TWI556465B - A sputtering target for forming a transparent film for a solar cell and a method for manufacturing the same - Google Patents
A sputtering target for forming a transparent film for a solar cell and a method for manufacturing the same Download PDFInfo
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- TWI556465B TWI556465B TW101104037A TW101104037A TWI556465B TW I556465 B TWI556465 B TW I556465B TW 101104037 A TW101104037 A TW 101104037A TW 101104037 A TW101104037 A TW 101104037A TW I556465 B TWI556465 B TW I556465B
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- transparent film
- sputtering target
- solar cell
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- 238000005477 sputtering target Methods 0.000 title claims description 49
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 238000000034 method Methods 0.000 title description 5
- 239000000843 powder Substances 0.000 claims description 35
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 32
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 28
- 239000011812 mixed powder Substances 0.000 claims description 16
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 14
- 239000002131 composite material Substances 0.000 claims description 12
- 239000012535 impurity Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000005245 sintering Methods 0.000 claims description 4
- 239000010408 film Substances 0.000 description 79
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 70
- 239000011787 zinc oxide Substances 0.000 description 34
- 238000004544 sputter deposition Methods 0.000 description 32
- 239000011701 zinc Substances 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 16
- 239000000203 mixture Substances 0.000 description 12
- 230000002159 abnormal effect Effects 0.000 description 8
- 239000010409 thin film Substances 0.000 description 8
- 238000002441 X-ray diffraction Methods 0.000 description 6
- -1 polyethylene Polymers 0.000 description 6
- 238000007731 hot pressing Methods 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 239000005083 Zinc sulfide Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 2
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910007541 Zn O Inorganic materials 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- UGZADUVQMDAIAO-UHFFFAOYSA-L zinc hydroxide Chemical compound [OH-].[OH-].[Zn+2] UGZADUVQMDAIAO-UHFFFAOYSA-L 0.000 description 1
- 229940007718 zinc hydroxide Drugs 0.000 description 1
- 229910021511 zinc hydroxide Inorganic materials 0.000 description 1
- RMAKSEQFVRNWKO-UHFFFAOYSA-N zinc;cerium(3+);oxygen(2-) Chemical compound [O-2].[Zn+2].[Ce+3] RMAKSEQFVRNWKO-UHFFFAOYSA-N 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/453—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
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- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/64—Burning or sintering processes
- C04B35/645—Pressure sintering
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
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- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/02168—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells the coatings being antireflective or having enhancing optical properties for the solar cells
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Description
本發明有關很適合作為薄膜太陽電池(thin film solar cell)用之低折射率的透明膜之ZnO-SiO2-Al2O3(氧化鋅-二氧化矽-三氧化二鋁)膜的成膜之太陽電池用透明膜形成用濺鍍靶(sputtering target)及其製造方法。
近年來,薄膜太陽電池已開始提供為實用。此種薄膜太陽電池,具有形成有AZO(Al-Zn-O:Aluminium doped Zinc Oxide:摻雜有鋁之氧化鋅)等的透明電極層(transparent electrode layer)、再於該透明電極層上形成有為防止反射用之低折射率的透明膜之基本構造。
上述低折射率的透明膜,係配置於透明導電膜(transparent conductive film)的上面藉以緩和與大氣之間的折射率的變化而防止反射之用所設置者。
在來,例如專利文獻1中所記載,透明導電層上之低折射率透明膜,係由MgF2(氟化鎂)所形成者。
又,例如專利文獻2中所記載,為抑制各層的折射率差為小,抑制在界面的反射以增大到達受光面(light reception surface)之光量起見、為連續性增大折射率起見,形成有多層的防反射塗膜(anti-reflection coating)。
[先前技術文獻]
[專利文獻]
[專利文獻1]日本專利特開2001-257374號公報
[專利文獻2]日本專利特開平7-235684號公報
上述在來技術中,尚留存有下述的課題。
亦即,低折射率的透明膜而言,以往,在採用折射率1.37(對波長550nm的光)的MgF2膜,惟由於該MgF2膜下的透明導電層之AZO膜的折射率為1.8(對波長550nm的光)之故,因兩者的折射率差而有發生相當不少程度之光反射之問題。因此,希望開發一種使具有較AZO膜為低,而接近MgF2膜之折射率之透明膜介在兩者之間,以使階段性變化折射率,藉以抑制光的反射之作法。又,希望開發一種能將此種太陽電池用透明膜,利用生產性優異的DC(直流)濺鍍進行成膜之濺鍍靶。
本發明乃係鑑於前述之課題所開發者,其目的在於提供一種能將較AZO膜之折射率為低的ZnO-SiO2-Al2O3膜進行DC濺鍍之太陽電池用透明膜形成用濺鍍靶及其製造方法。
本發明人等根據,如使AZO膜中含有SiO2則折射率會降低之事實,為製造能作為太陽電池用透明膜之ZnO-SiO2-Al2O3膜之成膜之濺鍍靶起見,進行研究。於此研究中,如將
Al2O3粉末與SiO2粉末與ZnO粉末之混合粉末在大氣中燒成或氮氣氣氛中燒成以製作濺鍍靶之情形,發生SiO2與ZnO進行反應而成為複合氧化物(compound oxide),並且電阻升高為1×106Ω/cm2以上而發生異常放電,以致不能進行DC濺鍍之問題。又,如將SiO2的含量設定為少量時,雖然依上述製法仍能製得低電阻的濺鍍靶,惟利用該濺鍍靶之成膜時,則不能獲得作為太陽電池用透明膜所要求之低折射率。於是,本發明人等再進行研究之結果發現,如成分組成控制為既定範圍以實施熱壓(hot pressing)時,則可製得低電阻且能進行良好的DC濺鍍之濺鍍靶,如使用該濺鍍靶以進行濺鍍成膜時則可製得一種低折射率之ZnO-SiO2-Al2O3膜之事實。
因而,本發明係根據上述心得所開發者,為解決前述課題起見,採用如下述之構成。亦即,本發明之濺鍍靶,係由具有對全金屬成分量含有Al:0.3至4.0wt(重量)%、Si:6.0至14.5wt%、餘部為由Zn以及不可避免之不純物所成之成分組成之氧化物燒結體所成者,其特徵為:該燒結體的組織中存在有複合氧化物Zn2SiO4及ZnO。
由於此種太陽電池用透明膜形成用濺鍍靶,係由具有對全金屬成分量含有Al:0.3至4.0wt%、Si:6.0至14.5wt%、餘部為由Zn以及不可避免之不純物所成之成分組成之氧化物燒結體所成,而於該燒結體的組織中存在有複合氧化物Zn2SiO4及ZnO之故,複合氧化物Zn2SiO4與ZnO共存於組織中而藉以獲得導電性,除能進行良好的
DC濺鍍之同時,尚可製得較AZO膜為低折射率且適合於太陽電池用透明膜之ZnO-SiO2-Al2O3膜。
在此,將上述Al的含量作成0.3至4.0wt%之理由,係如在0.3wt%以下時,則由於不能獲得足夠的導電性而發生異常放電,以致不能實施DC濺鍍之故,如在4.0wt%以上時,則由於將發生起因於所產生之Al2O3與ZnO的複合氧化物ZnAl2O4之異常放電,以致不能實施DC濺鍍之故。
又,將上述Si的含量作成6.0至14.5wt%之理由,係如在6.0wt%以下時,是由於不能獲得降低折射率之充分的效果,如在14.5wt%以上時,是由於不能獲得足夠的導電性而發生異常放電,以致不能實施DC濺鍍之故。
又,本發明之太陽電池用透明膜形成用濺鍍靶之特徵為:前述燒結體的密度,係以理論密度比(theoretical density ratio)計,為100至108%。
由於該太陽電池用透明膜形成用濺鍍靶,係燒結體的密度為理論密度的100至108%之故,除能實施DC濺鍍之同時,尚可抑制靶龜裂。
亦即,將上述燒結體的密度以理論密度比計,作成100至108%之理由,係如在100%以下時,則由於會發生靶龜裂等問題之故,如在108%以上時,則由於殆全部將成為複合氧化物Zn2SiO4的組織,以致不能實施藉由DC濺鍍之放電之故。
在此,為理論密度比的計算上,採用ZnO:5.61g/cm3
、SiO2:2.20g/cm3、Al2O3:3.99g/cm3之值進行計算。
又,本發明之太陽電池用透明膜形成用濺鍍靶之特徵為:體電阻(bulk resistance),為1Ω.cm以下。
亦即,由於該太陽電池用透明膜形成用濺鍍靶,係體電阻在1Ω.cm以下之故,能穩定進行良好的DC濺鍍。
本發明之太陽電池用透明膜形成用濺鍍靶之製造方法,係製作上述太陽電池用透明膜形成用濺鍍靶之方法,其特徵為:包含;將Al2O3粉末與SiO2粉末與ZnO粉末,按能成為由Al2O3:0.5至5.0wt%、SiO2:10至22wt%、餘部:ZnO以及不可避免之不純物所成之方式混合以作成混合粉末之步驟、及將前述混合粉末在真空中使用熱壓機(hot press)以進行燒結之步驟。
亦即,於該太陽電池用透明膜形成用濺鍍靶之製造方法中,由於依上述的範圍混合Al2O3粉末與SiO2粉末與ZnO粉末以作成混合粉末之步驟後,將前述混合粉末在真空中使用熱壓機以進行燒結之故,能穩定地實施良好的DC濺鍍,且可製作能進行低折射率透明膜之成膜之濺鍍靶。
如採用本發明,則可發揮如下述之效果。
亦即,如採用有關本發明之太陽電池用透明膜形成用濺鍍靶,則由於由具有對全金屬成分量含有:Al:0.3至4.0wt%、Si:6.0至14.5wt%、餘部為由Zn以及不可避免
之不純物所成之成分組成之氧化物燒結體所成,而於該燒結體的組織中存在有複合氧化物Zn2SiO4及ZnO之故,可製得一種除能進行良好的DC濺鍍之同時,尚較AZO膜之折射率為低且適合於太陽電池用透明膜之ZnO-SiO2-Al2O3膜。如採用本發明之濺鍍靶之製造方法,而將經依上述的範圍混合Al2O3粉末與SiO2粉末與ZnO粉末之混合粉末,在真空中使用熱壓機進行燒結後,則可製作上述濺鍍靶。
因而,在經採用本發明之濺鍍靶並藉由DC濺鍍所成膜之太陽電池用透明膜,可獲得作為薄膜太陽電池的AZO膜(透明電極層)上所形成之防止反射用之透明膜所要求之低折射率,且能以低成本製作轉換效率(convertion efficiency)良好的薄膜太陽電池。
以下,在參考第1圖及第2圖之下,將有關本發明之太陽電池用透明膜形成用濺鍍靶及其製造方法之一實施形態加以說明。
本實施形態之太陽電池用透明膜形成用濺鍍靶,係由具有對全金屬成分量含有:Al:0.3至4.0wt%、Si:6.0至14.5wt%、餘部為由Zn以及不可避免之不純物所成之成分組成之氧化物燒結體所成,於該燒結體之組織中存在有複合氧化物Zn2SiO4及ZnO之靶。
又,該濺鍍靶,係燒結體的密度為理論密度之100至
108%者。再者,該濺鍍靶,係體電阻為1Ω.cm以下者。
製作本實施形態之太陽電池用透明膜形成用濺鍍靶之方法,包含;將Al2O3粉末與SiO2粉末與ZnO粉末,按能成為由Al2O3:0.5至5.0wt%、SiO2:10至22wt%、餘部:ZnO以及不可避免之不純物所成之方式混合以作成混合粉末之步驟、及將前述混合粉末在真空中使用熱壓機以進行燒結之步驟。
如就上述製法之一例加以詳述時,則例如,第1圖所示般,首先將Al2O3粉末與SiO2粉末與ZnO粉末按能成為上述含量範圍之方式進行稱量,使用濕式球磨機加以粉碎.混合以製作混合粉末。例如,將經稱量所得之各粉末及氧化鋯球置入聚乙烯容器(聚乙烯製壼)中,使用球磨機裝置進行濕式混合既定時間,以作成混合粉末。在此,為溶劑,則例如,採用乙醇。
其次,將所得之混合粉末乾燥後,過篩例如,篩孔:250μm的篩子並造粒、再在真空乾燥後,例如在1200℃下5小時,以200kgf(千克力)/cm2的壓力、在真空中進行熱壓以作成燒結體。在此,熱壓溫度,較佳為1100至1250℃的範圍,壓力較佳為150至350kgf/cm2之範圍。
經如此方式熱壓之燒結體,通常採用放電加工、切削或磨削技法機械加工為靶的指定形狀,將加工後的靶以In(銦)作為銲劑,並黏合(bonding)於由Cu(銅)或SUS(不鏽鋼)或者其他金屬(例如,Mo(鉬))所成之背板(backing
plate)以供為濺鍍之用。
在此,其他的製造方法而言,亦可為將上述製造方法之濕式球磨機所成之粉碎、混合,以純水作為溶劑並使用內容積300L(公升)的球磨機裝置來進行,然後,經由噴霧乾燥所乾燥造粒者,再使用乾式球磨機加以撕碎,並將該撕碎粉末按與上述同樣方式進行熱壓之方法。又,亦可為經省略使用上述乾式球磨機之撕碎過程之方法。
經使用該本實施形態之濺鍍靶實施DC濺鍍之太陽電池用透明膜,具有含有Al2O3:0.5至5.0wt%、SiO2:10至22wt%、餘部為由ZnO以及不可避免之不純物所成之成分組成。
經採用此種太陽電池用透明膜之薄膜太陽電池,例如第2圖所示,係於鹼石灰玻璃基板(soda lime glass board)1上依序層合:Mo(鉬)後面電極(rear-face electrode)2、CIGS(銅銦鎵硒)吸收層3、屬於n型半導體層之ZnO(氧化鋅),ZnS(硫化鋅),ZnOH(氫氧化鋅),CdS(硫化鎘)等的緩衝層(buffer layer)4、屬於高電阻層之i(異)ZnO緩衝層5、屬於上部透明電極層之AZO電極6、防反射膜7a、7b、以及表面電極8、所構成,其中,屬於MgF2(氟化鎂)膜之防反射膜7b與AZO電極6之間的防反射膜7a,即為本實施形態之太陽電池用透明膜。
於如此之本實施形態之太陽電池用透明膜形成用濺鍍靶中,由於由具有對全金屬成分量含有Al:0.3至4.0wt%、Si:6.0至14.5wt%、餘部為由Zn以及不可避免之不純
物所成之成分組成之氧化物燒結體所成、而於該燒結體的組織中存在有複合氧化物Zn2SiO4及ZnO之故,藉由組織中共存有複合氧化物Zn2SiO4與ZnO之結果獲得導電性,而可製得除能進行良好的DC濺鍍之同時,尚較AZO膜之折射率為低且適合於太陽電池用透明膜之ZnO-SiO2-Al2O3膜。
又,由於該太陽電池用透明膜形成用濺鍍靶的燒結體密度,係理論密度的100至108%之故,除能進行DC濺鍍之同時,尚可抑制靶的龜裂。
再者,由於該太陽電池用透明膜形成用濺鍍靶的體電阻,係1Ω.cm以下之故,能穩定進行良好的DC濺鍍。
又,由於本實施形態之太陽電池用透明膜形成用濺鍍靶之製造方法,係將Al2O3粉末與SiO2粉末與ZnO粉末,依上述的範圍進行混合以作成混合粉末之步驟後,將此混合粉末在真空中使用熱壓機進行燒結之故,能穩定進行良好的DC濺鍍,而可製作能進行低折射率透明膜之成膜之上述濺鍍靶。
再者,由於採用該濺鍍靶以進行DC濺鍍所得之防反射用透明膜,係依上述含有範圍含有Al2O3、SiO,並具有餘部為由ZnO以及不可避免之不純物所成之成分組成之故,可獲得作為將形成於薄膜太陽電池的透明電極層上之防反射用透明膜所需要之低折射率,如採用該膜,則可作為太陽電池而獲得高的轉換效率。
將就根據上述本實施形態實際所製作之太陽電池用透明膜形成用濺鍍靶之實施例所評價之結果,加以說明如下。
本實施例之製造,係依下列條件所實施者。
首先,將Al2O3粉末及SiO2粉末及ZnO粉末,依表1中所示之各比例加以稱量後,將所得之粉末及其4倍量(重量比)的氧化鋯球(將直徑5mm的球及直徑10mm的球各一半)置入10公升的聚乙烯容器(聚乙烯製壼)中,使用球磨機裝置進行濕式混合48小時,作成混合粉末。在此,為溶劑,則例如,採用乙醇。
其次,將所得之混合粉末乾燥後,過篩例如,篩孔250μm的篩子並造粒,再在真空乾燥後,在1200℃下5小時,以200kgf/cm2的壓力,在真空中進行熱壓以作成燒結體。
將經如此方式熱壓之燒結體,機械加工為靶的指定形狀(直徑125mm、厚度10mm),並將經加工者黏合於由無氧銅所成之背板以製作本實施例之濺鍍靶。
再者,作為比較例1至11,將Al2O3粉末及SiO2粉末及ZnO粉末依表1所示之各比例稱量,並將所得之各粉末混合,以0.6t(噸)/cm2加壓,再使用CIP(冷間等靜水壓壓機)依175MPa(兆帕斯卡)進行成型,將此在1400℃下實施大氣燒成以製作濺鍍靶。又,作為比較例12至14,按本發明之成分組成的範圍外而依表1中所示之各比例稱量
,按與本實施例同樣條件進行真空熱壓以製作濺鍍靶。
再者,將此等濺鍍靶裝附於磁控式濺鍍裝置(magnetron sputtering device)上,依電源:DC(直流)、施加電力:200W(瓦特)、到達真空度:1×10-4Pa(帕)、濺鍍氣體:Ar(氬)、濺鍍壓力:0.67Pa之條件,於經加熱為200℃之玻璃基板(康寧公司1737#縱:20×橫:20、厚度:0.7mm)上,嘗試具有膜厚:300nm之透明膜之形成。
