TWI558468B - Liquid film material dispensing device - Google Patents
Liquid film material dispensing device Download PDFInfo
- Publication number
- TWI558468B TWI558468B TW103140646A TW103140646A TWI558468B TW I558468 B TWI558468 B TW I558468B TW 103140646 A TW103140646 A TW 103140646A TW 103140646 A TW103140646 A TW 103140646A TW I558468 B TWI558468 B TW I558468B
- Authority
- TW
- Taiwan
- Prior art keywords
- tank
- film material
- path
- pressure sensor
- pressure
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
Landscapes
- Coating Apparatus (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014047141A JP6436634B2 (ja) | 2014-03-11 | 2014-03-11 | 液状の膜材料の吐出装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201534401A TW201534401A (zh) | 2015-09-16 |
TWI558468B true TWI558468B (zh) | 2016-11-21 |
Family
ID=54076904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103140646A TWI558468B (zh) | 2014-03-11 | 2014-11-24 | Liquid film material dispensing device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6436634B2 (ko) |
KR (1) | KR101730506B1 (ko) |
CN (1) | CN104907222B (ko) |
TW (1) | TWI558468B (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107262330B (zh) * | 2017-05-20 | 2019-05-07 | 郑州轻工业学院 | 一种带ccd计算机视觉定位的smt涂绘装置 |
JP6980339B2 (ja) * | 2017-09-05 | 2021-12-15 | 住友重機械工業株式会社 | 液体材料吐出装置及び液体材料吐出方法 |
KR102008709B1 (ko) * | 2017-12-27 | 2019-08-09 | (주)임펙 엔터프라이즈 | 코팅액 공급 장치 및 방법과 이를 위한 토출밸브 |
JP6964010B2 (ja) * | 2018-01-26 | 2021-11-10 | 日東シンコー株式会社 | コーティング剤供給装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW343163B (en) * | 1995-10-13 | 1998-10-21 | Misuzu Saw Mfg | Temperature controlling device for a flow coater |
TW200410760A (en) * | 2002-07-31 | 2004-07-01 | Seiko Epson Corp | Droplet discharge method and device, method of manufacturing liquid crystal device and liquid crystal device, and electronic apparatus |
CN1629211A (zh) * | 2003-12-01 | 2005-06-22 | 森泰浩 | 固体物质的表面改性方法以及经表面改性的固体物质 |
TW200716262A (en) * | 2005-07-25 | 2007-05-01 | Seiko Epson Corp | Method of forming film, patterning and method of manufacturing electronic device using thereof |
CN101903303A (zh) * | 2007-12-20 | 2010-12-01 | Beneq有限公司 | 用于形成气溶胶的装置以及用于涂覆玻璃的方法和设备 |
US20120304921A1 (en) * | 2011-06-02 | 2012-12-06 | Tokyo Ohka Kogyo Co., Ltd. | Heating apparatus, coating apparatus and heating method |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001314801A (ja) * | 2000-05-09 | 2001-11-13 | Seven Tec:Kk | 液剤施工システム |
JP2004087800A (ja) * | 2002-08-27 | 2004-03-18 | Tokyo Electron Ltd | 成膜装置および成膜装置の供給ノズル吐出制御方法 |
JP2005131829A (ja) | 2003-10-28 | 2005-05-26 | Sony Corp | 液体吐出性能維持方法及び液体吐出装置 |
JP4438678B2 (ja) * | 2005-04-22 | 2010-03-24 | セイコーエプソン株式会社 | 液滴吐出方法と液滴吐出装置、薄膜形成方法及びデバイス並びに電子機器 |
JP2007216108A (ja) | 2006-02-15 | 2007-08-30 | Hitachi Plant Technologies Ltd | 塗布装置 |
US7770760B2 (en) * | 2007-02-12 | 2010-08-10 | Illinois Tool Works Inc. | Modular system for the delivery of hot melt adhesive or other thermoplastic materials |
JP2008264767A (ja) * | 2007-03-28 | 2008-11-06 | Toshiba Corp | 液滴噴射塗布装置及び塗布体の製造方法 |
JP5169120B2 (ja) * | 2007-10-05 | 2013-03-27 | リコープリンティングシステムズ株式会社 | 液滴塗布装置 |
JP2012096524A (ja) * | 2010-05-24 | 2012-05-24 | Panasonic Corp | 循環式インクジェット装置 |
JP2013110236A (ja) * | 2011-11-21 | 2013-06-06 | Sumitomo Heavy Ind Ltd | 薄膜パターン形成装置及び薄膜パターン形成方法 |
JP5524154B2 (ja) * | 2011-09-09 | 2014-06-18 | 東京エレクトロン株式会社 | 液処理装置及び液処理方法 |
JP5698638B2 (ja) | 2011-09-27 | 2015-04-08 | 富士フイルム株式会社 | 液体付与装置及びインクジェット記録装置 |
US20140014683A1 (en) * | 2012-07-13 | 2014-01-16 | Nordson Corporation | Hot melt dispensing unit and method with integrated flow control |
JP2014030807A (ja) * | 2012-08-06 | 2014-02-20 | Sumitomo Heavy Ind Ltd | 薄膜形成装置及び基板製造方法 |
CN203370688U (zh) * | 2013-07-19 | 2014-01-01 | 中国科学院理化技术研究所 | 涂布装置 |
-
2014
- 2014-03-11 JP JP2014047141A patent/JP6436634B2/ja not_active Expired - Fee Related
- 2014-11-24 TW TW103140646A patent/TWI558468B/zh not_active IP Right Cessation
- 2014-11-25 CN CN201410691416.2A patent/CN104907222B/zh not_active Expired - Fee Related
- 2014-11-28 KR KR1020140168741A patent/KR101730506B1/ko active IP Right Grant
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW343163B (en) * | 1995-10-13 | 1998-10-21 | Misuzu Saw Mfg | Temperature controlling device for a flow coater |
TW200410760A (en) * | 2002-07-31 | 2004-07-01 | Seiko Epson Corp | Droplet discharge method and device, method of manufacturing liquid crystal device and liquid crystal device, and electronic apparatus |
CN1629211A (zh) * | 2003-12-01 | 2005-06-22 | 森泰浩 | 固体物质的表面改性方法以及经表面改性的固体物质 |
TW200716262A (en) * | 2005-07-25 | 2007-05-01 | Seiko Epson Corp | Method of forming film, patterning and method of manufacturing electronic device using thereof |
CN101903303A (zh) * | 2007-12-20 | 2010-12-01 | Beneq有限公司 | 用于形成气溶胶的装置以及用于涂覆玻璃的方法和设备 |
US20120304921A1 (en) * | 2011-06-02 | 2012-12-06 | Tokyo Ohka Kogyo Co., Ltd. | Heating apparatus, coating apparatus and heating method |
Also Published As
Publication number | Publication date |
---|---|
CN104907222A (zh) | 2015-09-16 |
KR20150106323A (ko) | 2015-09-21 |
JP2015170831A (ja) | 2015-09-28 |
JP6436634B2 (ja) | 2018-12-12 |
CN104907222B (zh) | 2018-02-16 |
TW201534401A (zh) | 2015-09-16 |
KR101730506B1 (ko) | 2017-04-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |