TWI548319B - 提供可撓性結構的方法及可撓性裝置 - Google Patents

提供可撓性結構的方法及可撓性裝置 Download PDF

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TWI548319B
TWI548319B TW102140426A TW102140426A TWI548319B TW I548319 B TWI548319 B TW I548319B TW 102140426 A TW102140426 A TW 102140426A TW 102140426 A TW102140426 A TW 102140426A TW I548319 B TWI548319 B TW I548319B
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Taiwan
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flexible substrate
adhesive layer
flexible
layer
hard layer
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TW102140426A
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TW201419973A (zh
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余振華
林士庭
林俊成
侯上勇
盧思維
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台灣積體電路製造股份有限公司
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Description

提供可撓性結構的方法及可撓性裝置
本發明係有關於半導體元件的封裝技術，特別有關於可撓性基板上的晶片接合結構及其形成方法。
可撓性基板(flexible substrate)(在此也稱為軟性基板(flex substrate))為針對可撓性動作提供的基板，可撓性基板提供的優點在應用上超過非可撓性基板，在可撓性基板上，元件可承受例如彎曲(bending)、扭轉(twisting)或類似的動作。半導體元件、積體電路或類似的元件可以電性耦接至軟性基板，軟性基板與耦接至此軟性基板的元件之間在材料特性上的差異會使得元件與軟性基板之間的電性連接品質降低，例如，軟性基板與電性耦接至此軟性基板的元件之間在熱膨脹係數上的差異會在元件與軟性基板之間的電性連接器上造成應變(strain)。
在一實施例中，提供可撓性結構的方法可包含提供軟性基板，其具有複數個電性連接器形成於軟性基板的第一側上；以及將黏著層和堅硬層附著於軟性基板的第二側，其中黏著層和堅硬層附著至軟性基板第二側的一區域，此區域背對軟性基板第一側上的前述之一個或多個電性連接器。
在另一實施例中，提供可撓性結構的另一方法可包含將元件附著至位於軟性基板第一側上的一個或超過一個以上的電性連接器；以及將黏著層和堅硬層附著在軟性基板的第二側上，其中黏著層附著至軟性基板第二側的一區域，此區域背對前述之一個或超過一個以上的電性連接器。
在一實施例中，提供可撓性裝置，此裝置可包含軟性基板，其具有第一側和第二側；一個或超過一個以上的電性連接器設置在軟性基板的第一側上；第一堅硬層設置在軟性基板的第二側上，其中第一堅硬層位於第二側的一區域內，此區域背對軟性基板第一側上的前述之一個或超過一個以上的電性連接器；以及第一黏著層設置於第一堅硬層與軟性基板的第二側之間。
110、210、310‧‧‧軟性基板
110a、210a、310a‧‧‧軟性基板的第一側
110b、210b、310b‧‧‧軟性基板的第二側
112、152‧‧‧焊料凸塊以及/或接合墊
120、250、314、331、341‧‧‧黏著層
130、260、315.1、315.2、332、342‧‧‧堅硬層
140、270、316、330、340‧‧‧控制翹曲的元件
150、220、312、322‧‧‧元件
160、240、313、323‧‧‧成型底部填充膠
170、230、311、321‧‧‧電性連接器
為了讓本揭示之目的、特徵、及優點能更明顯易懂，以下配合所附圖式作詳細說明如下：第1A-1D圖顯示依據一實施例，形成控制翹曲的元件之各中間階段的剖面示意圖；第2A-2D圖顯示依據另一實施例，形成控制翹曲的元件之各中間階段的剖面示意圖；以及第3A-3B圖顯示依據各種實施例，各種控制翹曲的元件之剖面示意圖。
以下詳述實施例的製造與使用，然而，可以理解 的是，本揭示提供許多可應用的發明概念，其可以在廣泛的各種特定背景中實施，在此所討論的特定實施例僅用於說明本揭示之製造與使用的特定方式，並非用於限定本揭示的範圍。
一般而言，在此所述之實施例提供控制翹曲的元件(warpage control device)，其限制了軟性基板的翹曲(warpage)或彎曲(bow)。控制翹曲的元件可在回焊製程之前或之後應用，在回焊製程中元件可電性耦接至軟性基板，控制翹曲的元件可提供對軟性基板的支撐，其有助於在各種製造、組裝以及/或測試製程的全部過程中維持元件與軟性基板之間電性連接的完整性，控制翹曲的元件對軟性基板提供的支撐也可有助於在各種操作環境、條件或應用中，維持元件與軟性基板之間電性連接的完整性。
第1A-1D圖說明依據一實施例，形成控制翹曲的元件140之中間階段的剖面示意圖，如第1A-1B圖所示，軟性基板110可包含第一側110a和第二側110b，在一實施例中，複數個焊料凸塊(solder bumps)以及/或接合墊(bonding pads)112可形成在軟性基板的第一側110a上，黏著層120和堅硬層(rigid layer)130一起可包括控制翹曲的元件140，並且可附著至軟性基板110的第二側110b。在一實施例中，控制翹曲的元件140可形成在第二側110b的一區域上，此區域背對形成在軟性基板110第一側110a上的這些焊料凸塊以及/或接合墊112。
在各種實施例中，軟性基板110可包括高分子膜，例如聚對苯二甲酸乙二酯(polyethylene terephthalate)、聚亞醯 胺類薄膜(kapton)、聚亞醯胺(polyimide)或類似的材料；軟性基板110還可包括可撓性塑膠基板(flexible plastic substrates)、透明導電聚酯膜(transparent conductive polyester films)或其他類似的材料。在各種實施例中，黏著層120可包括環氧樹脂(epoxy)、高分子、黏膠(glue)、黏著劑(adhesive agent)或類似的材料，黏著層120設置於堅硬層130與軟性基板110之間。在各種實施例中，堅硬層130可包括金屬、塑膠、高分子、半導體材料、石英、陶瓷或其他材料，堅硬層130可對軟性基板110提供堅硬或半堅硬(semi-rigid)的支撐，例如，可選擇相較於軟性基板110具有更高體積模數(bulk modulus)的材料作為堅硬層130，在一實施例中，堅硬層130可包括複數層(未繪出)的結構。
如第1A-1B圖所示，在一實施例中，可在電性耦接另一元件(如下所述)至軟性基板110之前，將控制翹曲的元件140附著至軟性基板110。在電性耦接其他元件(如下所述)至軟性基板110之前，將控制翹曲的元件140安置在軟性基板110上，其有助於在電性耦接其他元件(如下所述)的期間以及/或在後續的製造程序期間，讓軟性基板110的翹曲或彎曲最小化。
將控制翹曲的元件140附著在軟性基板110上的方法可以有很多種，在一實施例中，黏著層120可先形成在軟性基板110的第二側110b上，然後可將堅硬層施加至黏著層120。在各種實施例中，可使用各種製程，例如層壓(lamination)、噴灑(spraying)、浸泡(dipping)、刷塗(brushing) 或類似的方式，將黏著層120形成在軟性基板110的第二側110b上，在這些實施例中，例如可藉由壓製(pressed)、熔接(fused)、層壓(laminated)、貼附(affixed)或塗佈(applied)的方式將堅硬層130施加在黏著層120上，以形成控制翹曲的元件140。
在另一實施例中，黏著層120可先形成在堅硬層130上，然後組合在一起的黏著層120與堅硬層130可附著至軟性基板110的第二側110b，以形成控制翹曲的元件140。在各種實施例中，可使用各種製程，例如層壓(lamination)、噴灑(spraying)、浸泡(dipping)、刷塗(brushing)或類似的方式，將黏著層120先形成在堅硬層130上，在這些實施例中，可藉由壓製(pressed)、熔接(fused)、層壓(laminated)、貼附(affixed)或塗佈(applied)的方式，讓堅硬層130和黏著層120一起附著在軟性基板110的第二側110b上，以形成控制翹曲的元件140。
如第1C-1D圖所示，在控制翹曲的元件140附著至軟性基板110上之後，元件150可耦接至軟性基板110。如第1C圖所示，元件150可包含焊料凸塊或接合墊152形成於其上，元件150可對齊並放置在位於軟性基板110上相對應的焊料凸塊或接合墊112上。在各種實施例中，元件150可以是已封裝的半導體元件、中介層(interposer)、晶片、晶圓、另一個軟性基板、非可撓性基板或其他類似的元件。在各種實施例中，元件上的焊料凸塊或接合墊152可包括金屬，其包含但不限定於，共熔合金(eutectic alloy)，例如AlCu、AlGe；或者低熔點金屬層，例如In、Au、Sn、Cu、無鉛焊料、錫膏(solder paste) 或其他類似的材料。
如第1D圖所示，可經由複數個電性連接器170，進行回焊製程將元件150耦接至軟性基板110，在回焊製程期間，控制翹曲的元件140可有助於讓軟性基板110的翹曲或彎曲降到最低。如第1D圖所示，成型底部填充膠(molding underfill)160可在元件150與軟性基板的第一側110a之間形成，成型底部填充膠160可進一步在後續的製造程序期間讓軟性基板110的翹曲或彎曲降到最低。
在各種實施例中，位於軟性基板110的第一側110a上的焊料凸塊以及/或接合墊112可包括金屬，其包含但不限定於，共熔合金，例如AlCu、AlGe；或者低熔點金屬層，例如In、Au、Sn、Cu或其他類似的材料。
第2A-2D圖顯示依據另一實施例，形成控制翹曲的元件之各中間階段的剖面示意圖，如第2A-2B圖所示，軟性基板210可包含第一側210a和第二側210b，元件220可經由軟性基板210第一側210a上的複數個連接器230電性耦接至軟性基板210，第2B圖顯示成型底部填充膠240形成在第2A圖的元件220與軟性基板210的第一側210a之間後的狀態。
如第2C-2D圖所示，控制翹曲的元件270可附著在軟性基板210的第二側210b上，控制翹曲的元件270可包含黏著層250與堅硬層260。在一實施例中，控制翹曲的元件270可形成在第二側210b的一區域上，此區域可背對形成在軟性基板210第一側210a上的元件220。相較於第1A-1D圖中所示之實施例，其控制翹曲的元件140在元件150耦接至軟性 基板110之前就附著至軟性基板110，而第2A-2D圖中所示之實施例則是在元件220耦接至軟性基板210之後，才提供控制翹曲的元件270附著至軟性基板210。
將控制翹曲的元件270附著至軟性基板210上的方法可以改變，在一實施例中，黏著層250可先形成在軟性基板210的第二側210b上，然後堅硬層260再附著至黏著層250。在各種實施例中，可使用各種製程，例如層壓、噴灑、浸泡、刷塗或類似的方式，將黏著層形成在軟性基板210的第二側210b上，在這些實施例中，堅硬層260可經由壓製、熔接、層壓、貼附或塗佈等方式附著在黏著層250上，以形成控制翹曲的元件270。
在另一實施例中，黏著層250可先形成在堅硬層260上，然後結合在一起的黏著層250和堅硬層260再附著至軟性基板210的第二側210b，以形成控制翹曲的元件270。在各種實施例中，可使用各種製程，例如層壓、噴灑、浸泡、刷塗或類似的方式，將黏著層形成在堅硬層260上，在這些實施例中，堅硬層260和黏著層250可一起經由壓製、層壓、熔接、貼附或塗佈等方式附著在軟性基板210的第二側210b上，以形成控制翹曲的元件270。
如第2A-2D圖所示，元件220可在控制翹曲的元件270形成於軟性基板210上之前就耦接至軟性基板210。在軟性基板上形成控制翹曲的元件之順序可取決於製造程序，以及/或可耦接至軟性基板相反側上的元件種類，在第1A-1D圖及第2A-2D圖中所示之實施例的提供係說明在軟性基板上形 成控制翹曲的元件之順序可以改變，其係由包含軟性基板的設計以及/或製造程序而決定。
本揭示還提供其他控制翹曲的元件之型態，第3A-3B圖顯示依據各種實施例，各種控制翹曲的元件之剖面示意圖。如第3A圖所示，軟性基板310可包含第一側310a和第二側310b，複數個電性連接器311可形成在介於元件312與軟性基板310之間的第一側310a上，並且成型底部填充膠313可形成在元件312與軟性基板310的第一側310a之間，控制翹曲的元件316可附著至第二側310b的一區域，此區域背對形成在軟性基板310第一側310a上的元件312。控制翹曲的元件316可包含黏著層314以及複數層結構，例如在此所示之第一層315.1和第二層315.2。在各種實施例中，這些複數層可以是堅硬層、半堅硬層、散熱器(heat-sinks)或類似的元件，這些層可使用與在此所討論的黏著方法類似的方法黏著在一起。
第3B圖顯示依據一實施例，在軟性基板320上的複數個控制翹曲的元件之剖面示意圖，如第3B圖所示，軟性基板320可包含第一側320a和第二側320b，複數個電性連接器321可形成在元件322與軟性基板320之間，並且位於軟性基板320的第一側320a上，成型底部填充膠323可形成在元件322與軟性基板320的第一側320a之間。
第一控制翹曲的元件330可包含第一黏著層331和第一堅硬層332，其可附著於軟性基板320的第二側320b，第一控制翹曲的元件330可形成在第二側320b的一區域內，此區域可背對形成在軟性基板320第一側320a上的元件322。
如第3B圖所示，軟性基板320可以用一種方式折彎成雙背面(double-back)在其本身上，在一實施例中，第二控制翹曲的元件340可包含第二黏著層341和第二堅硬層342，第二控制翹曲的元件340也可以附著於軟性基板320的第二側320b，第二控制翹曲的元件340可形成在第二側320b的一區域內，當軟性基板320向後折彎在其本身上，如第3B圖所示，此區域大抵上可對齊第一控制翹曲的元件330。
第二控制翹曲的元件340可提供額外的支撐，在從頭至尾的應用期間，其有助於維持元件322與軟性基板320之間的電性連接器321之完整性，在應用時可能會有一種或多種力量施加在此，其可能會一起擠壓軟性基板320，這些應用可包含，例如觸控螢幕的應用、觸控板(touch pad)的應用、按鍵(press-key)的應用或其他應用，在一實施例中，第二控制翹曲的元件位於相似的區域中，但是第二控制翹曲的元件可能位於軟性基板的第一側320a上。
雖然本發明已揭露較佳實施例如上，然其並非用以限定本發明，在此技術領域中具有通常知識者當可瞭解，在不脫離本發明之精神和範圍內，當可做些許更動與潤飾。例如，在此技術領域中具有通常知識者當可瞭解，在不脫離本發明之精神和範圍內，上述的結構及步驟順序可以改變。因此，本發明之保護範圍當視後附之申請專利範圍所界定為準。
110‧‧‧軟性基板
110a‧‧‧軟性基板的第一側
140‧‧‧控制翹曲的元件
150‧‧‧元件
160‧‧‧成型底部填充膠
170‧‧‧電性連接器

Claims (9)

  1. 一種提供可撓性結構的方法，包括：提供一軟性基板，具有複數個電性連接器形成於該軟性基板的一第一側上；將一黏著層和一堅硬層附著於該軟性基板的一第二側，其中該黏著層和該堅硬層附著至該軟性基板的該第二側的一區域，該區域背對於該軟性基板的該第一側上的該些電性連接器的一個或多個電性連接器；將一元件附著至該軟性基板的該第一側上的該些電性連接器；以及形成一成型底部填充膠，介於該元件與該軟性基板之間。
  2. 如申請專利範圍第1項所述之提供可撓性結構的方法，其中該堅硬層為金屬、高分子或前述之組合。
  3. 如申請專利範圍第1項所述之提供可撓性結構的方法，其中將該元件附著至該軟性基板的該第一側上的該些電性連接器的該步驟是在將該黏著層和該堅硬層附著於該軟性基板的該第二側的該步驟之前或之後進行。
  4. 如申請專利範圍第3項所述之提供可撓性結構的方法，其中該元件為一封裝的半導體元件、一晶片或一中介層。
  5. 如申請專利範圍第1項所述之提供可撓性結構的方法，其中將該黏著層和該堅硬層附著於該軟性基板的該第二側的該步驟包括：將該黏著層附著於該軟性基板的該第二側；以及於該黏著層附著之後，將該堅硬層附著於該黏著層。
  6. 如申請專利範圍第1項所述之提供可撓性結構的方法，其中將該黏著層和該堅硬層附著於該軟性基板的該第二側的該步驟包括：在該堅硬層上形成該黏著層；以及於該堅硬層上形成該黏著層之後，將該黏著層和該堅硬層附著至該軟性基板的該第二側。
  7. 一種可撓性裝置，包括：一軟性基板，具有一第一側和一第二側；一個或超過一個以上的電性連接器，設置在該軟性基板的該第一側上；一第一堅硬層，設置在該軟性基板的該第二側上，其中該第一堅硬層位於該第二側的一區域內，該區域背對於該軟性基板的該第一側上的該一個或超過一個以上的電性連接器；一第一黏著層，設置於該第一堅硬層與該軟性基板的該第二側之間；一元件，電性耦接至該軟性基板的該第一側上的該一個或超過一個以上的電性連接器；以及一成型底部填充膠，介於該元件與該軟性基板的該第一側之間。
  8. 如申請專利範圍第7項所述之可撓性裝置，其中該第一堅硬層包括複數層。
  9. 如申請專利範圍第7項所述之可撓性裝置，更包括：一第二黏著層，設置於該軟性基板的該第二側上，其中該 第二黏著層位於該軟性基板的該第二側的一區域內，該區域面對該第一堅硬層；以及一第二堅硬層，設置於該第二黏著層上。
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