TWI551721B - 排氣阱 - Google Patents

排氣阱 Download PDF

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Publication number
TWI551721B
TWI551721B TW101133232A TW101133232A TWI551721B TW I551721 B TWI551721 B TW I551721B TW 101133232 A TW101133232 A TW 101133232A TW 101133232 A TW101133232 A TW 101133232A TW I551721 B TWI551721 B TW I551721B
Authority
TW
Taiwan
Prior art keywords
baffle
gas
exhaust
baffles
diameter hole
Prior art date
Application number
TW101133232A
Other languages
English (en)
Chinese (zh)
Other versions
TW201329282A (zh
Inventor
小池悟
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TW201329282A publication Critical patent/TW201329282A/zh
Application granted granted Critical
Publication of TWI551721B publication Critical patent/TWI551721B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D45/00—Separating dispersed particles from gases or vapours by gravity, inertia, or centrifugal forces
    • B01D45/04—Separating dispersed particles from gases or vapours by gravity, inertia, or centrifugal forces by utilising inertia
    • B01D45/08—Separating dispersed particles from gases or vapours by gravity, inertia, or centrifugal forces by utilising inertia by impingement against baffle separators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
    • B01D46/10—Particle separators, e.g. dust precipitators, using filter plates, sheets or pads having plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D50/00—Combinations of methods or devices for separating particles from gases or vapours
    • B01D50/20—Combinations of devices covered by groups B01D45/00 and B01D46/00

Landscapes

  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW101133232A 2011-09-13 2012-09-12 排氣阱 TWI551721B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011199622A JP5728341B2 (ja) 2011-09-13 2011-09-13 排気トラップ

Publications (2)

Publication Number Publication Date
TW201329282A TW201329282A (zh) 2013-07-16
TWI551721B true TWI551721B (zh) 2016-10-01

Family

ID=47828749

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101133232A TWI551721B (zh) 2011-09-13 2012-09-12 排氣阱

Country Status (5)

Country Link
US (1) US20130061969A1 (cg-RX-API-DMAC7.html)
JP (1) JP5728341B2 (cg-RX-API-DMAC7.html)
KR (1) KR101538830B1 (cg-RX-API-DMAC7.html)
CN (1) CN102989238B (cg-RX-API-DMAC7.html)
TW (1) TWI551721B (cg-RX-API-DMAC7.html)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103752122B (zh) * 2014-02-11 2015-11-11 江苏佳有环保科技有限公司 漆气氧化洗涤塔装置
JP6468884B2 (ja) 2014-04-21 2019-02-13 東京エレクトロン株式会社 排気システム
US10927457B2 (en) * 2015-03-04 2021-02-23 Toshiba Memory Corporation Semiconductor manufacturing apparatus
US10982319B2 (en) 2015-08-21 2021-04-20 Flisom Ag Homogeneous linear evaporation source
TWI624554B (zh) * 2015-08-21 2018-05-21 弗里松股份有限公司 蒸發源
JP6610806B2 (ja) 2016-10-14 2019-11-27 株式会社Ｉｈｉ 気相プロセス用再熱捕集装置
TWI665019B (zh) * 2017-02-15 2019-07-11 辛耘企業股份有限公司 基板處理裝置
KR102422106B1 (ko) * 2017-03-22 2022-07-15 스미스 아날리티컬 엘엘씨 증류 프로브 및 유체를 샘플링하고 조절하기 위한 방법
JP7258274B2 (ja) * 2018-12-25 2023-04-17 株式会社レゾナック フィルタ装置、化学気相成長装置およびＳｉＣエピタキシャルウェハの製造方法
KR102209205B1 (ko) * 2019-08-21 2021-02-01 주식회사 미래보 반도체 공정용 유로방향 전환식 반응부산물 포집장치
US11282491B2 (en) * 2019-12-17 2022-03-22 Emerson Process Management Regulator Technologies, Inc. Plates and plate assemblies for noise attenuators and other devices and methods making the same
US11562726B2 (en) 2019-12-17 2023-01-24 Emerson Process Management Regulator Technologies, Inc. Plates and plate assemblies for noise attenuators and other devices and methods making the same
TWI889744B (zh) * 2020-01-29 2025-07-11 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 污染物捕集系統、及擋板堆疊
JP2021186785A (ja) * 2020-06-03 2021-12-13 東京エレクトロン株式会社 トラップ装置及び基板処理装置
US11992835B2 (en) 2020-08-04 2024-05-28 Universal Analyzers Inc. Distillation probes and methods for sampling and conditioning a fluid
KR102442234B1 (ko) * 2021-02-09 2022-09-13 주식회사 저스템 기류 균일화 장치를 구비한 efem
TW202303865A (zh) 2021-05-28 2023-01-16 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 污染物捕集系統、及擋板堆疊
CN113818012B (zh) * 2021-11-25 2022-04-01 新美光(苏州)半导体科技有限公司 一种化学气相沉积装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4488887A (en) * 1983-10-17 1984-12-18 R. J. Reynolds Tobacco Company Cold trap
JP2007208042A (ja) * 2006-02-02 2007-08-16 Tokyo Electron Ltd 減圧処理装置

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1186067A (en) * 1915-09-28 1916-06-06 William A Rawlings Muffler.
US1632325A (en) * 1924-05-26 1927-06-14 Int Precipitation Co Gas scrubber
GB268163A (en) * 1926-05-03 1927-03-31 Vilbiss Co Improvements in apparatus for cleansing air and gases
US1857348A (en) * 1928-05-14 1932-05-10 Bokenkroger William Filter for gaseous substances
US3224171A (en) * 1963-08-16 1965-12-21 Hyman D Bowman Exhaust filter for internal combustion engines
US3572391A (en) * 1969-07-10 1971-03-23 Hirsch Abraham A Flow uniformizing baffling for closed process vessels
US3606738A (en) * 1969-12-02 1971-09-21 Ben Kraus Jr Fluid separator
US4065918A (en) * 1973-02-12 1978-01-03 Ethyl Corporation Exhaust systems
US4506513A (en) * 1983-06-17 1985-03-26 Max John K Cold trap
DK166260C (da) * 1990-06-08 1993-08-30 Haldor Topsoe As Fremgangsmaade til fjernelse af sure, gasformige bestanddele i roeg- og spildgas ved behandling med ammoniak
JPH05160029A (ja) * 1991-12-02 1993-06-25 Hitachi Ltd 成膜装置およびその排気トラップ
US5422081A (en) * 1992-11-25 1995-06-06 Tokyo Electron Kabushiki Kaisha Trap device for vapor phase reaction apparatus
JPH07193008A (ja) * 1993-12-27 1995-07-28 Toshiba Corp 半導体化学気相成長システム
JP3540064B2 (ja) * 1995-09-04 2004-07-07 株式会社アルバック ドライ真空ポンプ前段用のトラップ
JPH1054356A (ja) * 1996-08-14 1998-02-24 Ebara Corp 析出物除去用トラップ
US6156107A (en) * 1996-11-13 2000-12-05 Tokyo Electron Limited Trap apparatus
JP3991375B2 (ja) * 1996-11-13 2007-10-17 東京エレクトロン株式会社 トラップ装置
JPH11300153A (ja) * 1998-04-24 1999-11-02 Dainippon Screen Mfg Co Ltd 昇華成分除去ユニットおよびそれを備えた熱処理装置
JP2000045073A (ja) * 1998-07-29 2000-02-15 Kokusai Electric Co Ltd 排気トラップ及び処理装置
JP2000256856A (ja) * 1999-03-11 2000-09-19 Tokyo Electron Ltd 処理装置及び処理装置用真空排気システム及び減圧ｃｖｄ装置及び減圧ｃｖｄ装置用真空排気システム及びトラップ装置
US6206971B1 (en) * 1999-03-29 2001-03-27 Applied Materials, Inc. Integrated temperature controlled exhaust and cold trap assembly
US6173735B1 (en) * 1999-04-29 2001-01-16 Perry Equipment Corporation Method and apparatus for regulating gas flow
JP4642379B2 (ja) * 2004-05-12 2011-03-02 東京エレクトロン株式会社 排気捕集装置
JP5036354B2 (ja) * 2006-04-04 2012-09-26 東京エレクトロン株式会社 成膜装置の排気系構造、成膜装置、および排ガスの処理方法
JP5128168B2 (ja) * 2006-04-24 2013-01-23 三菱電線工業株式会社 排気装置
US7866345B2 (en) * 2007-09-28 2011-01-11 Circor Instrumentation Technologies, Inc. Non-clogging flow restriction for pressure based flow control devices
JP5696348B2 (ja) * 2008-08-09 2015-04-08 東京エレクトロン株式会社 金属回収方法、金属回収装置、排気系及びこれを用いた成膜装置
CN201470229U (zh) * 2009-09-01 2010-05-19 中国石油集团西部钻探工程有限公司吐哈钻井工艺研究院 环保抑尘器
CN201589723U (zh) * 2009-12-15 2010-09-22 东莞市环境保护监测站 粒子采样用分级冲撞器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4488887A (en) * 1983-10-17 1984-12-18 R. J. Reynolds Tobacco Company Cold trap
JP2007208042A (ja) * 2006-02-02 2007-08-16 Tokyo Electron Ltd 減圧処理装置

Also Published As

Publication number Publication date
US20130061969A1 (en) 2013-03-14
KR101538830B1 (ko) 2015-07-22
JP2013062362A (ja) 2013-04-04
KR20130029011A (ko) 2013-03-21
CN102989238A (zh) 2013-03-27
TW201329282A (zh) 2013-07-16
CN102989238B (zh) 2015-06-03
JP5728341B2 (ja) 2015-06-03

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