JP6184769B2 - 照明装置 - Google Patents
照明装置 Download PDFInfo
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- JP6184769B2 JP6184769B2 JP2013135062A JP2013135062A JP6184769B2 JP 6184769 B2 JP6184769 B2 JP 6184769B2 JP 2013135062 A JP2013135062 A JP 2013135062A JP 2013135062 A JP2013135062 A JP 2013135062A JP 6184769 B2 JP6184769 B2 JP 6184769B2
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- JP
- Japan
- Prior art keywords
- light
- light source
- lead frame
- surface portion
- light emitting
- Prior art date
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Planar Illumination Modules (AREA)
- Led Device Packages (AREA)
Description
第3連結部分736の第1方向の長さ(E)と第1連結部分732の第1方向の長さ(C11)の比は例えば1:1.2〜1.8である。貫通孔722の第1方向の長さ(D11又はD12)と第1側面部714の上端部714-1の第1方向の長さ(B1)の比は例えば1:3.8〜6.3である。
図34を参照すると、第1リードフレーム810は、第1上面部812、第1上面部812の第1側部から折り曲げられる第1側面部814、及び第2側面部816を含むことができる。第1上面部812には発光チップ642、644が配置できる。
30 反射ユニット 31 反射パターン
33 第1反射フィルム 35 第2反射フィルム
36 離隔領域 37 離隔部材
40 レジン層 50 光学パターン層
52 第1光学シート 54 第2光学シート
56 接着層 60 光学パターン
70 拡散板 81 離隔部
90 光反射部材 110 放熱部材
101-1〜101-n サブ光源モジュール
410-1、420-1、410-2 連結固定部
510、520、530、540 コネクタ
610 パッケージ胴体 620 第1リードフレーム
630 第2リードフレーム 640 発光チップ
645 ツェナーダイオード 650 ワイヤ
712 第1上面部 714 第1側面部
722、724 貫通孔 742 第2上面部
744 第2側面部 801 第2電極層
810 電極材料層 815 支持層
820 ボンディング層 825 反射層
830 オーミック領域 840 発光構造物
850 パッシベーション層 860 第1電極層
900 車両用ライト 910 光源モジュール
920 ライトハウジング
Claims (20)
- プリント回路基板上に配置される少なくとも一つの光源、上記光源を埋めるために上記プリント回路基板上に配置されるレジン層及び上記プリント回路基板と上記レジン層との間に形成され、内部に離隔領域を備えた反射ユニットを含む光源モジュールと、
上記レジン層の一側面及び他側面のうち少なくともいずれかに形成される光反射部材と、
上記光源モジュールの上部と接触する上部面及び上記上部面と一体に形成され、下側方向に延長形成されて上記光反射部材と密着する側壁を備えた拡散板と、を含む照明装置。 - 上記少なくとも一つの光源は、上記反射ユニットに向かって光を出射する請求項1に記載の照明装置。
- 上記光源モジュールは、
上記レジン層上に形成されて光を分散する光学パターンを備えた光学パターン層をさらに含む請求項1又は請求項2に記載の照明装置。 - 上記レジン層は、
オリゴマーを含む紫外線硬化樹脂からなる請求項1〜請求項3のうちいずれか一項に記載の照明装置。 - 上記オリゴマーは、
含有量が40〜55重量部であり、
ウレタンアクリレート(Urethane Acrylate)、エポキシアクリレート(Epoxy Acrylate)、ポリエステルアクリレート(Polyester Acrylate)、ポリエーテルアクリレート(Polyether Acrylate)、ポリブタジエンアクリレート(Polybutadiene Acrylate)、シリコンアクリレート(Silicon Acrylate)のうち少なくともいずれか一つを含んでなる請求項4に記載の照明装置。 - 上記反射ユニットは、
上記プリント回路基板の表面に密着する第1反射フィルムと、
上記第1反射フィルムと離隔されて上記離隔領域を形成する透明材質の第2反射フィルムと、を含む請求項2に記載の照明装置。 - 上記反射ユニットは、
上記第1反射フィルムと上記第2反射フィルムの間に配置される離隔部材をさらに含む請求項6に記載の照明装置。 - 上記離隔部材は、
内部にエアスペースとなる第1離隔部を含む接着物質で構成される少なくとも一つの単位離隔部材を含む請求項7に記載の照明装置。 - 上記離隔部材は複数の単位離隔部材が相互に離隔して配置され、
上記単位離隔部材間の相互に離隔された空間に第2離隔部が形成される請求項8に記載の照明装置。 - 上記光源モジュールは、
上記反射ユニット上に形成された反射パターンをさらに含む請求項2に記載の照明装置。 - 上記光学パターン層は、
上記レジン層の上面に形成されて出射される光を分散させる第1光学シートと、
上記第1光学シート上に形成される第2光学シートと、を含む請求項3に記載の照明装置。 - 上記光学パターン層は、
上記第1光学シートと上記第2光学シートとの間に形成された接着層をさらに含む請求項11に記載の照明装置。 - 上記接着層は、上記光学パターンの周辺に配置され、上記接着層と上記光学パターンを離隔させる離隔部を含む請求項12に記載の照明装置。
- 上記光学パターンは、
上記第1光学シートの上面又は上記第2光学シートの下面に形成される請求項12に記載の照明装置。 - 上記光学パターンは、
TiO2、CaCO3、BaSO4、Al2O3、Silicon、PS(Polystyrene)から選ばれるいずれか一つ以上を含む拡散パターンと、
Al又はAlとTiO2の混合物質を含む遮光パターンの重畳構造からなる請求項3に記載の照明装置。 - 上記レジン層は、
シリコン(silicon)、シリカ(silica)、グラスバブル(glass bubble)、PMMA、ウレタン(urethane)、Zn、Zr、Al2O3、アクリル(acryl)から選ばれる少なくともいずれか一つで構成される光を拡散させるための拡散物質をさらに含む請求項1〜請求項15のうちいずれか一項に記載の照明装置。 - 上記光源は、
側面型(side view type)の発光素子パッケージである請求項1〜請求項16のうちいずれか一項に記載の照明装置。 - 上記光源は、
キャビティを有するパッケージ胴体と、
上記キャビティに露出される一端、及び上記パッケージ胴体を貫通して上記パッケージ胴体の一面に露出される他端を含む第1リードフレームと、
上記パッケージ胴体の上記一面の一側に露出される一端、上記パッケージ胴体の上記一面の他側に露出される他端、及び上記キャビティに露出される中間部を含む第2リードフレームと、
上記第1リードフレーム上に配置される少なくとも一つの発光チップを含む光源パッケージからなる請求項1〜請求項17のうちいずれか一項に記載の照明装置。 - 上記第1リードフレームは、
上記キャビティに露出される第1上面部と、
上記第1上面部の第1側部から折り曲げられ、上記パッケージ胴体の上記一面に露出される第1側面部と、を含む請求項18に記載の照明装置。 - 上記第2リードフレームは、
上記第1上面部の少なくとも一つの側部の周りに配置され、上記パッケージ胴体の上記キャビティに露出される第2上面部と、
上記第2上面部から折り曲げられ、上記パッケージ胴体の上記一面の上記一側及び上記他側にそれぞれ露出される第2側面部と、を含む請求項19に記載の照明装置。
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