TWI557655B - Production efficiency system, production efficiency of the device and production efficiency of the method - Google Patents

Production efficiency system, production efficiency of the device and production efficiency of the method Download PDF

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Publication number
TWI557655B
TWI557655B TW101146792A TW101146792A TWI557655B TW I557655 B TWI557655 B TW I557655B TW 101146792 A TW101146792 A TW 101146792A TW 101146792 A TW101146792 A TW 101146792A TW I557655 B TWI557655 B TW I557655B
Authority
TW
Taiwan
Prior art keywords
processing device
processing
production efficiency
processed
transport
Prior art date
Application number
TW101146792A
Other languages
English (en)
Chinese (zh)
Other versions
TW201346790A (zh
Inventor
Taku Mizutani
Ichiro Namioka
Toshihiko Iijima
Shigenori Todate
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201346790A publication Critical patent/TW201346790A/zh
Application granted granted Critical
Publication of TWI557655B publication Critical patent/TWI557655B/zh

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Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31277—Dispatching rules, shortest travel time or bidding based to reduce empty travel
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32271—Decision of job dispatching, select job to process next on each machine
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P80/00—Climate change mitigation technologies for sector-wide applications
    • Y02P80/10—Efficient use of energy, e.g. using compressed air or pressurized fluid as energy carrier
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)
TW101146792A 2011-12-13 2012-12-12 Production efficiency system, production efficiency of the device and production efficiency of the method TWI557655B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011272476A JP6017134B2 (ja) 2011-12-13 2011-12-13 生産効率化システム、生産効率化装置および生産効率化方法

Publications (2)

Publication Number Publication Date
TW201346790A TW201346790A (zh) 2013-11-16
TWI557655B true TWI557655B (zh) 2016-11-11

Family

ID=48612320

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101146792A TWI557655B (zh) 2011-12-13 2012-12-12 Production efficiency system, production efficiency of the device and production efficiency of the method

Country Status (5)

Country Link
US (1) US10012980B2 (enExample)
JP (1) JP6017134B2 (enExample)
KR (1) KR101953423B1 (enExample)
TW (1) TWI557655B (enExample)
WO (1) WO2013088865A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6172022B2 (ja) * 2014-03-28 2017-08-02 株式会社デンソー 搬送システム
JP6330596B2 (ja) * 2014-09-16 2018-05-30 株式会社デンソー 搬送システム
DE102015211941A1 (de) * 2015-06-26 2016-12-29 Zf Friedrichshafen Ag Verfahren und Vorrichtung zur Reduzierung eines Energiebedarfs einer Werkzeugmaschine und Werkzeugmaschinensystem
NL2017837A (en) * 2015-11-25 2017-06-02 Asml Netherlands Bv A Measurement Substrate and a Measurement Method
WO2017098813A1 (ja) * 2015-12-09 2017-06-15 村田機械株式会社 搬送システム及び搬送方法
JP6605951B2 (ja) * 2015-12-25 2019-11-13 株式会社東芝 シミュレーション装置及びシミュレーション方法
CN106909129B (zh) * 2017-02-23 2019-10-18 惠科股份有限公司 一种搬运管理的方法及系统
CN107024867B (zh) * 2017-06-01 2019-10-25 合肥工业大学 一种考虑前视距离的相容工件族的优化控制方法
JP6792098B1 (ja) * 2019-02-07 2020-11-25 株式会社日立ハイテク 真空処理装置の運転方法
KR102876296B1 (ko) * 2021-10-07 2025-10-23 주식회사 엘지에너지솔루션 자동 안내 차량을 이용한 자동 운반 제어 방법 및 자동 운반 시스템

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW425598B (en) * 1998-10-30 2001-03-11 Tokyo Electron Ltd Processing system
TW200525601A (en) * 2004-01-07 2005-08-01 Trecenti Technologies Inc Semiconductor manufacturing system, work manufacturing system, and conveyance system
TW200719423A (en) * 2005-11-04 2007-05-16 Powerchip Semiconductor Corp A method for material handling analysis
US20100249993A1 (en) * 2009-03-30 2010-09-30 Ichiro Mitsuyoshi Substrate processing apparatus and substrate transport method

