TWI562240B - - Google Patents

Info

Publication number
TWI562240B
TWI562240B TW104129332A TW104129332A TWI562240B TW I562240 B TWI562240 B TW I562240B TW 104129332 A TW104129332 A TW 104129332A TW 104129332 A TW104129332 A TW 104129332A TW I562240 B TWI562240 B TW I562240B
Authority
TW
Taiwan
Application number
TW104129332A
Other languages
Chinese (zh)
Other versions
TW201546905A (zh
Inventor
Hideto Yamaguchi
Tetsuya Kosugi
Masaaki Ueno
Original Assignee
Hitachi Int Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Int Electric Inc filed Critical Hitachi Int Electric Inc
Publication of TW201546905A publication Critical patent/TW201546905A/zh
Application granted granted Critical
Publication of TWI562240B publication Critical patent/TWI562240B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Vapour Deposition (AREA)
TW104129332A 2012-09-25 2013-09-09 熱電偶支撐體、基板處理裝置、溫度檢測方法及半導體裝置之製造方法 TW201546905A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012210264A JP6080451B2 (ja) 2012-09-25 2012-09-25 基板処理装置、半導体装置の製造方法、及び熱電対支持体

Publications (2)

Publication Number Publication Date
TW201546905A TW201546905A (zh) 2015-12-16
TWI562240B true TWI562240B (enExample) 2016-12-11

Family

ID=50547606

Family Applications (2)

Application Number Title Priority Date Filing Date
TW102132387A TWI511203B (zh) 2012-09-25 2013-09-09 A substrate processing apparatus, a manufacturing method of a semiconductor device, and a temperature detection method
TW104129332A TW201546905A (zh) 2012-09-25 2013-09-09 熱電偶支撐體、基板處理裝置、溫度檢測方法及半導體裝置之製造方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW102132387A TWI511203B (zh) 2012-09-25 2013-09-09 A substrate processing apparatus, a manufacturing method of a semiconductor device, and a temperature detection method

Country Status (4)

Country Link
US (3) US20140120636A1 (enExample)
JP (1) JP6080451B2 (enExample)
KR (2) KR101543375B1 (enExample)
TW (2) TWI511203B (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140134838A1 (en) * 2012-11-09 2014-05-15 Primestar Solar, Inc. Methods of annealing a conductive transparent oxide film layer for use in a thin film photovoltaic device
US9700951B2 (en) * 2014-05-28 2017-07-11 Hakko Corporation Heater sensor complex with high thermal capacity
JP6333126B2 (ja) 2014-08-29 2018-05-30 東京エレクトロン株式会社 磁気アニール装置及び磁気アニール方法
DE102014119593A1 (de) * 2014-12-23 2016-06-23 Endress + Hauser Wetzer Gmbh + Co. Kg Temperaturfühler
JP6579974B2 (ja) * 2015-02-25 2019-09-25 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、温度センサ及び半導体装置の製造方法
US10228291B2 (en) 2015-02-25 2019-03-12 Kokusai Electric Corporation Substrate processing apparatus, and thermocouple
US10535538B2 (en) * 2017-01-26 2020-01-14 Gary Hillman System and method for heat treatment of substrates
JP6857156B2 (ja) 2017-07-14 2021-04-14 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、基板保持具及び半導体装置の製造方法
KR20190008101A (ko) 2017-07-14 2019-01-23 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 기판 보지구 및 반도체 장치의 제조 방법
US10998205B2 (en) * 2018-09-14 2021-05-04 Kokusai Electric Corporation Substrate processing apparatus and manufacturing method of semiconductor device
JP7034324B2 (ja) 2018-09-18 2022-03-11 株式会社Kokusai Electric 基板温度センサ、温度制御システム、基板処理装置および半導体装置の製造方法
JP7117398B2 (ja) * 2019-01-07 2022-08-12 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法およびヒータユニット
CN114846587A (zh) * 2020-03-02 2022-08-02 株式会社国际电气 基板处理装置、半导体装置的制造方法和存储介质
JP6916920B1 (ja) * 2020-03-04 2021-08-11 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、治具、半導体装置の製造方法および基板処理装置の校正方法
TWI736449B (zh) * 2020-10-19 2021-08-11 中國鋼鐵股份有限公司 熱電偶之修復與固定裝置及其使用方法
JP7236420B2 (ja) * 2020-10-29 2023-03-09 株式会社Kokusai Electric 温度センサ、ヒータユニット、基板処理装置及び半導体装置の製造方法
JP7565885B2 (ja) * 2021-07-27 2024-10-11 三菱電機株式会社 半導体装置の製造方法および半導体製造装置
CN114234763B (zh) * 2021-12-31 2024-07-26 拓荆科技股份有限公司 位置调整量监测装置
CN114527009B (zh) * 2022-02-09 2023-07-04 南京钢铁股份有限公司 一种在热模拟试验机上熔化凝固过程控制方法
WO2025074667A1 (ja) 2023-10-06 2025-04-10 株式会社Kokusai Electric 温度測定アセンブリ、基板処理装置、基板処理方法、半導体装置の製造方法及びプログラム
KR102763912B1 (ko) 2024-07-11 2025-02-10 (주) 예스티 파티클 비산 방지 기능을 갖는 고압 어닐링 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63121431U (enExample) * 1987-01-30 1988-08-05
JP2006173531A (ja) * 2004-12-20 2006-06-29 Hitachi Kokusai Electric Inc 基板処理装置
TW201140699A (en) * 2006-03-07 2011-11-16 Hitachi Int Electric Inc Substrate processing device and substrate processing method thereof

