KR101953423B1 - 생산 효율화 시스템, 생산 효율화 장치 및 생산 효율화 방법 - Google Patents

생산 효율화 시스템, 생산 효율화 장치 및 생산 효율화 방법 Download PDF

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KR101953423B1
KR101953423B1 KR1020147016031A KR20147016031A KR101953423B1 KR 101953423 B1 KR101953423 B1 KR 101953423B1 KR 1020147016031 A KR1020147016031 A KR 1020147016031A KR 20147016031 A KR20147016031 A KR 20147016031A KR 101953423 B1 KR101953423 B1 KR 101953423B1
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processing
production efficiency
conveying
conveyance
processing apparatus
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KR20140102678A (ko
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다쿠 미즈타니
이치로 나미오카
도시히코 이이지마
시게노리 도다테
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도쿄엘렉트론가부시키가이샤
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31277—Dispatching rules, shortest travel time or bidding based to reduce empty travel
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32271—Decision of job dispatching, select job to process next on each machine
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P80/00—Climate change mitigation technologies for sector-wide applications
    • Y02P80/10—Efficient use of energy, e.g. using compressed air or pressurized fluid as energy carrier
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)
KR1020147016031A 2011-12-13 2012-11-08 생산 효율화 시스템, 생산 효율화 장치 및 생산 효율화 방법 Expired - Fee Related KR101953423B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011272476A JP6017134B2 (ja) 2011-12-13 2011-12-13 生産効率化システム、生産効率化装置および生産効率化方法
JPJP-P-2011-272476 2011-12-13
PCT/JP2012/078923 WO2013088865A1 (ja) 2011-12-13 2012-11-08 生産効率化システム、生産効率化装置および生産効率化方法

Publications (2)

Publication Number Publication Date
KR20140102678A KR20140102678A (ko) 2014-08-22
KR101953423B1 true KR101953423B1 (ko) 2019-02-28

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Country Status (5)

Country Link
US (1) US10012980B2 (enExample)
JP (1) JP6017134B2 (enExample)
KR (1) KR101953423B1 (enExample)
TW (1) TWI557655B (enExample)
WO (1) WO2013088865A1 (enExample)

Cited By (1)

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KR20200098473A (ko) * 2019-02-07 2020-08-20 주식회사 히타치하이테크 진공 처리 장치의 운전 방법

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JP6330596B2 (ja) * 2014-09-16 2018-05-30 株式会社デンソー 搬送システム
DE102015211941A1 (de) * 2015-06-26 2016-12-29 Zf Friedrichshafen Ag Verfahren und Vorrichtung zur Reduzierung eines Energiebedarfs einer Werkzeugmaschine und Werkzeugmaschinensystem
NL2017837A (en) * 2015-11-25 2017-06-02 Asml Netherlands Bv A Measurement Substrate and a Measurement Method
WO2017098813A1 (ja) * 2015-12-09 2017-06-15 村田機械株式会社 搬送システム及び搬送方法
JP6605951B2 (ja) * 2015-12-25 2019-11-13 株式会社東芝 シミュレーション装置及びシミュレーション方法
CN106909129B (zh) * 2017-02-23 2019-10-18 惠科股份有限公司 一种搬运管理的方法及系统
CN107024867B (zh) * 2017-06-01 2019-10-25 合肥工业大学 一种考虑前视距离的相容工件族的优化控制方法
KR102876296B1 (ko) * 2021-10-07 2025-10-23 주식회사 엘지에너지솔루션 자동 안내 차량을 이용한 자동 운반 제어 방법 및 자동 운반 시스템

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KR20200098473A (ko) * 2019-02-07 2020-08-20 주식회사 히타치하이테크 진공 처리 장치의 운전 방법
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Also Published As

Publication number Publication date
WO2013088865A1 (ja) 2013-06-20
TW201346790A (zh) 2013-11-16
US10012980B2 (en) 2018-07-03
JP2013125788A (ja) 2013-06-24
TWI557655B (zh) 2016-11-11
KR20140102678A (ko) 2014-08-22
US20140297017A1 (en) 2014-10-02
JP6017134B2 (ja) 2016-10-26

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