TWI547759B - A photosensitive resin composition, a hardened film thereof, and a printed wiring board - Google Patents
A photosensitive resin composition, a hardened film thereof, and a printed wiring board Download PDFInfo
- Publication number
- TWI547759B TWI547759B TW103119199A TW103119199A TWI547759B TW I547759 B TWI547759 B TW I547759B TW 103119199 A TW103119199 A TW 103119199A TW 103119199 A TW103119199 A TW 103119199A TW I547759 B TWI547759 B TW I547759B
- Authority
- TW
- Taiwan
- Prior art keywords
- compound
- photosensitive
- resin
- group
- manufactured
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims description 58
- 229920005989 resin Polymers 0.000 claims description 109
- 239000011347 resin Substances 0.000 claims description 109
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 79
- 229910000679 solder Inorganic materials 0.000 claims description 24
- 229910052782 aluminium Inorganic materials 0.000 claims description 23
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 20
- 239000011256 inorganic filler Substances 0.000 claims description 18
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 17
- 239000000460 chlorine Substances 0.000 claims description 9
- 239000000178 monomer Substances 0.000 claims description 9
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 8
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 7
- 229910052801 chlorine Inorganic materials 0.000 claims description 7
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 4
- 238000007334 copolymerization reaction Methods 0.000 claims description 3
- -1 (meth)acrylic acid Chemical class 0.000 description 119
- 239000000049 pigment Substances 0.000 description 93
- 239000003822 epoxy resin Substances 0.000 description 70
- 229920000647 polyepoxide Polymers 0.000 description 70
- 150000001875 compounds Chemical class 0.000 description 60
- 239000000126 substance Substances 0.000 description 30
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 24
- 238000000576 coating method Methods 0.000 description 24
- 238000007747 plating Methods 0.000 description 24
- 239000003999 initiator Substances 0.000 description 23
- 239000000758 substrate Substances 0.000 description 22
- 229920001187 thermosetting polymer Polymers 0.000 description 22
- 239000004593 Epoxy Substances 0.000 description 21
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 21
- 239000011248 coating agent Substances 0.000 description 21
- 239000000203 mixture Substances 0.000 description 20
- 239000000047 product Substances 0.000 description 20
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 19
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 19
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 19
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 18
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 17
- 239000002981 blocking agent Substances 0.000 description 17
- 239000012948 isocyanate Substances 0.000 description 15
- 230000001588 bifunctional effect Effects 0.000 description 14
- 238000011161 development Methods 0.000 description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 14
- 229910052737 gold Inorganic materials 0.000 description 14
- 239000010931 gold Substances 0.000 description 14
- 239000005056 polyisocyanate Substances 0.000 description 14
- 229920001228 polyisocyanate Polymers 0.000 description 14
- 239000003054 catalyst Substances 0.000 description 13
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 12
- 229920003319 Araldite® Polymers 0.000 description 12
- 125000000217 alkyl group Chemical group 0.000 description 12