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4977361A (en) * 1978-06-26 1990-12-11 Eaton Corporation X-Y addressable workpiece positioner and mask aligner using same
US4687980A (en) * 1980-10-20 1987-08-18 Eaton Corporation X-Y addressable workpiece positioner and mask aligner using same
US4425537A (en) * 1978-06-26 1984-01-10 Optimetrix Corporation X-Y Addressable workpiece positioner and mask aligner using same
US4442388A (en) * 1980-04-02 1984-04-10 Optimetrix Corporation X-Y Addressable workpiece positioner having an improved X-Y address indicia sensor
US5399531A (en) 1990-12-17 1995-03-21 United Micrpelectronics Corporation Single semiconductor wafer transfer method and plural processing station manufacturing system
FR2676018B1 (fr) * 1991-05-02 1997-06-06 Prodel Jacques Installation pour la circulation de palettes motorisees porte-pieces.
DE4418206C2 (de) * 1994-05-25 1999-01-14 Siemens Ag CMOS-kompatibler Bipolartransistor und Herstellungsverfahren desselben
US6991012B2 (en) * 1996-03-21 2006-01-31 Coe Newnes/Mcgehee Inc. Apparatus for sawing a workpiece
USRE39579E1 (en) * 1997-04-04 2007-04-17 Renesas Technology Corp. Semiconductor integrated circuit device comprising RAM with command decode system and logic circuit integrated into a single chip and testing method of the RAM with command decode system
US6269279B1 (en) * 1997-06-20 2001-07-31 Tokyo Electron Limited Control system
JP2000099557A (ja) * 1998-09-25 2000-04-07 Hitachi Ltd 半導体集積回路装置、及びその製造方法、及び記憶媒体
JP3662150B2 (ja) * 1998-10-30 2005-06-22 東京エレクトロン株式会社 処理システム
JP3487774B2 (ja) 1998-11-19 2004-01-19 沖電気工業株式会社 半導体装置製造工程の搬送方法
JP4666723B2 (ja) * 1999-07-06 2011-04-06 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6952020B1 (en) * 1999-07-06 2005-10-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
EP1258915A1 (en) * 2001-05-17 2002-11-20 Infineon Technologies SC300 GmbH & Co. KG Method of detecting defects on a semiconductor device in a processing tool and an arrangement therefore
JP2002359272A (ja) * 2001-05-31 2002-12-13 Hirata Corp 処理システム
US6944842B1 (en) * 2001-06-27 2005-09-13 Xilinx, Inc. Method for making large-scale ASIC using pre-engineered long distance routing structure
US6601227B1 (en) * 2001-06-27 2003-07-29 Xilinx, Inc. Method for making large-scale ASIC using pre-engineered long distance routing structure
WO2003010614A1 (en) * 2001-07-24 2003-02-06 Honda Giken Kogyo Kabushiki Kaisha Work transfer method and system
JP4073186B2 (ja) 2001-09-20 2008-04-09 大日本スクリーン製造株式会社 基板処理装置のスケジュール作成方法及びそのプログラム
US6615093B1 (en) * 2002-01-04 2003-09-02 Taiwan Semiconductor Manufacturing Company Adaptive control algorithm for improving AMHS push lot accuracy
US8621786B2 (en) * 2003-02-13 2014-01-07 Wei Chak Joseph Lam Efficient layout and design of production facility
US7269925B2 (en) * 2002-06-14 2007-09-18 Wei Chak Joseph Lam Layout of production facility
CN1288315C (zh) * 2002-06-14 2006-12-06 约瑟夫·林惠泽 生产企业布局和设计
