JP6700265B2 - 発光装置およびその製造方法 - Google Patents
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- Condensed Matter Physics & Semiconductors (AREA)
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Description
Claims (3)
- 上面の中央に矩形の実装領域が設けられた基板と、
発光面を前記基板とは反対側に向けて、前記基板の前記実装領域に密集しかつ格子状に配列して実装された複数の発光素子と、
前記基板上における前記実装領域の周囲に白色の樹脂で形成された矩形の樹脂枠と、
前記複数の発光素子からの光により励起される複数種類の蛍光体を前記複数の発光素子の上面に堆積した状態で含有し、前記基板上の前記樹脂枠で囲われた部分に注入されて前記複数の発光素子の全体を封止する封止樹脂と、
前記複数の発光素子から出射された光を集光するレンズと、を有し、
隣接する前記発光素子同士の間隔は、5μm以上であり、かつ前記複数種類の蛍光体のうちで平均粒径が最大である蛍光体のメジアン径D50の120%以下の長さであり、
前記基板は、金属製の実装基板と、矩形の開口部を有し前記実装基板の上に固定された回路基板とで構成され、
前記実装領域は、前記開口部内で露出している前記実装基板の上面であり、
前記樹脂枠は、前記回路基板の上面における前記開口部の外周に固定され、
前記実装基板上における前記樹脂枠と外周側に位置する発光素子との間の外周部分の幅は、個々の発光素子の横幅よりも狭く、
前記開口部内における前記外周部分は、蛍光体を含有しない透明または白色の樹脂で埋め尽くされ、
前記回路基板上には、前記樹脂枠を取り囲む平面領域が設けられ、
前記レンズは、下側に凹部を有し、前記平面領域に下端を接触させ前記凹部内に前記封止樹脂を収容して前記回路基板上に載置されている、
ことを特徴とする発光装置。 - 前記メジアン径D50は20μm以上かつ25μm以下である、請求項1に記載の発光装置。
- 金属製の実装基板と矩形の開口部を有し前記実装基板の上に固定された回路基板とで構成される基板とは反対側に発光面を向けて、前記実装基板の上面の中央に設けられ前記開口部内で露出している矩形の実装領域に、密集かつ格子状に配列させて複数の発光素子を実装する工程と、
前記回路基板上における前記実装領域の周囲かつ前記開口部の外周に矩形の樹脂枠を、前記回路基板上の外周側に前記樹脂枠を取り囲む平面領域が確保されるように白色の樹脂で形成する工程と、
前記複数の発光素子からの光により励起される複数種類の蛍光体を含有する封止樹脂を前記基板上の前記樹脂枠で囲われた部分に注入して前記複数の発光素子の全体を封止する工程と、
前記複数種類の蛍光体を前記封止樹脂内で自然沈降させ、前記複数の発光素子の上面に堆積させてから前記封止樹脂を硬化させる工程と、
下側に凹部を有し前記複数の発光素子から出射された光を集光するレンズを、前記凹部内に前記封止樹脂を収容し前記平面領域に前記レンズの下端を接触させて前記回路基板上に載置する工程と、を有し、
前記実装する工程では、隣接する発光素子同士の間隔が5μm以上でありかつ前記複数種類の蛍光体のうちで平均粒径が最大である蛍光体のメジアン径D50の120%以下の長さになるように、前記複数の発光素子を実装し、
前記形成する工程では、前記実装基板上における前記樹脂枠と外周側に位置する発光素子との間の外周部分の幅が個々の発光素子の横幅よりも狭くなるように前記樹脂枠を形成し、
前記封止する工程では、蛍光体を含有しない透明または白色の樹脂で前記開口部内における前記外周部分を埋め尽くす、
ことを特徴とする発光装置の製造方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015110489 | 2015-05-29 | ||
JP2015110489 | 2015-05-29 | ||
JPPCT/JP2016/053839 | 2016-02-09 | ||
PCT/JP2016/053839 WO2016194405A1 (ja) | 2015-05-29 | 2016-02-09 | 発光装置およびその製造方法 |
PCT/JP2016/065931 WO2016194876A1 (ja) | 2015-05-29 | 2016-05-30 | 発光装置およびその製造方法 |
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JPWO2016194876A1 JPWO2016194876A1 (ja) | 2018-03-15 |
JP6700265B2 true JP6700265B2 (ja) | 2020-05-27 |
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US (1) | US10629786B2 (ja) |
JP (1) | JP6700265B2 (ja) |
CN (1) | CN107615496A (ja) |
WO (1) | WO2016194405A1 (ja) |
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KR20180090002A (ko) * | 2017-02-02 | 2018-08-10 | 서울반도체 주식회사 | 발광 다이오드 패키지 |
CN110391321B (zh) * | 2018-04-19 | 2021-05-28 | 展晶科技(深圳)有限公司 | 发光二极管封装体及其制造方法 |
US12040249B2 (en) * | 2019-12-31 | 2024-07-16 | Texas Instruments Incorporated | Packages with separate communication and heat dissipation paths |
KR20230023834A (ko) * | 2020-12-09 | 2023-02-20 | 주식회사 솔루엠 | 에어포켓 방지 기판, 에어포켓 방지 기판 모듈, 이를 포함하는 전기기기 및 이를 포함하는 전기기기의 제조 방법 |
US20240266477A1 (en) * | 2021-08-31 | 2024-08-08 | Citizen Electronics Co., Ltd. | Led light emitting device |
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2016
- 2016-02-09 WO PCT/JP2016/053839 patent/WO2016194405A1/ja active Application Filing
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US20180158998A1 (en) | 2018-06-07 |
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