficiency due to the light emitted from the LED 120 being absorbed by the electrode pad decreases as it approaches the Zener diode 160.
- the amount of light increases as the degree increases.
- the luminance unevenness can be reduced in each of the circuits U1, U2,..., U8.
- the light emitting device 2 according to the present embodiment is substantially the same as the light emitting device 1 according to the first embodiment, and is different in that a plurality of LEDs 120 are arranged in two rows as shown in FIG.
- symbol is attached
- the first wiring 240 a and the second wiring 240 b are formed on the substrate 110 along the longitudinal direction of the substrate 110. Further, as shown in FIG. 8A, the first wiring 240a is composed of eight first partial wirings 241, 243, 245, 247, 249, 251, 253, and 255, and the second wiring 240b includes eight first wirings 240b. The second partial wirings 242, 244, 246, 248, 250, 252, 254, and 256 are included.
- the first partial wiring 243 has substantially the same shape as the first partial wiring 143 according to Embodiment 1, and the length of the electrode pad 243a in the short side direction of the substrate 110 is longer than that of the electrode pad 143a. Only the difference.
- the first partial wirings 241, 245, 247, 249, 251, and 253 have the same configuration as the first partial wiring 243, and thus the description thereof is omitted.
- the second partial wiring 242 has substantially the same shape as the second partial wiring 142 according to Embodiment 1, and the length of the electrode pad 242a in the short direction of the substrate 110 is longer than that of the electrode pad 142a. Only the difference.
- the second partial wirings 244, 246, 248, 250, 252, 254, and 256 have the same configuration as the second partial wiring 242 and will not be described.
- the Zener diode 160 is positioned at the end of the first partial wiring 241 on the second circuit U2 side.
- the leg portion 141b1 is disposed between the leg portion 141b1 and the leg portion 142b1 disposed in the second partial wiring 142 at a position closest to the leg portion 141b1.
- the distances W1 to W9 are shorter as they approach the position where the Zener diode 160 is disposed.
- the intervals W1, W2,..., W9 are shortened by a certain length in order.
- FIG. 9 is an exploded perspective view showing lighting device 1001 according to the present embodiment.
- the lighting device 1001 includes the light-emitting device 1 according to Embodiment 1, an elongated housing 1010 that houses the light-emitting device 1, a globe 1020 that is attached to the housing 1010, and a housing
- the bases 1030a and 1030b are attached to both ends in the longitudinal direction of 1010.
- the casing 1010 includes an elongated rectangular main piece 1010a, a sub-piece 1010b projecting in one direction along the thickness direction of the main piece 1010a from both sides in the short direction of the main piece 1010a, and two sub-pieces 1010b. , And a flange portion 1010c that protrudes in a direction perpendicular to the sub-piece 1010b and away from the other end on the opposite side to the one end continuous with the main piece 1010a. And the light-emitting device 1 is arrange
- the globe 1020 is elongated and the length in the longitudinal direction is substantially the same as the length of the housing 1010.
- the globe 1020 has a U-shaped cross section perpendicular to the longitudinal direction, and has an elongated opening 1020a along the longitudinal direction.
- the opening end part 1020b of the globe 1020 is provided with a collar part 1020c protruding in a direction approaching each other.
- the globe 1020 is attached so as to cover the side where the light emitting device 1 is disposed in the housing 1010 by hooking the collar 1020c on the collar 1010c provided on the sub-piece 1010b of the housing 1010. .
- the bases 1030a and 1030b are attached to both ends of the housing 1010 in a state where the globe 1020 is attached to the housing 1010.
- the light emitting device 1 according to the first embodiment is described as being provided.
- the present invention is not limited to this, and the light emitting device 2 according to the second embodiment is used instead of the light emitting device 1. It may be provided.
- FIG. 10 is a cross-sectional view showing the liquid crystal display device according to the present embodiment.
- the liquid crystal display device 2001 includes an edge light type backlight unit 2010, an active matrix type liquid crystal panel 2020, and a housing 2030 for housing the backlight unit 2010 and the liquid crystal panel 2020.
- the backlight unit 2010 includes a casing 2011 including a main body 2011a and a front frame 2011b, a reflection sheet 2012, a light guide plate 2013, a diffusion sheet 2014, a prism sheet 2015, a polarizing sheet 2016, a heat sink 2017, and a lighting circuit. 2018 and the light-emitting device 1 described in Embodiment 1.
- the light emitting device 1 is disposed in a state where the surface 110a side of the substrate 110 on which the sealing member 130 is disposed is opposed to the light incident surface 1013a of the light guide plate 1013.
- the light emitting device 1 according to the first embodiment is described as being provided.
- the present invention is not limited to this, and the light emitting device 2 according to the second embodiment is used instead of the light emitting device 1. It may be provided.
- each of the eight Zener diodes 160 has a boundary between the first circuit U1 and the second circuit U2, the third circuit U3, and the fourth circuit U4.
- the electrode pads 141a, the electrode pads 141a are arranged close to the boundary, the boundary between the fifth circuit U5 and the sixth circuit U6, and the boundary between the seventh circuit U7 and the eighth circuit U8.
- the intervals W1 to W9 between 142a reflect the position of the Zener diode 160, between the first circuit U1 and the second circuit U2, between the third circuit U3 and the fourth circuit U4, and between the fifth circuit U5 and the sixth circuit U6.
- the example in which the distance between the circuit U6 and the distance between the seventh circuit U7 and the eighth circuit U8 becomes shorter has been described. However, the present invention is not limited to this.
- each of the eight Zener diodes 160 is disposed close to a substantially central portion in the longitudinal direction (the Y-axis direction in FIGS. 11A and 11B) of each of the circuits U1 to U8 (see FIG. 11).
- the intervals W1 to W9 between the electrode pads 141a and 142a reflect the position of the Zener diode 160 in each circuit. It may be shorter as it approaches the approximate center of each of U1 to U8.
- each of the eight Zener diodes 160 includes the first circuit U1, the second circuit U2, the third circuit U3, the fourth circuit U4, the fifth circuit U5, the sixth circuit U6, the seventh circuit U7, and the eighth circuit U8.
- Each is disposed at either one of both ends in the longitudinal direction of the substrate 110 (the Y-axis direction in FIGS. 12A and 12B) (see FIG. 12A), and FIGS. 12A and 12B.
- the distances W1 to W9 between the electrode pads 141a and 142a reflect the position of the Zener diode 160, and the substantially central portions of the circuits U1 to U8 are the longest, It may be shorter as it approaches the end of each of the circuits U1 to U8.
- each of the eight Zener diodes 160 is near the end of the first circuit U1 opposite to the second circuit U2 side, the boundary between the second circuit U2 and the third circuit U3, the fourth circuit U4 and the fifth circuit.
- U5 a boundary between the sixth circuit U6 and the seventh circuit U7, and an end portion of the eighth circuit U8 in the vicinity of the end opposite to the seventh circuit U7 side, as shown in FIG.
- each of the eight Zener diodes 160 is disposed on one side (the ⁇ Y direction side in FIG. 13B) of both ends in the longitudinal direction of the substrate 110 for each of the circuits U1 to U8.
- the intervals W1 to W9 between the electrode pads 141a and 142a in the circuit become shorter as they approach the end on the one direction side (the ⁇ Y direction side in FIG. 13B) in each of the circuits U1 to U8. There may be.
- Each of the eight Zener diodes 160 includes a boundary between the first circuit U1 and the second circuit U2, a boundary between the third circuit U3 and the fourth circuit U4, a boundary between the fifth circuit U5 and the sixth circuit U6, and a seventh circuit.
- the intervals W1 to W9 between the electrode pads 141a and 142a are separated from the position of the Zener diode 160, as shown in FIG. 14A.
- the first circuit U1 is equal to the second circuit U2, the boundary between the third circuit U3 and the fourth circuit U4, the boundary between the fifth circuit U5 and the sixth circuit U6, the seventh circuit U7 and the eighth circuit U6. It may be shorter near the boundaries of the circuit U8 as it approaches each boundary.
- each of the eight Zener diodes 160 is the same as the configuration shown in FIG. 14A, and as shown in FIG. 14B, the intervals W1 to W1 between the electrode pads 141a and 142a in each circuit. W9 may alternately change between the first length and the second length longer than the first length along the longitudinal direction of the substrate 110.
- intervals W1 and W9 between the electrode pads 141a and 142a arranged at both ends in the longitudinal direction of the substrate 110 in each circuit may be set to the first length.
- the light emitting devices described with reference to FIG. 13B may be arranged in two rows.
- each of the eight Zener diodes 160 has a first length along the longitudinal direction of the substrate 110 out of both ends in the longitudinal direction of the substrate 110 for each of the circuits U ⁇ b> 1 to U ⁇ b> 8.
- Spaces W1 to W9 between electrode pads 141a and 142a in each circuit are arranged on one direction side (Y direction side in FIG. 15), and each circuit U1 to U8 has a first direction side (Y direction direction in FIG. 15). The shorter it is, the closer to the end of the side.
- each of the eight Zener diodes 160 has a second direction side opposite to the first direction ( ⁇ Y in FIG.
- Embodiment 1 although the light-emitting device 1 demonstrated the example provided with eight circuits U1 thru
- a substrate 310 having a rectangular shape in plan view a first wiring 440 a composed of a first partial wiring 441 and a second partial wiring 442, a first partial wiring 443 and a second partial wiring 444.
- the light-emitting device 4 provided with the 2nd wiring 440b comprised from these, and the sealing member 430 may be sufficient.
- the first partial wirings 441 and 443 are arranged in parallel in the longitudinal direction of the substrate 310 (the Y-axis direction in FIG. 16) and have the same configuration as the first partial wiring 141 according to the first embodiment.
- the second partial wirings 442 and 444 also have the same configuration as the second partial wiring 142 according to Embodiment 1 in parallel with the longitudinal direction of the substrate 310 (the Y-axis direction in FIG. 16).
- the example of the light emitting device 1 including a circuit in which nine LEDs 120 and one Zener diode 160 are connected in parallel to each other has been described.
- the present invention is not limited to this. It may be provided with a circuit in which no more than one LED 120 and one Zener diode 160 are connected in parallel to each other, or in which ten or more LEDs 120 and one Zener diode 160 are connected in parallel to each other.
- a circuit may be provided.
- Embodiment 3 the example of the lighting device 1001 provided with only one light emitting device 1 has been described, but the present invention is not limited to this.
- an illumination device 1003 may be provided in which four light emitting devices 1 are arranged in one row in a state where the longitudinal direction and the column direction of each light emitting device 1 coincide. .
- an illumination device 1004 in which the two light emitting devices 1 are arranged in two rows in a state where the longitudinal direction and the column direction of each light emitting device 1 coincide with each other may be used. .
- an illuminating device 1005 in which eight light emitting devices 1 are arranged in a state where the longitudinal direction and the alignment direction of each light emitting device 1 are orthogonal to each other may be used.
- the five light emitting devices 1 are arranged in a state where the longitudinal direction and the alignment direction of the respective light emitting devices 1 are orthogonal to each other, and both sides of the five light emitting devices 1 in the longitudinal direction.
- the lighting device 1006 may be arranged in such a manner that the longitudinal direction of each light emitting device 1 is aligned with the alignment direction.
- Embodiment 1 the example in which the mounting method of the LED 120 on the substrate 110 is face-up mounting has been described.
- the present invention is not limited to this.
- a land (not shown) for flip-chip mounting the electrode of the LED 120 may be formed, and the land and the electrode pads 141a and 142a may be connected via the wire 195.
- Light emitting device 110 Substrate 111 Plate material 112 Insulating film 120 LED (light emitting element) 130 Sealing member 140a First wiring 140b Second wiring 141, 143, 145, 147, 149, 151, 153, 155, 241, 243, 245, 247, 249, 251, 253, 255 First partial wiring 141a, 142a , ..., 156a, 241a, 242a, ..., 256a Electrode pads 142, 144, 146, 148, 150, 152, 154, 156, 242, 244, 246, 248, 250, 252, 254, 256 Two-part wiring 160 Zener diodes 171, 172,..., 186 Inspection pads 1001, 1002, 1003, 1004, 1005, 1006 Illumination device 2001 Liquid crystal display device 1010 Backlight unit U1, U2,. group)
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Abstract
Description
<1>構成
図1は、本実施の形態に係る発光装置1の一部を示す斜視図である。図2(a)は、図1におけるA-A’線で破断した断面を矢印方向から見た図であり、図2(b)は、図1におけるB-B’線で破断した断面の一部を矢印方向から見た図であり、図3(a)は、発光装置1全体を示す図であり、図3(b)は、発光装置1の一部を拡大した図である。
図1および図3(a)に示すように、基板110は、長尺の矩形板状に形成されており、LED120が設けられる面110aに直交する方向から見て(以下、「平面視」と称する。)、短手方向(図1および図3(a)におけるX方向)の長さが約15mmであり、長手方向(図1および図3(a)におけるY方向)の長さが約300mmである。また、図2(a)および(b)に示すように、基板110は、アルミニウム等の金属からなる板材111と、白色のポリカーボネート樹脂等からなり板材111の表面全体に形成されLED120から発せられて光を反射する絶縁膜112とから構成される。
各LED120は、青色発光するGaN系のLEDである。そして、図1に示すように、LED120は、基板110上に一列に配設されている。ここで、各LED120は、電極(図示せず)のある面を基板110に当接する側とは反対側にして(いわゆるフェイスアップの状態で)基板110に実装されている。また、図2(a)および(b)に示すように、LED120は、LED120の列方向の両側に設けられた一対の電極パッド141a,142aにワイヤ195を介して電気的に接続されている。このワイヤ195は、例えば、金から形成されるものであり、周知のワイヤボンディング法により一端部が電極パッド141a,142aに接合され他端部がLED120の電極に接合されている。また、各ワイヤ195の延長方向は、複数のLED120からなる素子列の列方向に沿っている。これにより、ワイヤ195の延長方向が素子列の列方向に直交する方向に沿っている構成に比べて、封止部材130の長手方向の伸縮により、ワイヤ195に素子列の列方向に沿った力が加わっても、ワイヤ195が捩れにくくなっている。なお、電極パッド141aは、第1配線140aの一部を構成し、電極パッド142aは、第2配線140bの一部を構成している。また、図2(a)および(b)に示すように、LED120は、平面視矩形であって、平面視における短手方向の長さCS1および長手方向の長さCS2それぞれが、0.3乃至1.0mmであり、厚みCS3が0.08乃至0.30mmである。
図1に示すように、第1配線140aおよび第2配線140bは、基板110上に、基板110の長手方向に沿うように形成されている。この配線140a,140bは、例えば、AgやCu等の金属材料から形成されている。なお、配線140a,140bの材料としては、金属材料に限られず、例えば、シリコン等の半導体材料やその他の導電性材料から形成されるものであってもよい。
図1に示すように、ツェナーダイオード160は、第1部分配線141における第2回路U2側の端部に位置する脚部141b1に連続する電極パッド141aと、第2部分配線142における、脚部141b1に最も近い位置に配置された脚部142b1に連続する電極パッド142aとの間に配置されている。このツェナーダイオード160と、脚部141b1,142b1の先端部に配設された電極パッド141a,142aとがワイヤ195を介して電気的に接続されている。図4に示すように、このツェナーダイオード160は、第1回路U1乃至第8回路U8それぞれにLED120と並列に接続される形で1個ずつ設けられている。
図1および図3(a)に示すように、封止部材130は、72個のLED120、各LED120について設けられた一対の電極パッドおよびLED120と電極パッドとの間を接続するワイヤ195の全てを覆うように、基板110の長手方向に沿って配置されている。この封止部材130は、蛍光体を含有した透光性の樹脂材料で形成されている。この透光性の樹脂材料としては、例えば、シリコーン樹脂、フッソ樹脂、シリコーン・エポキシのハイブリッド樹脂、ユリア樹脂などを用いることができる。また、蛍光体としては、例えば、YAG蛍光体((Y,Gd)3Al5O12:Ce3+)、珪酸塩蛍光体((Sr,Ba)2SiO4:Eu2+)、窒化物蛍光体((Ca,Sr,Ba)AlSiN3:Eu2+)、酸窒化物蛍光体(Ba3Si6O12N2:Eu2+)の粉末を用いることができる。これにより、各LED120から出射される青色光と、当該青色光の一部を蛍光体により変換されて出射される黄緑色とが混色することにより白色光が得られる。なお、封止部材130は、必ずしも蛍光体が含有されている必要はない。このように、LED120、電極パッドおよびワイヤ195が、封止部材130で封止されていることにより、LED120、電極パッドおよびワイヤ195の劣化を防止することができる。
ところで、図3(b)に示すように、第1回路U1では、ツェナーダイオード160が、第1部分配線141における第2回路U2側の端部に位置する脚部141b1に連続する電極パッド141aと、第2部分配線142における、脚部141b1に最も近い位置に配置された脚部142b1に連続する電極パッド142aとの間に配置されている。
本実施の形態に係る発光装置1の製造工程について説明する。
結局、本実施の形態に係る発光装置1は、各回路U1,U2,・・・,U8において、LED120毎に列方向に沿った両側に設けられた一対の電極パッド同士の間隔が、ツェナーダイオード160に最も近い位置以外の2箇所に設けられた一対の電極パッド同士の間隔が互いに異なる。これにより、各回路U1,U2,・・・,U8においてツェナーダイオード160近傍の輝度だけが局所的に低い輝度分布となることがなく、各回路U1,U2,・・・,U8における複数箇所で輝度が変化する分布となる。このように、各回路U1,U2,・・・,U8における複数箇所で輝度が変化する分布を付けることにより、各回路U1U2,・・・,U8におけるツェナーダイオード160近傍の輝度低下を目立たなくすることができる。
本実施の形態に係る発光装置2は、実施の形態1に係る発光装置1と略同様であり、図7に示すように、複数のLED120が2列に配設されている点が相違する。なお、実施の形態1と同様の構成については同一の符号を付して適宜説明を省略する。
図9は、本実施の形態に係る照明装置1001を示す分解斜視図である。
図10は、本実施の形態に係る液晶表示装置を示す断面図である。
(1)実施の形態1では、図5(a)に示すように、8個のツェナーダイオード160それぞれが、第1回路U1および第2回路U2の境界、第3回路U3および第4回路U4の境界、第5回路U5および第6回路U6の境界、第7回路U7および第8回路U8の境界に近接して配置され、図5(b)に示すように、各回路内において電極パッド141a,142a同士の間隔W1乃至W9が、ツェナーダイオード160の位置を反映して、第1回路U1および第2回路U2の間、第3回路U3および第4回路U4の間、第5回路U5および第6回路U6の間、第7回路U7および第8回路U8の間に近づくほど短くなっている例について説明したが、これに限定されるものではない。
110 基板
111 板材
112 絶縁膜
120 LED(発光素子)
130 封止部材
140a 第1配線
140b 第2配線
141,143,145,147,149,151,153,155,241,243,245、247,249,251,253,255 第1部分配線
141a,142a,・・・,156a,241a,242a,・・・,256a 電極パッド
142,144,146,148,150,152,154,156,242,244,246,248,250,252,254,256 第2部分配線
160 ツェナーダイオード
171,172,・・・,186 検査用パッド
1001,1002,1003,1004,1005,1006 照明装置
2001 液晶表示装置
1010 バックライトユニット
U1,U2,・・・,U8 回路(グループ)
Claims (11)
- 基板と、
前記基板上に列状に配設された複数の発光素子と、
前記基板上に形成され、発光素子毎にその列方向における発光素子の前後両側に設けられた一対の電極パッドと、
前記列方向に連続する複数の発光素子および当該複数の発光素子それぞれに対応する各一対の電極パッドからなるグループ毎に1つずつ、グループ内のいずれか2個の隣り合う発光素子の間に位置する2つの電極パッドの間に配置された保護素子と、
前記発光素子、電極パッドおよび保護素子を封止する形で前記基板上に設けられた封止部材とを備え、
前記各グループにおいて、一対の電極パッド同士の間隔は、前記保護素子に最も近い位置に設けられた一対の電極パッド同士の間隔が最短であり且つ前記保護素子に最も近い位置以外の2箇所に設けられた一対の電極パッド同士の間隔が互いに異なる
ことを特徴とする発光装置。 - 前記各グループにおいて、前記保護素子に最も近い位置に設けられた少なくとも1つの発光素子と、当該発光素子に対して前記保護素子側とは反対側で隣り合う位置に設けられた発光素子との間の間隔が最も短い
ことを特徴とする請求項1記載の発光装置。 - 前記各グループにおいて、一対の電極パッド同士の間隔は、前記保護素子が配置された位置に近づくほど短くなる
ことを特徴とする請求項1または請求項2記載の発光装置。 - 隣り合う発光素子の間隔は、前記保護素子が配置された位置に近づくほど短くなる
ことを特徴とする請求項3記載の発光装置。 - 前記基板は、平面視矩形状に形成され、
前記複数の発光素子は、前記基板の長手方向に沿って列状に配置されている
ことを特徴とする請求項1乃至4のいずれか1項に記載の発光装置。 - 前記各保護素子は、前記各グループの両端側のいずれか一方に配設されている
ことを特徴とする請求項1乃至5のいずれか1項に記載の発光装置。 - 前記各保護素子は、前記各グループの中央部に配設されている
ことを特徴とする請求項1乃至5のいずれか1項に記載の発光装置。 - 前記グループ毎に、前記電極パッドを第一電極パッドとした場合、当該第一電極パッドとは異なる第二電極パッドを備える
ことを特徴とする請求項1乃至7のいずれか1項に記載の発光装置。 - 前記各発光素子は、前記列方向に沿った両側に設けられた一対の電極パッドとワイヤにより電気的に接続され、前記各保護素子は、前記隣り合う発光素子の間に位置する2つの電極パッドとワイヤにより電気的に接続され、
前記各ワイヤの延長方向は、前記複数の発光素子の列方向に沿っている
ことを特徴とする請求項1乃至8のいずれか1項に記載の発光装置。 - 前記封止部材は、蛍光体を含有する透光性材料からなる
ことを特徴とする請求項1乃至9のいずれか1項に記載の発光装置。 - 請求項1乃至10のいずれか1項に記載の発光装置を備える
ことを特徴とする照明装置。
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EP12840262.5A EP2768037B1 (en) | 2011-10-11 | 2012-09-28 | Light-emission device, and illumination device using same |
US14/344,130 US9070831B2 (en) | 2011-10-11 | 2012-09-28 | Light-emitting device each having variable distances between pairs of electrode pads with respect to Zener diodes and lighting apparatus using the same |
CN201280044828.6A CN103797593B (zh) | 2011-10-11 | 2012-09-28 | 发光装置及使用它的照明装置 |
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Also Published As
Publication number | Publication date |
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CN103797593A (zh) | 2014-05-14 |
US20140346536A1 (en) | 2014-11-27 |
US9070831B2 (en) | 2015-06-30 |
JP5236843B1 (ja) | 2013-07-17 |
CN103797593B (zh) | 2015-11-25 |
EP2768037B1 (en) | 2015-07-29 |
EP2768037A4 (en) | 2014-10-22 |
EP2768037A1 (en) | 2014-08-20 |
JPWO2013054483A1 (ja) | 2015-03-30 |
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