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3165426A (en) * 1962-07-30 1965-01-12 Beckman Paul Thermopile
US3400587A (en) * 1965-09-03 1968-09-10 Bethlehem Steel Corp Apparatus for measuring the temperature of a moving surface
US4377550A (en) * 1981-01-29 1983-03-22 The United States Of America As Represented By The United States Department Of Energy High temperature liquid level sensor
JPH0648217B2 (ja) * 1987-12-24 1994-06-22 川惣電機工業株式会社 溶融金属の連続測温装置
US5517594A (en) * 1994-10-17 1996-05-14 Relman, Inc. Thermal reactor optimization
JP3471100B2 (ja) * 1994-11-07 2003-11-25 東京エレクトロン株式会社 縦型熱処理装置
JPH08210923A (ja) * 1995-02-06 1996-08-20 Kokusai Electric Co Ltd 加熱炉用の炉内温度測定器
JPH0997787A (ja) * 1995-09-30 1997-04-08 Tokyo Electron Ltd 処理装置
JPH1025577A (ja) * 1996-07-12 1998-01-27 Tokyo Electron Ltd 成膜処理装置
JP2000150404A (ja) * 1998-11-11 2000-05-30 Sony Corp 熱処理装置
WO2003040673A2 (en) * 2001-11-02 2003-05-15 Phipps Jack M Temperature sensor with enhanced ambient air temperature detection
JP4557499B2 (ja) 2003-04-07 2010-10-06 株式会社日立国際電気 基板処理装置
US20050098107A1 (en) * 2003-09-24 2005-05-12 Du Bois Dale R. Thermal processing system with cross-flow liner
JP4396547B2 (ja) * 2004-06-28 2010-01-13 東京エレクトロン株式会社 成膜方法、成膜装置及び記憶媒体
JP2006090742A (ja) 2004-09-21 2006-04-06 Okazaki Mfg Co Ltd シース型ｋ熱電対
KR100669861B1 (ko) * 2005-03-21 2007-01-16 삼성전자주식회사 반도체 기판 가공 장치
KR20060110951A (ko) * 2005-04-21 2006-10-26 삼성전자주식회사 스파이크형 열전대
WO2007018142A1 (ja) * 2005-08-09 2007-02-15 Hitachi Kokusai Electric Inc. 基板処理装置、基板の製造方法及び半導体装置の製造方法
JP2008227363A (ja) * 2007-03-15 2008-09-25 Hitachi Kokusai Electric Inc 基板処理装置
US7874726B2 (en) * 2007-05-24 2011-01-25 Asm America, Inc. Thermocouple
KR101012082B1 (ko) * 2007-06-25 2011-02-07 데이또꾸샤 가부시키가이샤 가열 장치 및 이것을 채용한 기판 처리 장치 및 반도체장치의 제조 방법 및 절연체
US20090095422A1 (en) * 2007-09-06 2009-04-16 Hitachi Kokusai Electric Inc. Semiconductor manufacturing apparatus and substrate processing method
KR101097945B1 (ko) * 2007-10-19 2011-12-22 가부시키가이샤 히다치 고쿠사이 덴키 온도 제어 방법, 온도 보정치 취득 방법, 반도체 디바이스를 제조하기 위한 방법, 기판 처리 장치
US7946762B2 (en) * 2008-06-17 2011-05-24 Asm America, Inc. Thermocouple
JP5647502B2 (ja) * 2010-02-23 2014-12-24 株式会社日立国際電気 熱処理装置、半導体装置の製造方法及び基板処理方法。
KR101172376B1 (ko) * 2010-06-11 2012-08-08 한국수력원자력 주식회사 외장 열전대를 이용한 용융금속 액위 측정 장치
KR101196723B1 (ko) * 2010-12-31 2012-11-07 주식회사수성기술 다결정 실리콘 잉곳 제조장치용 열전대
JP5980551B2 (ja) * 2011-07-13 2016-08-31 株式会社日立国際電気 温度検出部、基板処理装置、及び半導体装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63121431U (enExample) * 1987-01-30 1988-08-05
JP2006173531A (ja) * 2004-12-20 2006-06-29 Hitachi Kokusai Electric Inc 基板処理装置
TW201140699A (en) * 2006-03-07 2011-11-16 Hitachi Int Electric Inc Substrate processing device and substrate processing method thereof

Also Published As

Publication number Publication date
TWI511203B (zh) 2015-12-01
US10418293B2 (en) 2019-09-17
JP6080451B2 (ja) 2017-02-15
JP2014067766A (ja) 2014-04-17
KR20150035904A (ko) 2015-04-07
TW201546905A (zh) 2015-12-16
KR20140039987A (ko) 2014-04-02
KR101543375B1 (ko) 2015-08-11
TW201421585A (zh) 2014-06-01
US20190355630A1 (en) 2019-11-21
US11049742B2 (en) 2021-06-29
US20140120636A1 (en) 2014-05-01
US20180040520A1 (en) 2018-02-08
KR101579501B1 (ko) 2015-12-22

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