JP6104613B2 - 発光ランプ - Google Patents
発光ランプ Download PDFInfo
- Publication number
- JP6104613B2 JP6104613B2 JP2013007515A JP2013007515A JP6104613B2 JP 6104613 B2 JP6104613 B2 JP 6104613B2 JP 2013007515 A JP2013007515 A JP 2013007515A JP 2013007515 A JP2013007515 A JP 2013007515A JP 6104613 B2 JP6104613 B2 JP 6104613B2
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- Prior art keywords
- light
- light source
- light emitting
- surface portion
- lead frame
- Prior art date
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Images
Classifications
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
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- G—PHYSICS
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0075—Arrangements of multiple light guides
- G02B6/0078—Side-by-side arrangements, e.g. for large area displays
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- G—PHYSICS
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/0088—Positioning aspects of the light guide or other optical sheets in the package
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- G—PHYSICS
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/25—Preparing the ends of light guides for coupling, e.g. cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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Description
20 発光素子
30 反射シート
31 反射パターン
40 導光層
52 第1の光学シート
54 第2の光学シート
56 接着部材
60 光学パターン
70 拡散板
110 放熱部材
101―1〜101―n サブ光源モジュール
410―1、420―1、410―2 連結固定部
510、520、530、540 コネクター
610 パッケージ本体
620 第1のリードフレーム
630 第2のリードフレーム
640 発光チップ
645 ツェナーダイオード
650 ワイヤ
712 第1の上面部
714 第1の側面部
722、724 貫通ホール
742 第2の上面部
744 第2の側面部
900 車両用ライト
910 光源モジュール
920 ライトハウジング
1801 第2の電極層
1810 電極物質層
1815 支持層
1820 ボンディング層
1825 反射層
1830 オーミック領域
1840 発光構造物
1850 パッシベーション層
1860 第1の電極層
Claims (25)
- 基板上に配置される少なくとも一つの光源、及び前記光源を埋め込むように前記基板上に配置される導光層を含む光源モジュールと、
前記光源モジュールを収納するハウジングと、を含み、
前記光源は、
キャビティを有する本体と、
前記キャビティに露出し少なくとも一つの発光チップが配置される上面部、及び前記上面部の第1の側部から折り曲げられ、前記本体の一面に露出する第1の側面部を含む第1のリードフレームと、
前記本体の前記一面の一側に露出する一端、前記本体の前記一面の他の一側に露出する他端、及び前記キャビティに露出する中間部を含む第2のリードフレームと、
第1の半導体層、活性層、及び第2の半導体層とを含み、
前記第1のリードフレームの第1の側面部は、前記第2のリードフレームの一端と他端との間に位置し、前記第2のリードフレームの中間部は、前記第2のリードフレームの一端と前記第2のリードフレームの他端とを連結する発光ランプ。 - 前記第1の側面部は、
前記上面部の第1の側部と連結される上端部;及び
前記上端部と連結され、前記上端部の下側に位置する下端部;を含み、
前記上端部の側面と前記下端部の側面は段差を有する、請求項1に記載の発光ランプ。 - 前記第1のリードフレームは、前記第1の上面部と前記第1の側面部との境界部分に隣接して少なくとも一つの貫通ホールを有する、請求項1又は2に記載の発光ランプ。
- 前記第1のリードフレームは、前記第1の上面部と第1の側面部とを互いに連結する各連結部分を含み、前記各連結部分間には前記貫通ホールが位置する、請求項1〜3のうちいずれか1項に記載の発光ランプ。
- 前記各連結部分のうち前記発光チップに整列される第1の連結部分の第1の方向の長さは、前記発光チップに整列されない第2の連結部分の第1の方向の長さより大きく、前記第1の方向はxyz座標系でx軸方向である、請求項4に記載の発光ランプ。
- 前記第2のリードフレームは、
前記第1の上面部の少なくとも一つの側部の周囲に配置され、前記本体の前記キャビティに露出する第2の上面部と、
前記第2の上面部から折り曲げられ、前記本体の前記一面の前記一側及び前記他側のそれぞれに露出する第2の側面部と、を含む、請求項1〜5のうちいずれか1項に記載の発光ランプ。 - 前記光源モジュールは、
前記基板の下面上に配置される放熱部材をさらに含む、請求項1〜6のうちいずれか1項に記載の発光ランプ。 - 前記基板は、少なくとも一つのビアホールを有する、請求項1〜7のうちいずれか1項に記載の発光ランプ。
- 前記光源モジュールは、
前記基板と前記導光層との間に配置される反射シートをさらに含む、請求項1〜8のうちいずれか1項に記載の発光ランプ。 - 前記光源モジュールは、
前記反射シート上に配置される反射パターンをさらに含む、請求項9に記載の発光ランプ。 - 前記光源モジュールは、
前記導光層上に配置され、前記導光層から出射される光を分散する第1の光学シートをさらに含む、請求項1〜10のうちいずれか1項に記載の発光ランプ。 - 前記光源モジュールは、
前記第1の光学シート上に配置され、前記光源から出射される光を遮断又は反射する光学パターンをさらに含む、請求項11に記載の発光ランプ。 - 前記光源モジュールは、
前記第1の光学シートと、前記光学パターン上に配置される第2の光学シートと、をさらに含む、請求項12に記載の発光ランプ。 - 前記光源モジュールは、
前記第2の光学シート上に配置される拡散板をさらに含む、請求項13に記載の発光ランプ。 - 前記拡散板上に配置される多数のレンズをさらに含む、請求項14に記載の発光ランプ。
- 前記導光層は、
オリゴマーを含む紫外線硬化樹脂からなる、請求項1〜15のうちいずれか1項に記載の発光ランプ。 - 前記紫外線硬化樹脂は、ウレタンアクリレート、エポキシアクリレート、ポリエステルアクリレート、ポリエーテルアクリレート、ポリブタジエンアクリレート、及びシリコンアクリレートのうち少なくとも一つを含む、請求項16に記載の発光ランプ。
- 前記導光層は、
ポリエステルポリオール樹脂、アクリルポリオール樹脂、炭化水素系又は/及びエステル系の溶剤のうち少なくとも一つを含む熱硬化樹脂からなる、請求項1〜15のうちいずれか1項に記載の発光ランプ。 - 前記導光層は、
シリコン、シリカ、グラスバブル、PMMA、ウレタン、Zn、Zr、Al2O3、アクリルから選ばれる少なくともいずれか一つで構成される光を拡散させるための拡散物質をさらに含む、請求項1〜18のうちいずれか1項に記載の発光ランプ。 - 前記光源モジュールは、
前記基板に配置され、外部との電気的連結のための少なくとも一つのコネクターをさらに含む、請求項1〜19のうちいずれか1項に記載の発光ランプ。 - 前記光源モジュールは、
外部との締結のために前記基板に形成される締結固定部をさらに含む、請求項20に記載の発光ランプ。 - 前記基板は、回路パターン及び絶縁層を含み、軟性を有する基板である、請求項1〜21のうちいずれか1項に記載の発光ランプ。
- 前記発光チップは、600nm〜690nmの波長範囲を有する赤色光を発光する、請求項1〜22のうちいずれか1項に記載の発光ランプ。
- 前記光源は側面型の発光素子パッケージである、請求項1〜23のうちいずれか1項に記載の発光ランプ。
- 前記光源モジュールは面光源である、請求項1〜24のうちいずれか1項に記載の発光ランプ。
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US20160099236A1 (en) | 2016-04-07 |
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