TWI548512B - Metal materials for electronic components - Google Patents

Metal materials for electronic components Download PDF

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Publication number
TWI548512B
TWI548512B TW102102406A TW102102406A TWI548512B TW I548512 B TWI548512 B TW I548512B TW 102102406 A TW102102406 A TW 102102406A TW 102102406 A TW102102406 A TW 102102406A TW I548512 B TWI548512 B TW I548512B
Authority
TW
Taiwan
Prior art keywords
layer
metal material
patent application
electronic parts
substrate
Prior art date
Application number
TW102102406A
Other languages
English (en)
Chinese (zh)
Other versions
TW201341171A (zh
Inventor
Yoshitaka Shibuya
Kazuhiko Fukamachi
Atsushi Kodama
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201341171A publication Critical patent/TW201341171A/zh
Application granted granted Critical
Publication of TWI548512B publication Critical patent/TWI548512B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/017—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of aluminium or an aluminium alloy, another layer being formed of an alloy based on a non ferrous metal other than aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/002—Alloys based on nickel or cobalt with copper as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/005—Alloys based on nickel or cobalt with Manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/007—Alloys based on nickel or cobalt with a light metal (alkali metal Li, Na, K, Rb, Cs; earth alkali metal Be, Mg, Ca, Sr, Ba, Al Ga, Ge, Ti) or B, Si, Zr, Hf, Sc, Y, lanthanides, actinides, as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • C22C19/05—Alloys based on nickel or cobalt based on nickel with chromium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/04—Alloys based on a platinum group metal
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C22C5/08—Alloys based on silver with copper as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Contacts (AREA)
TW102102406A 2012-04-13 2013-01-23 Metal materials for electronic components TWI548512B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012092240A JP5968668B2 (ja) 2012-04-13 2012-04-13 電子部品用金属材料

Publications (2)

Publication Number Publication Date
TW201341171A TW201341171A (zh) 2013-10-16
TWI548512B true TWI548512B (zh) 2016-09-11

Family

ID=49327413

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102102406A TWI548512B (zh) 2012-04-13 2013-01-23 Metal materials for electronic components

Country Status (5)

Country Link
JP (1) JP5968668B2 (ja)
KR (1) KR101688290B1 (ja)
CN (1) CN104204296B (ja)
TW (1) TWI548512B (ja)
WO (1) WO2013153832A1 (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5700183B1 (ja) * 2013-10-22 2015-04-15 Ｊｆｅスチール株式会社 固体高分子形燃料電池のセパレータ用ステンレス箔
JP6503159B2 (ja) * 2014-04-22 2019-04-17 Ｊｘ金属株式会社 電子部品用金属材料、それを用いたコネクタ端子、コネクタ及び電子部品
JP6553333B2 (ja) * 2014-06-05 2019-07-31 Ｊｘ金属株式会社 電子部品用金属材料、それを用いたコネクタ端子、コネクタ及び電子部品
JP6268070B2 (ja) * 2014-09-16 2018-01-24 矢崎総業株式会社 メッキ材及び端子金具
JP6268055B2 (ja) * 2014-07-15 2018-01-24 矢崎総業株式会社 端子及びコネクタ
JP6272744B2 (ja) * 2014-10-24 2018-01-31 矢崎総業株式会社 板状導電体及び板状導電体の表面処理方法
WO2016010053A1 (ja) * 2014-07-14 2016-01-21 矢崎総業株式会社 電気素子
JP6374718B2 (ja) * 2014-07-14 2018-08-15 矢崎総業株式会社 電気素子
JP2016113666A (ja) * 2014-12-15 2016-06-23 矢崎総業株式会社 電気素子及びコネクタ
EP3235588B1 (en) * 2014-12-15 2019-11-06 Senju Metal Industry Co., Ltd Solder alloy for plating and electronic component
JP2016115542A (ja) * 2014-12-15 2016-06-23 矢崎総業株式会社 電気素子及びコネクタ
JP6655325B2 (ja) * 2015-08-25 2020-02-26 株式会社エンプラス 電気接触子及び電気部品用ソケット
JP6624999B2 (ja) * 2016-03-31 2019-12-25 日鉄日新製鋼株式会社 自動車用端子
KR101797660B1 (ko) * 2016-04-25 2017-11-15 (주)인광 내흑변성이 우수한 인듐합금 전해도금층을 갖는 전기, 전자기기 부품 및 그 제조방법
CN106364055A (zh) * 2016-11-24 2017-02-01 苏州华意铭铄激光科技有限公司 一种摩擦系数低的复合金属制品
TWI714284B (zh) * 2018-09-27 2020-12-21 日商Ｔｏｔｏ股份有限公司 水龍頭金屬零件
US11939653B2 (en) * 2018-11-30 2024-03-26 Tanaka Kikinzoku Kogyo K.K. Electrically-conductive material having excellent wear resistance and heat resistance
CN110438365B (zh) * 2019-09-06 2020-07-24 内蒙古自治区国际蒙医医院(内蒙古自治区蒙医药研究所) 蒙医针灸针及其制备方法
KR102092574B1 (ko) * 2019-11-21 2020-03-26 주식회사 지오스토리 전자해도의 실시간 갱신이 가능한 전자해도 현시용 모바일 디바이스의 운용시스템