US6871115B2 (en) * 2002-10-11 2005-03-22 Taiwan Semiconductor Manufacturing Co., Ltd Method and apparatus for monitoring the operation of a wafer handling robot
JP3999649B2 (ja) 2002-12-19 2007-10-31 大日本スクリーン製造株式会社 基板処理装置とその動作方法、およびプログラム
JP4143828B2 (ja) 2003-03-14 2008-09-03 村田機械株式会社 搬送台車システム
JP4449319B2 (ja) * 2003-03-25 2010-04-14 株式会社デンソー 製造管理方法
US7861228B2 (en) * 2003-12-03 2010-12-28 Hewlett-Packard Development Company, L.P. Variable delay instruction for implementation of temporal redundancy
US7512455B2 (en) * 2004-03-29 2009-03-31 Palo Alto Research Center Incorporated Method for self-synchronization of modular production systems
US7203563B2 (en) * 2004-04-08 2007-04-10 Taiwan Semiconductor Manufacturing Company, Ltd. Automatic N2 purge system for 300 mm full automation fab
US7966714B2 (en) * 2004-10-12 2011-06-28 Precision Automation, Inc. Multi-step systems for processing workpieces
KR101388345B1 (ko) * 2005-09-09 2014-04-22 가부시키가이샤 니콘 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법
KR100714274B1 (ko) * 2005-10-24 2007-05-02 삼성전자주식회사 반도체 제조설비의 관리시스템
JP5091413B2 (ja) 2006-03-08 2012-12-05 東京エレクトロン株式会社 基板処理装置および基板処理装置の制御方法
JP5032048B2 (ja) * 2006-03-31 2012-09-26 東京エレクトロン株式会社 基板処理装置の制御装置，制御方法および制御プログラムを記憶した記録媒体
JP2008124194A (ja) * 2006-11-10 2008-05-29 Canon Inc 液浸露光方法および液浸露光装置
KR20100033527A (ko) 2007-07-11 2010-03-30 히다치 가세고교 가부시끼가이샤 회로 부재 접속용 접착제
US8396826B2 (en) * 2007-12-17 2013-03-12 Landmark Graphics Corporation Systems and methods for optimization of real time production operations
US8170861B2 (en) * 2008-07-29 2012-05-01 GM Global Technology Operations LLC Method for distributed hybrid emulation of manufacturing systems
US8781882B1 (en) * 2008-08-07 2014-07-15 Accenture Global Services Limited Automotive industry high performance capability assessment
JP5119506B2 (ja) * 2009-05-20 2013-01-16 日本電気株式会社 半導体集積回路の設計装置、そのデータ処理方法、およびその制御プログラム
EP2264529A3 (en) * 2009-06-16 2011-02-09 ASML Netherlands B.V. A lithographic apparatus, a method of controlling the apparatus and a method of manufacturing a device using a lithographic apparatus
WO2013077191A1 (ja) * 2011-11-25 2013-05-30 東京エレクトロン株式会社 処理装置群コントローラ、生産処理システム、処理装置群制御方法、生産効率化システム、生産効率化装置および生産効率化方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW425598B (en) * 1998-10-30 2001-03-11 Tokyo Electron Ltd Processing system
TW200525601A (en) * 2004-01-07 2005-08-01 Trecenti Technologies Inc Semiconductor manufacturing system, work manufacturing system, and conveyance system
TW200719423A (en) * 2005-11-04 2007-05-16 Powerchip Semiconductor Corp A method for material handling analysis
US20100249993A1 (en) * 2009-03-30 2010-09-30 Ichiro Mitsuyoshi Substrate processing apparatus and substrate transport method

Also Published As

Publication number Publication date
WO2013088865A1 (ja) 2013-06-20
TW201346790A (zh) 2013-11-16
US10012980B2 (en) 2018-07-03
JP2013125788A (ja) 2013-06-24
KR20140102678A (ko) 2014-08-22
US20140297017A1 (en) 2014-10-02
JP6017134B2 (ja) 2016-10-26
KR101953423B1 (ko) 2019-02-28

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