- 239000003963 antioxidant agent Substances 0.000 description 12
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 12
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 11
- 230000003078 antioxidant effect Effects 0.000 description 11
- 125000004432 carbon atom Chemical group C* 0.000 description 11
- 230000002087 whitening effect Effects 0.000 description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 10
- 239000003086 colorant Substances 0.000 description 10
- 229920005862 polyol Polymers 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- 229930185605 Bisphenol Natural products 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 9
- 239000002253 acid Substances 0.000 description 9
- 239000003513 alkali Substances 0.000 description 9
- 239000007795 chemical reaction product Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 239000000945 filler Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 8
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 8
- 150000008065 acid anhydrides Chemical class 0.000 description 8
- 125000005442 diisocyanate group Chemical group 0.000 description 8
- 125000003700 epoxy group Chemical group 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 150000003077 polyols Chemical class 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 7
- 125000003545 alkoxy group Chemical group 0.000 description 7
- 229910052799 carbon Inorganic materials 0.000 description 7
- 239000012986 chain transfer agent Substances 0.000 description 7
- 230000005484 gravity Effects 0.000 description 7
- 229910052736 halogen Inorganic materials 0.000 description 7
- 150000002367 halogens Chemical class 0.000 description 7
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 7
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 239000003960 organic solvent Substances 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 239000003381 stabilizer Substances 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 6
- 125000002723 alicyclic group Chemical group 0.000 description 6
- 150000001412 amines Chemical class 0.000 description 6
- 125000003277 amino group Chemical group 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 6
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 229910052747 lanthanoid Inorganic materials 0.000 description 6
- 150000002602 lanthanoids Chemical class 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000003208 petroleum Substances 0.000 description 6
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 5
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 5
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 5
- 239000004721 Polyphenylene oxide Substances 0.000 description 5
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 5
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 5
- DNJIEGIFACGWOD-UHFFFAOYSA-N ethyl mercaptane Natural products CCS DNJIEGIFACGWOD-UHFFFAOYSA-N 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229910052500 inorganic mineral Inorganic materials 0.000 description 5
- 150000002513 isocyanates Chemical class 0.000 description 5
- NYGZLYXAPMMJTE-UHFFFAOYSA-M metanil yellow Chemical group [Na+].[O-]S(=O)(=O)C1=CC=CC(N=NC=2C=CC(NC=3C=CC=CC=3)=CC=2)=C1 NYGZLYXAPMMJTE-UHFFFAOYSA-M 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 229960003742 phenol Drugs 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 230000002829 reductive effect Effects 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 5
- CWERGRDVMFNCDR-UHFFFAOYSA-M thioglycolate(1-) Chemical compound [O-]C(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-M 0.000 description 5
- HEQOJEGTZCTHCF-UHFFFAOYSA-N 2-amino-1-phenylethanone Chemical compound NCC(=O)C1=CC=CC=C1 HEQOJEGTZCTHCF-UHFFFAOYSA-N 0.000 description 4
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 4
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Natural products CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 4
- 239000005995 Aluminium silicate Substances 0.000 description 4
- 241000208340 Araliaceae Species 0.000 description 4
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 4
- 235000003140 Panax quinquefolius Nutrition 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 4
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- 230000001476 alcoholic effect Effects 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 125000003282 alkyl amino group Chemical group 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 4
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 4
- 235000012211 aluminium silicate Nutrition 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- 229910001570 bauxite Inorganic materials 0.000 description 4
- 239000012965 benzophenone Substances 0.000 description 4
- WQAQPCDUOCURKW-UHFFFAOYSA-N butanethiol Chemical compound CCCCS WQAQPCDUOCURKW-UHFFFAOYSA-N 0.000 description 4
- 125000004122 cyclic group Chemical group 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
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- 150000002148 esters Chemical class 0.000 description 4
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- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
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- 239000002245 particle Substances 0.000 description 4
- 229920000570 polyether Polymers 0.000 description 4
- 229920005749 polyurethane resin Polymers 0.000 description 4
- XTQHKBHJIVJGKJ-UHFFFAOYSA-N sulfur monoxide Chemical group S=O XTQHKBHJIVJGKJ-UHFFFAOYSA-N 0.000 description 4
- 238000012719 thermal polymerization Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 3
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
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- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 3
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- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
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- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 3
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- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 3
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- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- AZIQALWHRUQPHV-UHFFFAOYSA-N prop-2-eneperoxoic acid Chemical compound OOC(=O)C=C AZIQALWHRUQPHV-UHFFFAOYSA-N 0.000 description 1
- QCTJRYGLPAFRMS-UHFFFAOYSA-N prop-2-enoic acid;1,3,5-triazine-2,4,6-triamine Chemical compound OC(=O)C=C.NC1=NC(N)=NC(N)=N1 QCTJRYGLPAFRMS-UHFFFAOYSA-N 0.000 description 1
- WJKYOQDIQYJXSD-UHFFFAOYSA-N propan-1-imine Chemical compound CCC=N WJKYOQDIQYJXSD-UHFFFAOYSA-N 0.000 description 1