就如此所製作之本發明之實施例及比較例,分別測定:燒結體的密度(理論密度比),藉由X射線繞射法(XRD)之ZnO(101)及Zn2SiO4(410)的繞射峰值之有無、DC濺鍍之可否、體電阻、60分鐘之DC濺鍍時的異常放電(extraordinary discharge)次數、經DC濺鍍之透明膜的折射率(對波長380nm、550nm、750nm的光),並加以評價。將其結果表示於表1中。
由此結果可知,採用大氣燒成之比較例之中,在Al2O3的含量少而不含SiO2之比較例1、2,則異常放電次數多以致不能實施穩定的DC濺鍍、在雖然有某程度之Al2O3的含量惟不含SiO2之比較例3至5,則未能獲得低折射率。又,採用大氣燒成之比較例之中,Al2O3的含量多而不含SiO2之比較例6、7,則異常放電次數多以致不能實施穩定的DC濺鍍,在含有Al2O3及SiO2之比較例8至11,則異常放電次數多或靶不具有導電性以致不能實施DC濺鍍。在此,比較例1至7中,密度均在理論密度之100%以下者。
再者,採用熱壓機之比較例之中,SiO2的含量較本發明之範圍為少的比較例12中,則未能獲得低的折射率而SiO2的含量較本發明之範圍為多之比較例13中,則靶不具有導電性以致未能實施DC濺鍍。又,Al2O3的含量較本發明之範圍為多之比較例14中,則異常放電次數多以致未能實施穩定的DC濺鍍。再者,在比較例8,12,14,則雖於XRD時觀察有ZnO(101)及Zn2SiO4(410)的兩峰值,然而由於Al或Si的含量係本發明之範圍外之故,發生有上述之缺點。
相對於此,本實施例中,均於XRD觀察有ZnO(101)及Zn2SiO4(410)的兩峰值,因異常放電次數非常少之故能穩定實施有良好的DC濺鍍、就折射率而言,亦均獲得有較AZO膜為低的折射率。又,就密度而言,於本實施例中,均在理論密度的100至108%之範圍內。
其次,就表1中所示實施例3(SiO2:20wt%),將藉由X射線繞射(XRD)所觀察之結果,表示於第3圖中。在此實施例3中,均以高的強度觀察有複合氧化物Zn2SiO4的(410)的繞射峰值及ZnO的(101)的繞射峰值。相對於此,經按與實施例3同樣成分組成但依大氣燒成所製作之比較例中,則如第4圖所示,未能獲得ZnO的(101)的繞射峰值。因而,如欲獲得導電性時,則如本實施例般,需要在組織中共存複合氧化物Zn2SiO4及ZnO之情況。
再者,本發明之技術範圍並不因上述實施形態及上述實施例而有所限定,可於不脫離本發明之要旨之範圍內加以種種變更。
1‧‧‧鹼石灰玻璃基板
2‧‧‧Mo後面電極
3‧‧‧CIGS吸收層
4‧‧‧緩衝層
5‧‧‧i-ZnO緩衝層
6‧‧‧AZO電極
7a‧‧‧防反射膜(太陽電池用透明膜)
7b‧‧‧防反射膜(MgF2膜)
8‧‧‧表面電極
[第1圖]於有關本發明之太陽電池用透明膜形成用濺鍍靶及其製造方法之實施形態中,表示濺鍍靶之製造過程之流程圖。
[第2圖]表示經採用本實施形態之太陽電池用透明膜之薄膜太陽電池之概略剖面圖。
[第3圖]於有關本發明之太陽電池用透明膜形成用濺鍍靶及其製造方法之實施例中,表示濺鍍靶之X射線繞射(XRD)的分析結果之圖。
[第4圖]於有關本發明之太陽電池用透明膜形成用濺鍍靶及其製造方法之比較例(大氣燒成)中,表示濺鍍靶的X射線繞射(XRD)的分析結果之圖。
Claims (2)
- 一種太陽電池用透明膜形成用濺鍍靶,其特徵為:由氧化物燒結體所構成,且該氧化物燒結體具有對全金屬成分量含有Al:0.3至4.0wt%、Si:6.0至14.5wt%,餘部為由Zn以及不可避免之不純物所成之成分組成,該燒結體的組織中存在有複合氧化物Zn2SiO4及ZnO,該燒結體的密度係以理論密度比計為100至108%。
- 一種太陽電池用透明膜形成用濺鍍靶之製造方法,其係製作如申請專利範圍第1項之太陽電池用透明膜形成用濺鍍靶之方法,其特徵為具有:將Al2O3粉末與SiO2粉末與ZnO粉末,按照由Al2O3:0.5至5.0wt%、SiO2:10至22wt%、餘部:ZnO以及不可避免之不純物所成之方式混合作成混合粉末之步驟、及將前述混合粉末在真空中使用熱壓機以進行燒結之步驟。
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CN107207356B (zh) * | 2015-02-27 | 2020-12-08 | 捷客斯金属株式会社 | 氧化物烧结体、氧化物溅射靶和氧化物薄膜 |
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