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JP2002352540A (ja) * 2001-05-22 2002-12-06 Mitsui Chemicals Inc フレキシブル金属積層体
JP2011037255A (ja) * 2009-07-15 2011-02-24 Kiyoshi Chiba 積層体

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JPS61124597A (ja) 1984-11-20 1986-06-12 Furukawa Electric Co Ltd:The 銀被覆電気材料
JP2726434B2 (ja) 1988-06-06 1998-03-11 古河電気工業株式会社 ＳｎまたはＳｎ合金被覆材料
JP2670348B2 (ja) 1989-05-15 1997-10-29 古河電気工業株式会社 ＳｎまたはＳｎ合金被覆材料
JP2925986B2 (ja) * 1995-09-08 1999-07-28 古河電気工業株式会社 接点部と端子部とからなる固定接点用材料又は電気接点部品
JPH11350188A (ja) * 1998-06-03 1999-12-21 Furukawa Electric Co Ltd:The 電気・電子部品用材料とその製造方法、およびその材料を用いた電気・電子部品
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JP3513709B2 (ja) 2001-10-16 2004-03-31 石原薬品株式会社 前処理によるスズホイスカーの防止方法
JP4111522B2 (ja) * 2004-11-30 2008-07-02 日鉱金属株式会社 Ｓｎ被覆銅系材料及び端子
JP5396139B2 (ja) * 2009-05-08 2014-01-22 株式会社神戸製鋼所 プレスフィット端子
JP4632380B2 (ja) * 2009-06-04 2011-02-16 協和電線株式会社 めっき被膜接続端子部材、これを用いた接続端子、これに用いられるめっき被膜材及び多層めっき材料、並びにめっき被膜接続端子部材の製造方法
JP2011006762A (ja) * 2009-06-29 2011-01-13 Shinko Electric Ind Co Ltd 端子接続部の表面被膜構造及びその形成方法
JP5612355B2 (ja) * 2009-07-15 2014-10-22 株式会社Ｋａｎｚａｃｃ メッキ構造及び電気材料の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002352540A (ja) * 2001-05-22 2002-12-06 Mitsui Chemicals Inc フレキシブル金属積層体
JP2011037255A (ja) * 2009-07-15 2011-02-24 Kiyoshi Chiba 積層体

Also Published As

Publication number Publication date
KR101688290B1 (ko) 2016-12-20
TW201341171A (zh) 2013-10-16
WO2013153832A1 (ja) 2013-10-17
CN104204296B (zh) 2016-09-14
KR20150002803A (ko) 2015-01-07
CN104204296A (zh) 2014-12-10
JP2013221166A (ja) 2013-10-28
JP5968668B2 (ja) 2016-08-10

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