JP6646969B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP6646969B2 JP6646969B2 JP2015153403A JP2015153403A JP6646969B2 JP 6646969 B2 JP6646969 B2 JP 6646969B2 JP 2015153403 A JP2015153403 A JP 2015153403A JP 2015153403 A JP2015153403 A JP 2015153403A JP 6646969 B2 JP6646969 B2 JP 6646969B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- mounting area
- mounting
- emitting device
- emitting elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229920005989 resin Polymers 0.000 claims description 24
- 239000011347 resin Substances 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 19
- 238000007789 sealing Methods 0.000 claims description 16
- 230000003287 optical effect Effects 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 230000007423 decrease Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 2
- 229910015802 BaSr Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
- F21Y2105/12—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
実施形態に係る発光装置では、複数の発光素子は、実装領域の中心部を含む第1実装領域に密集して実装される発光素子と、第1実装領域の周囲を囲む第2実装領域に、第1実装領域の発光素子より粗に実装される発光素子とに分けて配置される。実施形態に係る発光装置では、実装領域の中心部に実装される発光素子を密集して配置し且つ中心部から離れた位置に実装される発光素子を比較的粗に配置することにより、大きな発光強度と発熱量の抑制との両立を実現する。
図1(A)は完成品としての第1実施形態に係る発光装置の平面図であり、図1(B)は図1(A)のIA-IB線に沿った断面図である。
図4〜7は、発光装置1の製造工程を示す図である。図4(A)は第1工程の平面図であり、図5(A)は第1工程に続く第2工程の平面図であり、図6(A)は第2工程に続く第3工程の平面図であり、図7(A)は第3工程に続く第4工程の平面図である。図3(B)は図3(A)のIIA-IIB線に沿った断面であり、図4(B)は図4(A)のIIIA-IIIB線に沿った断面であり、図5(B)は図5(A)のIVA-IVB線に沿った断面であり、図6(B)は図6(A)のVA-VB線に沿った断面である。
発光装置1では、実装領域11の中心部を含む第1実装領域31に実装されたLED素子30の間の第1実装間隔が、第1実装領域31の周囲を囲む第2実装領域32に実装されたLED素子30の間の第2実装間隔よりも狭い。発光装置1は、実装領域11の中心部に近接する第1実装領域31に実装されるLED素子30の間の実装間隔を狭くして、レンズの光軸に近接するLED素子30の数を増加させて発光装置の発光強度を大きくする。また、発光装置1は、第2実装領域32に実装されるLED素子30の間の実装間隔を第1実装領域31に実装されるLED素子30の間の実装間隔よりも広くすることで実装密度を低くして、発光装置1の全体としての発熱量を抑制する。発光装置1は、第1実装領域31に実装されるLED素子30の間の実装間隔を第1実装領域31の周囲を囲む第2実装領域32に実装されるLED素子30の間の実装間隔よりも狭くして、大きな発光強度を有し且つ発熱量の増加を抑制可能にする。
発光装置1は、第1実装領域31に実装されるLED素子30は、格子状に第1実装間隔で実装されるが、第1実装領域31及び第2実装領域32に実装されるLED素子30の間の実装間隔は全て同一でなくてもよい。実施形態に発光装置では、第1実装領域31に実装されるLED素子30の間の平均間隔が、第1実装領域31の周囲を囲む第2実装領域32に実装されるLED素子30の間の平均間隔よりも狭ければよい。
発光装置1では、LED素子30は第1実装領域及び第2実装領域の2つの実装領域に分けて実装されるが、実施形態に発光装置では、LED素子30は3つ以上の実装領域に分けて配置されてもよい。LED素子30が3つ以上の実装領域に分けて配置される場合、実装領域が実装領域11の中心部から離れるに従って、実装領域に含まれるLED素子30の間の実装間隔は広くなるように実装される。また、実施形態に発光装置では、発光素子30の実装密度が実装領域11の中心部から離れるに従って粗になるように、発光素子30を実装してもよい。
10 実装基板
20 回路基板
30 LED素子(発光素子)
31、231、331 第1実装領域
32、232、332 第2実装領域
333 第3実装領域
40 樹脂枠
50 封止樹脂
80 レンズ
Claims (4)
- 正方形状の平面形状を有すると共に、正方形状の平面形状を有する実装領域を有する実装基板と、
正方形状の平面形状を有すると共に、前記実装領域に対応する開口部が形成され、裏面が前記実装基板の表面に接合された回路基板と、
前記開口部の外周部分に固定された矩形の枠体と、
前記実装領域に実装された正方形状の平面形状を有する複数の発光素子と、
前記複数の発光素子を封止する封止樹脂と、
前記実装基板上に配置されたレンズと、を有し、
前記複数の発光素子は、前記実装領域の中心部を含む第1実装領域に実装された発光素子と、前記第1実装領域の周囲を囲む第2実装領域に実装された発光素子とを含み、
前記第1実装領域に実装された前記発光素子の実装密度は、前記第2実装領域に実装された前記発光素子の実装密度よりも高く、
前記レンズの光軸は、前記実装領域の中心と一致し、
前記第1実装領域に実装された前記発光素子のそれぞれは、隣接する発光素子との間の間隔が均等な第1間隔になるように格子状に配置され、
前記第2実装領域に実装された前記発光素子は、前記実装領域の辺のそれぞれに平行に配列される、ことを特徴とする発光装置。 - 前記第2実装領域に実装された前記発光素子のそれぞれは、隣接する発光素子との間の間隔が前記第1間隔よりも広い第2間隔となるように配置される、請求項1に記載の発光装置。
- 前記実装基板は、金属基板である、請求項1又は2に記載の発光装置。
- 前記第1実装領域に実装された前記発光素子の実装間隔は、前記発光素子の一辺の長さの0.25倍よりも狭く、
前記第2実装領域に実装された前記発光素子の実装間隔は、前記発光素子の一辺の長さの0.25倍よりも広く、
前記第1実装領域に実装された前記発光素子の実装間隔は、5μm以上50μm以下である、請求項1〜3の何れか一項に記載の発光装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015153403A JP6646969B2 (ja) | 2015-08-03 | 2015-08-03 | 発光装置 |
US15/226,303 US10429050B2 (en) | 2015-08-03 | 2016-08-02 | Light-emitting apparatus having different packaging densities |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015153403A JP6646969B2 (ja) | 2015-08-03 | 2015-08-03 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017034122A JP2017034122A (ja) | 2017-02-09 |
JP6646969B2 true JP6646969B2 (ja) | 2020-02-14 |
Family
ID=57987283
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015153403A Active JP6646969B2 (ja) | 2015-08-03 | 2015-08-03 | 発光装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US10429050B2 (ja) |
JP (1) | JP6646969B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017045951A (ja) * | 2015-08-28 | 2017-03-02 | パナソニックIpマネジメント株式会社 | Ledモジュール及びそれを備えた照明器具 |
JP6610866B2 (ja) * | 2015-08-31 | 2019-11-27 | パナソニックIpマネジメント株式会社 | 発光装置、及び照明装置 |
US9985182B2 (en) * | 2015-12-25 | 2018-05-29 | Citizen Electronics Co., Ltd. | Light-emitting apparatus and color-matching apparatus |
WO2024157865A1 (ja) * | 2023-01-26 | 2024-08-02 | シチズン電子株式会社 | 発光装置及びその発光装置を用いた照明装置 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3820845B2 (ja) * | 2000-06-09 | 2006-09-13 | 日亜化学工業株式会社 | Led表示器及び信号灯 |
JP2005159262A (ja) * | 2003-10-30 | 2005-06-16 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置ならびに照明装置 |
JP5208597B2 (ja) * | 2008-07-01 | 2013-06-12 | 富士フイルム株式会社 | 照明装置、撮像装置 |
JP5079635B2 (ja) * | 2008-08-20 | 2012-11-21 | シャープ株式会社 | 照明機器 |
US8567988B2 (en) | 2008-09-29 | 2013-10-29 | Bridgelux, Inc. | Efficient LED array |
JP2010231938A (ja) * | 2009-03-26 | 2010-10-14 | Panasonic Electric Works Co Ltd | Led照明装置 |
JP5374332B2 (ja) | 2009-11-25 | 2013-12-25 | パナソニック株式会社 | 照明装置 |
DE102010027875A1 (de) | 2010-04-16 | 2011-10-20 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements |
JP5768435B2 (ja) * | 2010-04-16 | 2015-08-26 | 日亜化学工業株式会社 | 発光装置 |
JP5612991B2 (ja) * | 2010-09-30 | 2014-10-22 | シャープ株式会社 | 発光装置及びこれを備えた照明装置 |
JP5608042B2 (ja) * | 2010-10-27 | 2014-10-15 | シャープ株式会社 | 照明装置 |
CN103094267B (zh) * | 2011-11-01 | 2018-05-25 | 日亚化学工业株式会社 | 发光装置,照明器具 |
JP6209811B2 (ja) * | 2011-11-29 | 2017-10-11 | 日亜化学工業株式会社 | 発光装置、照明器具 |
JP2013118292A (ja) * | 2011-12-02 | 2013-06-13 | Citizen Electronics Co Ltd | Led発光装置 |
US9048367B2 (en) * | 2012-06-04 | 2015-06-02 | Brightek Optoelectronic Co., Ltd. | Multichip package structure for generating a symmetrical and uniform light-blending source |
CA2883861A1 (en) * | 2012-09-24 | 2014-03-27 | Terralux, Inc. | Variable-beam light source and related methods |
JP6147977B2 (ja) * | 2012-09-26 | 2017-06-14 | ローム株式会社 | Led照明器具およびledユニット |
JP6107136B2 (ja) * | 2012-12-29 | 2017-04-05 | 日亜化学工業株式会社 | 発光装置用パッケージ及びそれを備える発光装置、並びにその発光装置を備える照明装置 |
JP2015103733A (ja) * | 2013-11-27 | 2015-06-04 | 豊田合成株式会社 | 発光装置 |
-
2015
- 2015-08-03 JP JP2015153403A patent/JP6646969B2/ja active Active
-
2016
- 2016-08-02 US US15/226,303 patent/US10429050B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20170038051A1 (en) | 2017-02-09 |
JP2017034122A (ja) | 2017-02-09 |
US10429050B2 (en) | 2019-10-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6628739B2 (ja) | 発光装置 | |
JP6567050B2 (ja) | 発光装置およびその製造方法 | |
JP6646969B2 (ja) | 発光装置 | |
JP6700265B2 (ja) | 発光装置およびその製造方法 | |
US9799635B2 (en) | Light-emitting apparatus | |
JP6643910B2 (ja) | 発光装置 | |
WO2018105448A1 (ja) | 発光装置 | |
JP6566791B2 (ja) | 発光装置 | |
JP6646982B2 (ja) | 発光装置 | |
JP2019062058A (ja) | 発光装置 | |
JP2017050344A (ja) | 発光装置 | |
JP2017050342A (ja) | 発光装置 | |
JP6537410B2 (ja) | 発光装置の製造方法 | |
JP6643831B2 (ja) | 発光装置 | |
JP2015138902A (ja) | 発光装置 | |
JP2022015703A (ja) | 発光装置 | |
JP2017050104A (ja) | 発光装置 | |
JP2017050345A (ja) | 発光装置の製造方法 | |
JP7476002B2 (ja) | 発光装置 | |
WO2016194876A1 (ja) | 発光装置およびその製造方法 | |
JP2019106474A (ja) | 発光装置 | |
JP7444718B2 (ja) | 発光装置 | |
WO2018061889A1 (ja) | 発光装置 | |
JP2017130633A (ja) | 発光装置 | |
JP2018182053A (ja) | 発光装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180704 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190422 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190507 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190708 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20191217 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200114 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6646969 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |