TWI547986B - A substrate processing apparatus, a substrate processing method, and a memory medium - Google Patents

A substrate processing apparatus, a substrate processing method, and a memory medium Download PDF

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Publication number
TWI547986B
TWI547986B TW102141258A TW102141258A TWI547986B TW I547986 B TWI547986 B TW I547986B TW 102141258 A TW102141258 A TW 102141258A TW 102141258 A TW102141258 A TW 102141258A TW I547986 B TWI547986 B TW I547986B
Authority
TW
Taiwan
Prior art keywords
substrate
cup
casing
liquid
gas
Prior art date
Application number
TW102141258A
Other languages
English (en)
Chinese (zh)
Other versions
TW201440133A (zh
Inventor
Takahisa Otsuka
Nobuhiro Ogata
Hiroshi Marumoto
Terufumi Wakiyama
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=50726750&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI547986(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201440133A publication Critical patent/TW201440133A/zh
Application granted granted Critical
Publication of TWI547986B publication Critical patent/TWI547986B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW102141258A 2012-11-20 2013-11-13 A substrate processing apparatus, a substrate processing method, and a memory medium TWI547986B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012254424A JP6026241B2 (ja) 2012-11-20 2012-11-20 基板処理装置、基板処理方法及び記憶媒体

Publications (2)

Publication Number Publication Date
TW201440133A TW201440133A (zh) 2014-10-16
TWI547986B true TWI547986B (zh) 2016-09-01

Family

ID=50726750

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102141258A TWI547986B (zh) 2012-11-20 2013-11-13 A substrate processing apparatus, a substrate processing method, and a memory medium

Country Status (4)

Country Link
US (1) US20140137893A1 (enExample)
JP (1) JP6026241B2 (enExample)
KR (1) KR101949722B1 (enExample)
TW (1) TWI547986B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI746998B (zh) * 2018-06-29 2021-11-21 日商斯庫林集團股份有限公司 基板處理方法及基板處理裝置

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9698029B2 (en) * 2014-02-19 2017-07-04 Lam Research Ag Method and apparatus for processing wafer-shaped articles
KR102232664B1 (ko) * 2014-05-28 2021-03-30 세메스 주식회사 기판 처리 장치 및 기판 처리 시스템
JP6306459B2 (ja) * 2014-07-15 2018-04-04 東京エレクトロン株式会社 基板処理装置および基板処理方法
US10203604B2 (en) 2015-11-30 2019-02-12 Applied Materials, Inc. Method and apparatus for post exposure processing of photoresist wafers
KR102387542B1 (ko) * 2017-05-11 2022-04-19 주식회사 케이씨텍 에어공급부 및 기판 처리 장치
JP6887912B2 (ja) * 2017-08-07 2021-06-16 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP6990602B2 (ja) * 2018-02-27 2022-01-12 東京エレクトロン株式会社 基板処理装置、基板処理方法及びコンピュータ読み取り可能な記録媒体
KR102201879B1 (ko) * 2018-09-07 2021-01-12 세메스 주식회사 기판 처리 장치 및 방법
JP7307575B2 (ja) 2019-03-28 2023-07-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7314634B2 (ja) * 2019-06-11 2023-07-26 東京エレクトロン株式会社 塗布装置及び塗布方法
KR102351341B1 (ko) * 2019-12-09 2022-01-18 무진전자 주식회사 팬 필터 유닛 및 이를 포함하는 기판 처리 장치
JP7356896B2 (ja) 2019-12-24 2023-10-05 東京エレクトロン株式会社 液処理装置、液処理方法及びコンピュータ読み取り可能な記録媒体
US20210265177A1 (en) * 2020-02-26 2021-08-26 SCREEN Holdings Co., Ltd. Substrate treating apparatus
KR102835069B1 (ko) * 2020-04-16 2025-07-17 주식회사 제우스 기판 처리장치 및 기판 처리방법
KR102388473B1 (ko) * 2020-08-11 2022-04-20 (주)마스 클린 건조 공기 셔터 팬 필터 유닛
TWI770753B (zh) * 2021-01-04 2022-07-11 南亞科技股份有限公司 清洗裝置及清洗方法
KR20220131680A (ko) * 2021-03-22 2022-09-29 세메스 주식회사 기판 처리 장치
JP7719651B2 (ja) * 2021-07-15 2025-08-06 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置、基板洗浄システム、基板処理システム、基板洗浄方法および基板処理方法
KR102571523B1 (ko) * 2021-09-10 2023-08-29 (주)디바이스이엔지 배기구조를 포함하는 기판 처리장치
KR102646155B1 (ko) * 2022-10-05 2024-03-12 엘에스이 주식회사 기판 세정 장치
KR102844261B1 (ko) * 2024-01-04 2025-08-11 엘에스이 주식회사 기판 세정 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5792259A (en) * 1995-11-27 1998-08-11 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and air supply method in substrate processing apparatus
US6752543B2 (en) * 2002-05-23 2004-06-22 Dainippon Screen Mfg. Co. Ltd. Substrate processing apparatus
US20060024446A1 (en) * 2004-07-06 2006-02-02 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and substrate processing method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09148231A (ja) * 1995-11-16 1997-06-06 Dainippon Screen Mfg Co Ltd 回転式基板処理装置
JP4762098B2 (ja) 2006-09-28 2011-08-31 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP5143498B2 (ja) 2006-10-06 2013-02-13 東京エレクトロン株式会社 基板処理方法、基板処理装置、プログラムならびに記録媒体
JP5173502B2 (ja) * 2008-03-14 2013-04-03 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4516141B2 (ja) 2008-06-02 2010-08-04 東京エレクトロン株式会社 基板処理方法，記録媒体及び基板処理装置
JP2010080717A (ja) 2008-09-26 2010-04-08 Tokyo Electron Ltd プラズマ処理装置用の載置台
JP5472169B2 (ja) 2011-03-16 2014-04-16 東京エレクトロン株式会社 液処理装置、液処理方法および記憶媒体
JP2012204719A (ja) * 2011-03-28 2012-10-22 Dainippon Screen Mfg Co Ltd 基板処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5792259A (en) * 1995-11-27 1998-08-11 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and air supply method in substrate processing apparatus
US6752543B2 (en) * 2002-05-23 2004-06-22 Dainippon Screen Mfg. Co. Ltd. Substrate processing apparatus
US20060024446A1 (en) * 2004-07-06 2006-02-02 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and substrate processing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI746998B (zh) * 2018-06-29 2021-11-21 日商斯庫林集團股份有限公司 基板處理方法及基板處理裝置

Also Published As

Publication number Publication date
KR101949722B1 (ko) 2019-02-19
JP2014103263A (ja) 2014-06-05
JP6026241B2 (ja) 2016-11-16
TW201440133A (zh) 2014-10-16
KR20140064666A (ko) 2014-05-28
US20140137893A1 (en) 2014-05-22

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