- 125000005767 propoxymethyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])[#8]C([H])([H])* 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- FOWDZVNRQHPXDO-UHFFFAOYSA-N propyl hydrogen carbonate Chemical compound CCCOC(O)=O FOWDZVNRQHPXDO-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- TVRGPOFMYCMNRB-UHFFFAOYSA-N quinizarine green ss Chemical compound C1=CC(C)=CC=C1NC(C=1C(=O)C2=CC=CC=C2C(=O)C=11)=CC=C1NC1=CC=C(C)C=C1 TVRGPOFMYCMNRB-UHFFFAOYSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000001062 red colorant Substances 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 150000003304 ruthenium compounds Chemical class 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- LJFWQNJLLOFIJK-UHFFFAOYSA-N solvent violet 13 Chemical compound C1=CC(C)=CC=C1NC1=CC=C(O)C2=C1C(=O)C1=CC=CC=C1C2=O LJFWQNJLLOFIJK-UHFFFAOYSA-N 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 229910021653 sulphate ion Inorganic materials 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- MUQNAPSBHXFMHT-UHFFFAOYSA-N tert-butylhydrazine Chemical compound CC(C)(C)NN MUQNAPSBHXFMHT-UHFFFAOYSA-N 0.000 description 1
- WMXCDAVJEZZYLT-UHFFFAOYSA-N tert-butylthiol Chemical compound CC(C)(C)S WMXCDAVJEZZYLT-UHFFFAOYSA-N 0.000 description 1
- 150000003536 tetrazoles Chemical class 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 1
- 125000000101 thioether group Chemical group 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 229940035024 thioglycerol Drugs 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- NJRXVEJTAYWCQJ-UHFFFAOYSA-N thiomalic acid Chemical compound OC(=O)CC(S)C(O)=O NJRXVEJTAYWCQJ-UHFFFAOYSA-N 0.000 description 1
- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical compound [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- DHCDFWKWKRSZHF-UHFFFAOYSA-L thiosulfate(2-) Chemical compound [O-]S([S-])(=O)=O DHCDFWKWKRSZHF-UHFFFAOYSA-L 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- IEKWPPTXWFKANS-UHFFFAOYSA-K trichlorocobalt Chemical compound Cl[Co](Cl)Cl IEKWPPTXWFKANS-UHFFFAOYSA-K 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 235000019143 vitamin K2 Nutrition 0.000 description 1
- 239000011728 vitamin K2 Substances 0.000 description 1
- 229940041603 vitamin k 3 Drugs 0.000 description 1
- JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone powder Natural products C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 description 1
- 239000001060 yellow colorant Substances 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
- DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/0325—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polysaccharides, e.g. cellulose
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/035—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyurethanes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Epoxy Resins (AREA)
Description
本發明係關於一種感光性樹脂組成物、其硬化皮膜及具備該硬化皮膜之印刷配線板,更詳言之,硬化皮膜之無電解鍍金耐性良好,且焊料整平(預焊步驟)或無電解鍍金步驟時所發生之白化現象受到抑制之感光性樹脂組成物、其硬化皮膜及具備該硬化皮膜之印刷配線板。
近年來,民生用印刷配線板或產業用印刷配線板之抗焊劑中,由高精度、高密度之觀點,係使用紫外線照射後、藉由顯像而形成圖像、以熱及光照射之至少一者而完工硬化(正式硬化)之液狀顯像型抗焊劑。又,伴隨電子機器之輕薄短小化而需對應印刷配線板之高密度化,故要求抗焊劑之作業性之提升或高性能化。
液狀顯像型抗焊劑之中,因考慮到環境問題,作為顯像液亦以使用鹼水溶液之鹼顯像型之光抗焊劑逐漸成為主流。作為此般鹼顯像型之光抗焊劑,一般係使用由環氧樹脂之變性所衍生之環氧丙烯酸酯變性樹脂。
例如,專利文獻1中揭示由對酚醛型環氧化合物與不
飽和一元酸之反應生成物加成酸酐而成之感光性樹脂、光聚合起始劑、稀釋劑及環氧化合物所構成之抗焊劑組成物。專利文獻2中揭示由對使柳醛與一價酚之反應生成物再與環氧氯丙烷反應而得之環氧樹脂加成(甲基)丙烯酸,更再與多元性羧酸或其酐反應而得之感光性樹脂、光聚合起始劑、有機溶劑等所構成之抗焊劑組成物。
另一方面,最近由減少對環境之負荷之觀點,而朝向印刷配線板之無鹵素化邁進。例如,JPCA(日本電子電路工業協會)規格(JPCA-ES01)中,在貼銅層合板之項目中,將氯(Cl)含有率:0.09wt%(900ppm)以下、溴(Br)含有率:0.09wt%(900ppm)以下、氯(Cl)及溴(Br)含有率總量:0.15wt%(1500ppm)以下者規定作為無鹵素貼銅層合板。因此,對於印刷配線板中之主要構成材之一之抗焊劑,亦要求減少鹵素之含有量。
抗焊劑所含之感光性羧酸樹脂中,由環氧樹脂所衍生者由於包含源自環氧氯丙烷之氯離子,故由無鹵素化之觀點而不佳。因此,探討著非源自環氧樹脂之非感光性羧酸樹脂或採用非源自環氧樹脂之感光性羧酸樹脂之樹脂組成物。
[專利文獻1]日本特開昭61-243869號公報(申請專利範圍)
[專利文獻2]日本特開平3-250012號公報(申請專利範圍)
[專利文獻3]日本特開2010-237575號公報(申請專利範圍)
然而,使用上述般之非感光性羧酸樹脂之樹脂組成物,將具備曝光後之硬化皮膜之基板提供至焊料整平(預焊步驟)或無電解鍍金步驟時,則有硬化皮膜表面呈現白濁(以下,白化)之問題。
又,為了確報稀鹼所成之良好顯像性,使用較高酸價之羧酸樹脂之樹脂組成物在施行無電解鍍金時,則有鍍液滲入於抗焊劑之硬化物,硬化物之膨漲、剝離等產生之憂慮的問題。
因此,本發明之目的在於提供硬化皮膜之無電解鍍金耐性良好,且焊料整平(預焊步驟)或無電解鍍金步驟時所發生之白化現象受到抑制之感光性樹脂組成物、其硬化皮膜及具備該硬化皮膜之印刷配線板。
本發明者等為了解決上述課題經過精心研討之結果,發現藉由作成包含非感光性羧酸樹脂、含鋁無機填充料、環氧樹脂之感光性樹脂組成物,即可解決上述課題,進而
完成了本發明。
即,本發明之感光性樹脂組成物,其特徵為包含(A)非感光性羧酸樹脂、(B)含鋁無機填充料、(C)環氧樹脂者。
本發明之感光性樹脂組成物係以更包含感光性單體為佳。
又,本發明之感光性樹脂組成物中,前述(C)環氧樹脂係以2官能性環氧樹脂為佳。
又,本發明之感光性樹脂組成物係以更含有感光性羧酸樹脂為佳。又,本發明之感光性樹脂組成物中,感光性羧酸樹脂之含有量係以相對於全羧酸樹脂100質量份而言,以90質量份以下之範圍為佳。
又,本發明之感光性樹脂組成物,其氯含有率係以900ppm以下為佳。
又,本發明之感光性樹脂組成物係以使用作為抗焊劑者為佳。
本發明之硬化皮膜,其特徵為係使上述任一感光性樹脂組成物硬化而成者。
本發明之印刷配線板,其特徵為具備上述硬化皮膜者。
依據本發明即可提供一種硬化皮膜之無電解鍍金耐性良好,且焊料整平(預焊步驟)或無電解鍍金步驟時所發生
之白化現象受到抑制之感光性樹脂組成物、其硬化皮膜及具備該硬化皮膜之印刷配線板。
又,本發明之感光性樹脂組成物係適宜作為印刷配線板之永久皮膜,其中亦以適合作為抗焊劑用材料、層間絕緣材料。
本發明之感光性樹脂組成物,其特徵為包含(A)非感光性羧酸樹脂、(B)含鋁無機填充料、(C)環氧樹脂者。(A)非感光性羧酸樹脂如後述般,因係非源自環氧樹脂者,故來自環氧氯丙烷之氯離子之含有較少。因此,藉由使用此,可減少感光性樹脂組成物全體之鹵素含有量。由無鹵素之觀點,本發明之感光性樹脂組成物之氯含有率係以在900ppm以下為佳。
藉由含有(B)含鋁無機填充料,而可抑制白化現象之發生。
以下,詳細說明各成分。
上述(A)非感光性羧酸樹脂係於分子內具有羧基,且不具有乙烯性不飽和鍵等之感光性基之樹脂。
作為此般非感光性羧酸樹脂之具體例,例如可舉出如以下例舉之化合物(寡聚物及聚合物之任一者皆可)。
藉由使(甲基)丙烯酸等之不飽和羧酸,與苯乙烯、α-
甲基苯乙烯、低級烷基(甲基)丙烯酸酯、異丁烯等之含不飽和基化合物之共聚合而得之非感光性羧酸樹脂。尚且,低級烷基係指碳原子數1~5之烷基。
本發明所使用之(A)非感光性羧酸樹脂之酸價係以120mgKOH/g以上為佳,140~180mgKOH/g為較佳。(A)非感光性羧酸樹脂之酸價若未滿120mgKOH/g時,則有變得難以鹼顯像之情況。
本發明所使用之(A)非感光性羧酸樹脂之重量平均分子量雖根據樹脂骨架而相異,一般係以10,000以上30,000以下為佳。重量平均分子量若未滿10,000時,則有指觸乾燥性(無黏性能)拙劣,曝光後之塗膜耐濕性變差,顯像時產生膜減少,解像度亦大幅變差之情況。另一方面,若重量平均分子量超過30,000時,有顯像性顯著變差之情況。又,有儲藏安定性變差之情形。更佳為10,000以上25,000以下。
(A)非感光性羧酸樹脂之配合量在本發明之全羧酸樹脂100質量份中,以10~100質量份為佳。少於10質量份時,則導致指觸乾燥性(無黏性能)變差。較佳為20~50質量份。
尚且,全羧酸樹脂係意指組合(A)非感光性羧酸樹脂與後述之感光性羧酸樹脂者。
本發明之感光性樹脂組成物中更含有(B)含鋁無機填
充料。
(B)若使用含鋁無機填充料,因使所使用之樹脂類之折射率相近,故認為難以產生鍍金白化或焊料整平白化者。又,因塗膜之硬化收縮亦受減低,故認為可係可提高鍍金耐性者。又,若使用如硫酸鋇(比重:4.5)之大比重之填充料時,於顯像時在銅上會有確認到填充料之殘渣,相對於此,(B)含鋁無機填充料之比重較小,而不易聚集於塗膜之下部,故在顯像時可在銅上確認到填充料之殘渣受到抑制。
並且,如上述般,因(B)含鋁無機填充料之比重較小,即使大量填充(B)含鋁無機填充料至組成物中,該組成物與填充有較大比重之填充料之組成物相比,可確定到塗佈面積之效率優良。尚且,感光性樹脂組成物中,一般抗焊劑油墨之比重在1.3以上1.5以下。若大於1.5則塗佈面積之效率變差,因不經濟而不佳。根據以上,故主要以調整(B)含鋁無機填充料之填充量而使油墨之比重在上述範圍內為佳。
上述(B)含鋁無機填充料為包含鋁之無機填充料,適宜為含鋁礦物。含鋁無機填充料可使用公知者。具體而言,例如可舉出高嶺土(kaolin)、諾易堡矽土、氫氧化鋁等。含鋁無機填充料之配合量係相對於全羧酸樹脂100質量份而言,以50~500質量份為佳,100~400質量份為較佳。
高嶺土係為具有層狀構造之含水矽酸鋁。以化學式
(OH)8Si4Al4O10或Al2O3‧2SiO2‧2H2O所表示之組成者為佳。通常,天然產出之高嶺土有高嶺石(kaolinite)、狄克石、珍珠石之3種形態,可使用任一者。粒徑並無特別限定,可使用任意者。又,可使用以矽烷耦合劑等經表面處理者。
高嶺土例如可舉出(股)Imerys Minerals Japan製之Speswhite、Stocklite、Devolite、Polwhite、白石鈣公司(THIELE公司)之(商品名)Kaofine90、Kaobrite90、Kaogloss90、Kaofine、Kaobrite、Kaogloss、竹原化學工業(股)製之Union Clay RC-1、J.M.Huber公司製之Huber35、Huber35B、Huber80、Huber80B、Huber90、Huber90B、HuberHG90、Huber TEK2001、Polygloss90、Lithosperse 7005CS等。
諾易堡矽土粒子係為稱之sillitin、sillikolloid之天然之結合物,其係具有球狀之二氧化矽與板狀之高嶺石互相鬆散結合之構造者。
諾易堡矽土粒子例如可舉出sillitin V85、sillitin V88、sillitin N82、sillitin N85、sillitin N87、sillitin Z86、sillitin Z89、sillikolloid P87、sillitin N85 puris、sillitin Z86 puris、sillitin Z89 puris、sillikolloid P87 puris、(皆為商品名;Hoffmann-mineral公司製)等。此等可單獨使用1種,亦可將2種以上組使用。
施以表面處理之諾易堡矽土粒子,可舉出如Aktisil VM56、Aktisil MAM、Aktisil MAM-R、Aktisil EM、
Aktisil AM、Aktisil MM、Aktisil PF777(皆為商品名;(Hoffmann-mineral公司製)等。此等可單獨使用或亦可將2種以上組合使用。
氫氧化鋁可使用任意之市售品。氫氧化鋁可舉出如Higilite系列(H-21、H-31、H-32、H-42、H-42M、H-43、H-43M)(昭和電工公司製)等。
並且,因應必要亦可配合含鋁無機填充料以外之填充料。作為此般填充料,可使用公知之無機或有機填充料,例如可使用硫酸鋇、球狀二氧化矽或滑石。又,為了取得白色之外觀或難燃性,亦可將氧化鈦或金屬氧化物、金屬氫氧化物使用作為體質顏料填充料。
上述環氧樹脂係具有環氧基之樹脂,可使用公知之任意者。可舉出於分子中具有2個環氧基之2官能性環氧樹脂,於分子中具有多數環氧基之多官能環氧樹脂等,由可賦予提高鍍金耐性之觀點,以2官能性環氧樹脂為佳,其中亦以室溫(25℃)下為液狀之2官能性環氧樹脂為佳。
上述多官能環氧化合物,例如可舉出三菱化學公司製之jER828、jER834、jER1001、jER1004、DIC公司製之Epiclon 840、Epiclon 850、Epiclon 1050、Epiclon 2055、東都化成公司製之EpototeYD-011、YD-013、YD-127、YD-128、陶氏化學公司製之D.E.R.317、D.E.R.331、D.E.R.661、D.E.R.664、BASF JAPAN公司之Araldite
6071、Araldite 6084、Araldite GY250、Araldite GY260、住友化學工業公司製之Sumiepoxy ESA-011、ESA-014、ELA-115、ELA-128、旭化成工業公司製之A.E.R.330、A.E.R.331、A.E.R.661、A.E.R.664等(皆為商品名)之雙酚A型環氧樹脂;三菱化學公司製之jERYL903、DIC公司製之Epiclon 152、Epiclon 165、東都化成公司製之EpototeYDB-400、YDB-500、陶氏化學公司製之D.E.R.542、BASF JAPAN公司製之Araldite 8011、住友化學工業公司製之Sumiepoxy ESB-400、ESB-700、旭化成工業公司製之A.E.R.711、A.E.R.714等(皆為商品名)之溴化環氧樹脂;三菱化學公司製之jER152、jER154、陶氏化學公司製之D.E.N.431、D.E.N.438、DIC公司製之Epiclon N-730、Epiclon N-770、Epiclon N-865、東都化成公司製之EpototeYDCN-701、YDCN-704、BASF JAPAN公司製之Araldite ECN1235、Araldite ECN1273、Araldite ECN1299、Araldite XPY307、日本化藥公司製之EPPN-201、EOCN-1025、EOCN-1020、EOCN-104S、RE-306、NC-3000、住友化學工業公司製之Sumiepoxy ESCN-195X、ESCN-220、旭化成工業公司製之A.E.R.ECN-235、ECN-299、新日鐵化學公司製之YDCN-700-2、YDCN-700-3、YDCN-700-5,YDCN-700-7、YDCN-700-10、YDCN-704、YDCN-704A、DIC公司製之Epiclon N-680、N-690、N-695(皆為商品名)等之酚醛型環氧樹脂;DIC公司製之Epiclon 830、三菱化學公司製jER807、東
都化成公司製之EpototeYDF-170、YDF-175、YDF-2004、BASF JAPAN公司製之Araldite XPY306等(皆為商品名)之雙酚F型環氧樹脂;東都化成公司製之Epotote ST-2004、ST-2007、ST-3000(商品名)等之氫化雙酚A型環氧樹脂;三菱化學公司製之jER604、東都化成公司製之EpototeYH-434、BASF JAPAN公司製之Araldite MY720、住友化學工業公司製之Sumiepoxy ELM-120等(皆為商品名)之環氧丙基胺型環氧樹脂;BASF JAPAN公司製之Araldite CY-350(商品名)等之乙內醯脲型環氧樹脂;戴爾化學工業公司製之Ceroxide 2021、BASF JAPAN公司製之Araldite CY175、CY179等(皆為商品名)之脂環式環氧樹脂;三菱化學公司製之YL-933、陶氏化學公司製之T.E.N.、EPPN-501、EPPN-502等(皆為商品名)之三羥基苯基甲烷型環氧樹脂;三菱化學公司製之YL-6056、YX-4000、YL-6121(皆為商品名)等之聯茬酚型或聯酚型環氧樹脂或此等之混合物;日本化藥公司製EBPS-200、ADEKA公司製EPX-30、DIC公司製之EXA-1514(商品名)等之雙酚S型環氧樹脂;三菱化學公司製之jER157S(商品名)等之雙酚A酚醛型環氧樹脂;三菱化學公司製之jERYL-931、BASF JAPAN公司製之Araldite 163等(皆為商品名)之四苯酚基乙烷型環氧樹脂;BASF JAPAN公司製之Araldite PT810、日產化學工業公司製之TEPIC等(皆為商品名)之雜環式環氧樹脂;日本油脂公司製Blemmer DGT等之二環氧丙基酞酸酯樹脂;東都化成公司
製ZX-1063等之四環氧丙基茬酚基乙烷樹脂;新日鐵化學公司製ESN-190、ESN-360、DIC公司製HP-4032、EXA-4750、EXA-4700等之萘基含有環氧樹脂;DIC公司製HP-7200、HP-7200H等之具有二環戊二烯骨架之環氧樹脂;日本油脂公司製CP-50S、CP-50M等之環氧丙基甲基丙烯酸酯共聚合系環氧樹脂;以及環己基馬來醯亞胺與環氧丙基甲基丙烯酸酯之共聚合環氧樹脂;CTBN變性環氧樹脂(例如東都化成公司製之YR-102、YR-450等)等,但並不限定於此等。此等之中,特別係以甲酚酚醛型環氧樹脂等之酚醛型環氧樹脂、雜環式環氧樹脂、聯若酚型環氧樹脂或此等之混合物為佳。
上述2官能性環氧樹脂係於分子內具有2個環氧基之化合物,且較佳在室溫(25℃)下為液狀者。2官能性環氧樹脂例如可舉出雙酚A型環氧樹脂、氫化雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、聯茬酚型環氧樹脂、聯酚型環氧樹脂等。又,亦可為氫化2官能環氧化合物。
上述之雙酚型等之2官能性環氧樹脂例如係可藉由使雙酚類或聯酚類以環氧氯丙烷等進行環氧化而得。雙酚類可舉出如雙酚A、雙酚F、雙(4-羥基苯基)薄荷烷、雙(4-羥基苯基)二環戊烷、4,4’-二羥基二苯甲酮、雙(4-羥基苯基)醚、雙(4-羥基-3-甲基苯基)醚、雙(3,5-二甲基-4-羥基苯基)醚、雙(4-羥基苯基)硫化物、雙(4-羥基-3-甲基苯基)硫化物、雙(3,5-二甲基-4-羥基苯基)硫化物、雙(4-羥基苯
基)碸、雙(4-羥基-3-甲基苯基)碸、雙(3,5-二甲基-4-羥基苯基)碸、1,1-雙(4-羥基苯基)環己烷、1,1-雙(4-羥基-3-甲基苯基)環己烷、1,1-雙(3,5-二甲基-4-羥基苯基)環己烷、1,1’-雙(3-t-丁基-6-甲基-4-羥基苯基)丁烷等。
氫化2官能環氧化合物,例如可舉出三菱化學公司製之Epikote 828、Epikote 834、Epikote 1001、Epikote 1004、DIC公司製之Epiclon 840、Epiclon 850、Epiclon 1050、Epiclon 2055、東都化成公司製之EpototeYD-011、YD-013、YD-127、YD-128、陶氏化學公司製之D.E.R.317、D.E.R.331、D.E.R.661、D.E.R.664、BASF JAPAN公司之Araldite 6071、Araldite 6084、Araldite GY250、Araldite GY260、住友化學工業公司製之Sumiepoxy ESA-011、ESA-014、ELA-115、ELA-128、旭化成工業公司製之A.E.R.330、A.E.R.331、A.E.R.661、A.E.R.664等(皆為商品名)之雙酚A型環氧樹脂;DIC公司製之Epiclon 830、三菱化學公司製之Epikote 807、東都化成公司製之EpototeYDF-170、YDF-175、YDF-2004、BASF JAPAN公司製之Araldite XPY306等(皆為商品名)之雙酚F型環氧樹脂;三菱化學公司製之YL-6056、YX-4000、YL-6121(皆為商品名)等之聯茬酚型或聯酚型環氧樹脂或此等之混合物;日本化藥公司製之EBPS-200、ADEKA公司製之EPX-30、DIC公司製之EXA-1514(商品名)等之雙酚S型環氧樹脂;及其各別之氫化物。其中亦以氫化雙酚A型環氧化合物為佳,具體地可舉
出如三菱化學公司製之商品名「Epikote YL-6663」、東都化成公司製之商品名「EpototeST-2004」「EpototeST-2007」「Epotote ST-3000」等。又,環氧化合物之氫化率係以0.1%~100%為佳,可使用部分氫化之環氧化合物或下述式(1)所示般之完全氫化之化合物。
作為其他液狀2官能性環氧樹脂,可舉出如二環氧化乙烯基環己烯、(3’,4’-環氧基環己基甲基)-3,4-環氧基環己烷羧酸酯、(3’,4’-環氧基-6’-甲基環乙基甲基)-3,4-環氧基-6-甲基環己烷羧酸酯等之脂環族環氧樹脂。
上述2官能性環氧樹脂係以環氧當量為150~500者為佳,以170~300者為較佳。
上述環氧樹脂之配合量係相對於全羧酸樹脂100質量份而言,以10~60質量份為佳。較佳為20~50質量份。
上述環氧樹脂可單獨使用1種,亦可將2種以上併用。
並且,除環氧樹脂以外,因應必要亦可添加熱硬化性成分。本發明所使用之熱硬化性成分,可舉出如封端異氰酸酯化合物、胺基樹脂、馬來醯亞胺化合物、苯并噁嗪樹脂、碳二醯亞胺樹脂、環碳酸酯化合物、多官能環氧化合物、多官能氧環丁烷(oxetane)化合物、環氧硫化物樹脂等之公知慣用之熱硬化性樹脂等。此等之中較佳之熱硬化性成分係為於1分子中具有複數環狀醚基及/或環狀硫醚基
(以下,略稱為環狀(硫)醚基)之熱硬化性成分。此等具有環狀(硫)醚基之熱硬化性成分,市售之種類諸多,根據構造而可賦予多種之特性。
此般於分子中具有複數之環狀(硫)醚基之熱硬化性成分係為於分子中具有3、4或5員環之環狀醚基或環狀硫醚基之任一方者,或具有2個以上2種類之基之化合物,例如,可舉出於分子中具有多於2官能之環氧基之化合物、於分子中具有複數之氧環丁烷基(oxetanyl)之化合物,即多官能氧環丁烷化合物、於分子中具有複數之硫醚基之化合物,即環氧硫化物樹脂等。
本發明之感光性樹脂組成物中係以含有於分子中具有1個以上乙烯性不飽和基之化合物(感光性單體)為佳。尤其,實質上不含有上述感光性羧酸樹脂,或,含有量較少時,為了可賦予樹脂組成物充分之感光性,以大量含有感光性單體為佳。
作為上述感光性單體所使用之化合物,例如可舉出慣用公知之聚酯(甲基)丙烯酸酯、聚醚(甲基)丙烯酸酯、胺基甲酸酯(甲基)丙烯酸酯、碳酸酯(甲基)丙烯酸酯、環氧基(甲基)丙烯酸酯等。具體地可舉出如2-羥基乙基丙烯酸酯、2-羥基丙基丙烯酸酯等之羥基烷基丙烯酸酯類;乙二醇、甲氧基四乙二醇、聚乙二醇、丙二醇等之二醇之二丙烯酸酯類;N,N-二甲基丙烯醯胺、N-羥甲基丙烯醯胺、
N,N-二甲基胺基丙基丙烯醯胺等之丙烯醯胺類;N,N-二甲基胺基乙基丙烯酸酯、N,N-二甲基胺基丙基丙烯酸酯等之胺基烷基丙烯酸酯類;己二醇、三羥甲基丙烷、季戊四醇、二季戊四醇、參-羥基乙基異三聚氰酸酯等之多元醇或此等之環氧乙烷加成物、環氧丙烷加成物、或ε-己內酯加成物等之多價丙烯酸酯類;苯氧基丙烯酸酯、雙酚A二丙烯酸酯、及此等酚類之環氧乙烷加成物或環氧丙烷加成物等之多價丙烯酸酯類;丙三醇二環氧丙基醚、丙三醇三環氧丙基醚、三羥甲基丙烷三環氧丙基醚、三環氧丙基異三聚氰酸酯等之環氧丙基醚之多價丙烯酸酯類;但並受限於上述者,尚可舉出聚醚聚醇、聚碳酸酯二醇、羥基末端聚丁二烯、聚酯聚醇等之使聚醇直接丙烯酸酯化,或,經由二異氰酸酯而胺基甲酸酯丙烯酸酯化之丙烯酸酯類及三聚氰胺丙烯酸酯,及/或對應上述丙烯酸酯之各甲基丙烯酸酯類等。
並且,亦可使用使甲酚酚醛型環氧樹脂等之多官能環氧樹脂與丙烯酸反應而成之環氧丙烯酸酯樹脂,或再使其環氧丙烯酸酯樹脂之羥基,與季戊四醇三丙烯酸酯等之羥基丙烯酸酯與異佛酮二異氰酸酯等之二異氰酸酯之半胺基甲酸酯化合物反應而成之環氧基胺基甲酸酯丙烯酸酯化合物等作為感光性單體。此般環氧丙烯酸酯系樹脂可不使指觸乾燥性降低而提高光硬化性。
作為上述感光性單體使用之於分子中具有複數乙烯性不飽和基之化合物之配合量,較佳係相對於全羧酸樹脂
100質量份為5~100質量份,更加為5~70質量份之比例。前述配合量若未滿5質量份時,光硬化性降低,而有難以藉由活性能量線照射後之鹼顯像形成圖型形成之情況。另一方面,超過100質量份時,有指觸乾燥性(無黏性能)拙劣,解像度亦降低之情況。
本發明之感光性樹脂組成物係以含有感光性羧酸樹脂為佳。
感光性羧酸樹脂係除羧基之外,尚於分子內具有乙烯性不飽和鍵者。乙烯性不雙鍵係以源自丙烯酸或甲基丙烯酸或此等之衍生物者為佳。
又,以不使用環氧樹脂作為起始原料之感光性羧酸樹脂為佳。不使用環氧樹脂作為起始原料之含羧基樹脂因鹵素化物離子含有量非常少,故可抑制對環境之影響、硬化皮膜之絕緣信賴性之劣化。
作為可使用於本發明之感光性樹脂組成物之感光性羧酸樹脂之具體例,可舉出以下所例示之化合物(寡聚物及聚合物之任一者皆可)。尚且,由抑制對環境之影響、硬化皮膜之絕緣信頼性之劣化之觀點,以不使鹵素量增加地調整感光性樹脂組成物之添加量為佳。
(1)藉由使(甲基)丙烯酸等之不飽和羧酸,與苯乙烯、α-甲基苯乙烯、低級烷基(甲基)丙烯酸酯、異丁烯等之含不飽和基化合物,及後述般之感光性單體共聚合而得之感
光性羧酸樹脂。
(2)在脂肪族二異氰酸酯、分支脂肪族二異氰酸酯、脂環式二異氰酸酯、芳香族二異氰酸酯等之二異氰酸酯,與二羥甲基丙酸、二羥甲基丁酸等之含羧基之二醇化合物及聚碳酸酯系聚醇、聚醚系聚醇、聚酯系聚醇、聚烯烴系聚醇、丙烯酸系聚醇、雙酚A系環氧烷烴加成物二醇、具有酚性羥基及醇性羥基之化合物等之二醇化合物之複加成反應所成之含羧基之胺基甲酸酯樹脂之合成中,添加羥基烷基(甲基)丙烯酸酯等之於分子中具有1個羥基與1個以上(甲基)丙烯醯基之化合物,而末端(甲基)丙烯酸化之感光性羧酸樹脂(含感光性羧基之聚胺基甲酸酯樹脂)。
(3)在使脂肪族二異氰酸酯、分岐脂肪族二異氰酸酯、脂環式二異氰酸酯、芳香族二異氰酸酯等之二異氰酸酯化合物,與聚碳酸酯系聚醇、聚醚系聚醇、聚酯系聚醇、聚烯烴系聚醇、丙烯酸系聚醇、雙酚A系環氧烷烴加成物二醇、具有酚性羥基及醇性羥基之化合物等之二醇化合物之複加成反應所成之胺基甲酸酯樹脂之末端與酸酐反應而成之含末端羧基之胺基甲酸酯樹脂之合成中,添加羥基烷基(甲基)丙烯酸酯等之於分子中具有1個羥基與1個以上(甲基)丙烯醯基之化合物,而末端(甲基)丙烯酸化之感光性羧酸樹脂(含感光性羧基之聚胺基甲酸酯樹脂)。
(4)二異氰酸酯,與雙酚A型環氧樹脂、氫化雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、聯茬酚型環氧樹脂、聯酚型環氧樹脂等之2官能環氧樹脂之
(甲基)丙烯酸酯或其部分酸酐變性物、含羧基之二醇化合物及二醇化合物之複加成反應所成之感光性羧酸樹脂(含感光性羧基之聚胺基甲酸酯樹脂)。
(5)上述(4)之樹脂合成中,添加羥基烷基(甲基)丙烯酸酯等之於分子中具有1個羥基與1個以上(甲基)丙烯醯基之化合物,而末端(甲基)丙烯酸化之感光性羧酸樹脂(含感光性羧基之聚胺基甲酸酯樹脂)。
(6)上述(2)或(4)之樹脂合成中,添加異佛酮二異氰酸酯與季戊四醇三丙烯酸酯之等莫耳反應物等、於分子中具有1個異氰酸酯基與1個以上(甲基)丙烯醯基之化合物,而末端(甲基)丙烯酸化之感光性羧酸樹脂(含感光性羧基之聚胺基甲酸酯樹脂)。
(7)使後述般之多官能(固形)環氧樹脂與(甲基)丙烯酸反應,對存在於側鏈之羥基加成無水酞酸、四氫無水酞酸、六氫無水酞酸等之二元酸酸酐之感光性羧酸樹脂。
(8)使2官能(固形)環氧樹脂之羥基以環氧氯丙烷進行環氧化之多官能環氧樹脂再與(甲基)丙烯酸反應,且對生成之羥基加成二元酸酸酐之感光性含羧基樹脂。
(9)使後述般之2官能氧環丁烷樹脂使二羧酸反應,且對生成之1級羥基加成二元酸酸酐之感光性羧酸樹脂。
(10)使於1分子中具有複數酚性羥基之化合物與環氧乙烷、環氧丙烷等之環氧烷烴反應而得之反應生成物,再與含不飽和基之單羧酸反應而得之反應生成物,再與多元酸酐反應而得之感光性羧酸樹脂。
(11)使於1分子中具有複數酚性羥基之化合物與碳酸伸乙酯、碳酸伸丙酯等之環狀碳酸酯化合物反應而得之反應生成物再與含不飽和基之單羧酸反應,使取得之反應生成物與多元酸酐反應而得之感光性羧酸樹脂。
(12)使於1分子中具有複數環氧基之環氧化合物,與p-羥基苯乙基醇等之1分子中具有至少1個醇性羥基與1個酚性羥基之化合物與(甲基)丙烯酸等之含不飽和基之單羧酸反應,使取得之反應生成物之醇性羥基,與無水馬來酸、四氫無水酞酸、無水偏苯三甲酸、無水苯均四酸、己二酸等之多元酸酐反應而得之感光性羧酸樹脂。
(13)對上述(1)~(12)中任一之樹脂再加成環氧丙基(甲基)丙烯酸酯、α-甲基環氧丙基(甲基)丙烯酸酯等之於分子中具有1個環氧基與1個以上(甲基)丙烯醯基之化合物而成之感光性羧酸樹脂。
上述感光性羧酸樹脂之中,由具有異氰酸酯基之成分(亦包括二異氰酸酯)之異氰酸酯基未直接與苯環鍵結之二異氰酸酯所構成之含羧基之胺基甲酸酯樹脂,因黃變受到抑制,可有效隱蔽,且紫外線吸收少,故有作成鹼顯像性組成物時之解像性、低翹曲性優良之特徵。
尚且,在此之(甲基)丙烯酸酯係意指總稱丙烯酸酯、甲基丙烯酸酯及此等之混合物之用語,以下其他類似之表現亦為相同樣。
上述般之感光性羧酸樹脂因在背骨‧聚合物之側鏈具有多數之羧基,故可在鹼水溶液中顯像。
又,上述感光性羧酸樹脂之酸價係以在20~200mgKOH/g之範圍為佳,更佳為40~150mgKOH/g之範圍。感光性羧酸樹脂之酸價若未滿20mgKOH/g時,有無法取得塗膜密著性,難以鹼顯像之情況。另一方面,酸價若超過200mgKOH/g時,顯像液所造成之曝光部溶解進行,而使線寬變得比所需要以上還細,根據情況會導致曝光部與未曝光部之無法區別而在顯像液中溶解剝離,變得難以描繪正常抗蝕圖型。
上述感光性羧酸樹脂之重量平均分子量雖根據樹脂骨架而相異,一般係以2,000~150,000為佳。重量平均分子量若未滿2,000,則有無黏性能變差之情況,亦有曝光後之塗膜耐濕性變差,顯像時產生膜減少,解像度大幅變差之情形。另一方面,若重量平均分子量超過150,000時,則有顯像性顯著惡化之情形。又,亦有儲藏安定性拙劣之情況。更佳為5,000~100,000。
前述般之感光性羧酸樹脂之合量在羧酸樹脂100質量份中係以90質量份以下為佳。更佳為50~80質量份。
本發明之感光性樹脂組成物中係以包含光聚合起始劑為佳。光聚合起始劑可使用公知之任一者,其中亦以具有肟酯基之肟酯系光聚合起始劑、α-胺基苯乙酮系光聚合起始劑、醯基膦氧化物系光聚合起始劑為佳。光聚合起始劑可單獨使用1種,亦可將2種以上組合而使用。
肟酯系光聚合起始劑之市售品可舉出如BASF JAPAN公司製之CGI-325、Irgacure(註冊商標)OXE01、Irgacure OXE02、ADEKA公司製N-1919、Adeka Arkls(註冊商標)NCI-831等。
又,亦可適宜使用於分子內具有2個肟酯基之光聚合起始劑,具體地可舉出如下述一般式(2)所表示之具有咔唑構造之肟酯化合物。
特別係以上述式中X、Y各自為甲基或乙基,Z為甲基或苯基,n為0,Ar為伸苯基、伸萘基、噻吩或伸噻吩基之肟酯系光聚合起始劑為佳。
使用肟酯系光聚合起始劑時之配合量係相對於全羧酸樹脂100質量份而言,以設成0.01~5質量份為佳。若未滿0.01質量份時,則在銅上之光硬化性不足,不僅塗膜剝離,亦有耐藥品性等之塗膜特性降低之情形。另一方面,若超過5質量份時,抗焊劑塗膜表面上之光吸收變得劇激,而有深部硬化性降低之傾向。更佳為相對於全羧酸樹脂100質量份為0.5~3質量份。
α-胺基苯乙酮系光聚合起始劑,具體地可舉出如2-甲基-1-[4-(甲硫基)苯基]-2-嗎啉基丙酮-1、2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)-丁烷-1-酮、2-(二甲基胺基)-2-[(4-甲基苯基)甲基]-1-[4-(4-嗎咻基)苯基]-1-丁酮、N,N-二甲基胺基苯乙酮等。市售品可舉出如BASF JAPAN公司製之Irgacure 907、Irgacure 369、Irgacure 379等。
醯基膦氧化物系光聚合起始劑,具體地可舉出如2,4,6-三甲基苄醯基二苯基膦氧化物、雙(2,4,6-三甲基苄醯基)-苯基膦氧化物、雙(2,6-二甲氧基苄醯基)-2,4,4-三甲基-戊基膦氧化物等。市售品可舉出如BASF JAPAN公司製之Lucirin(註冊商標)TPO、Irgacure 819等。
使用α-胺基苯乙酮系光聚合起始劑或醯基膦氧化物系
光聚合起始劑時之各自之配合量,係相對於全羧酸樹脂100質量份而言,以0.01~15質量份為佳。若未滿0.01質量份時,同樣地不僅在銅上之光硬化性不足,且塗膜剝離,亦有耐藥品性等之塗膜特性降低之情形。另一方面,若超過15質量份時,無法取得充分之減低排出氣體之效果,並且抗焊劑塗膜表面上之光吸收變得激烈,而有深部硬化性降低之傾向。更佳為相對於全羧酸樹脂100質量份為0.5~10質量份。
除上述光聚合起始劑以外,本發明之感光性樹脂組成物中亦可適宜使用光開始助劑或增感劑。作為光開始助劑或增感劑,可舉出如安息香化合物、苯乙酮化合物、蒽醌化合物、噻吨酮(thioxanthone)化合物、縮酮化合物、二苯甲酮化合物、3級胺化合物、及氧葱酮(xanthone)化合物等。此等化合物亦有可使用作為光聚合起始劑之情況,但以與光聚合起始劑合併使用為佳。又,光開始助劑或增感劑可單獨使用1種類,亦可將2種以上予以併用。
安息香化合物例如可舉出安息香、安息香甲基醚、安息香乙基醚、安息香異丙基醚等。
苯乙酮化合物例如可舉出苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、2,2-二乙氧基-2-苯基苯乙酮、1,1-二氯苯乙酮等。
蒽醌化合物例如可舉出2-甲基蒽醌、2-乙基蒽醌、2-
t-丁基蒽醌、1-氯蒽醌等。
噻吨酮化合物例如可舉出2,4-二甲基噻吨酮、2,4-二乙基噻吨酮、2-氯噻吨酮、2,4-二異丙基噻吨酮等。
縮酮化合物例如可舉出苯乙酮二甲基縮酮、苄基二甲基縮酮等。
二苯甲酮化合物例如可舉出二苯甲酮、4-苄醯基二苯基硫化物、4-苄醯基-4’-甲基二苯基硫化物、4-苄醯基-4’-乙基二苯基硫化物、4-苄醯基-4’-丙基二苯基硫化物等。
3級胺化合物例如乙醇胺化合物、具有二烷基胺基苯構造之化合物,例如市售品中可舉出4,4’-二甲基胺基二苯甲酮(日本曹達(股)製Nissocure(註冊商標)MABP)、4,4’-二乙基胺基二苯甲酮(保土谷化學(股)製EAB)等之二烷基胺基二苯甲酮、7-(二乙基胺基)-4-甲基-2H-1-苯并哌喃-2-酮(7-(二乙基胺基)-4-甲基香豆素)等之二烷基胺基含有香豆素化合物、4-二甲基胺基安息香酸乙酯(日本化藥(股)製Kayacure(註冊商標)EPA)、2-二甲基胺基安息香酸乙酯(International Bio-synthetics公司製QuantacureDMB)、4-二甲基胺基安息香酸(n-丁氧基)乙酯(International Bio-synthetics公司製Quantacure BEA)、p-二甲基胺基安息香酸異戊基乙基酯(日本化藥(股)製KayacureDMBI)、4-二甲基胺基安息香酸2-乙基己酯(VanDyk公司製Esolol 507)等。3級胺化合物係以具有二烷基胺基苯構造之化合物為佳,其中亦以二烷基胺基二苯甲酮化合物、最大吸收波長在350~450nm之含二烷基胺
基之香豆素化合物及酮香豆素類為特佳。
作為二烷基胺基二苯甲酮化合物,因4,4’-二乙基胺基二苯甲酮之毒性為低,故為佳。含二烷基胺基之香豆素化合物,因最大吸收波長在350~410nm與紫外線領域中,故可取得自始即為著色少、無色透明之感光性組成物,使用著色顏料時可反映出著色顏料自身色彩之著色抗焊劑膜。尤其,以7-(二乙基胺基)-4-甲基-2H-1-苯并哌喃-2-酮,因其對波長400~410nm之雷射光顯示優良增感效果,故為佳。
此等之中,以噻吨酮化合物及3級胺化合物為佳。尤其,藉由含有噻吨酮化合物,可使深部硬化性提升。
使用光開始助劑或增感劑時之配合量,係相對於全羧酸樹脂100質量份而言,以0.1~20質量份為佳。光開始助劑或增感劑之配合量若未滿0.1質量份時,則有無法取得充分增感效果之傾向。另一方面,若超過20質量份時,則有3級胺化合物所致之塗膜表面上之光吸收變得劇激,深部硬化性降低之傾向。更佳為相對於全羧酸樹脂100質量份為0.1~10質量份。
光聚合起始劑、光開始助劑及增感劑之總量,係相對於全羧酸樹脂100質量份而言,以35質量份以下為佳。若超過35質量份時,則有因此等光吸收而深部硬化性下降之傾向。
尚且,此等光聚合起始劑、光開始助劑及增感劑,由於會吸收特定之波長,根據情況會有感度變低,作為紫外
線吸收劑運作之情形。但,此等並非係單僅以提升組成物之感度為目的而所使用者。因應必要可使其吸收特定波長之光,提高表面之光反應性,使抗蝕之線形狀及開口變化成垂直、梯形狀、倒梯形狀,且同時提高線寬或開口徑之加工精度。
本發明之感光性樹脂組成物中,為了提升感度,亦可使用作為鏈轉移劑之公知慣用之N苯基甘胺酸類、苯氧基乙酸類、硫苯氧基乙酸類、巰基噻唑等。作為鏈轉移劑,例如可舉出巰基琥珀酸、巰基乙酸、巰基丙酸、甲硫胺酸、半胱胺酸、硫柳酸及其衍生物等之具有羧基之鏈轉移劑;巰基乙醇、巰基丙醇、巰基丁醇、巰基丙二醇、巰基丁二醇、羥基苯硫醇及其衍生物等之具有羥基之鏈轉移劑;1-丁硫醇、丁基-3-巰基丙酸酯、甲基-3-巰基丙酸酯、2,2-(伸乙二氧基)二乙硫醇、乙硫醇、4-甲基苯硫醇、十二基硫醇、丙硫醇、丁硫醇、戊硫醇、1-辛硫醇、環戊硫醇、環己硫醇、硫甘油、4,4-硫代雙苯硫醇等。
又,鏈轉移劑亦可使用多官能性硫醇系化合物。多官能性硫醇系化合物例如可舉出己烷-1,6-二硫醇、癸烷-1,10-二硫醇、二巰基二乙基醚、二巰基二乙基硫化物等之脂肪族硫醇類、伸若基二硫醇、4,4'-二巰基二苯基硫化物、1,4-苯二硫醇等之芳香族硫醇類;乙二醇雙(巰基乙酸酯)、聚乙二醇雙(巰基乙酸酯)、丙二醇雙(巰基乙酸酯)、
丙三醇參(巰基乙酸酯)、三羥甲基乙烷參(巰基乙酸酯)、三羥甲基丙烷參(巰基乙酸酯)、季戊四醇肆(巰基乙酸酯)、二季戊四醇陸(巰基乙酸酯)等之多元醇之聚(巰基乙酸酯)類;乙二醇雙(3-巰基丙酸酯)、聚乙二醇雙(3-巰基丙酸酯)、丙二醇雙(3-巰基丙酸酯)、丙三醇參(3-巰基丙酸酯)、三羥甲基乙烷參(巰基丙酸酯)、三羥甲基丙烷參(3-巰基丙酸酯)、季戊四醇肆(3-巰基丙酸酯)、二季戊四醇陸(3-巰基丙酸酯)等之多元醇之聚(3-巰基丙酸酯)類;1,4-雙(3-巰基丁醯氧基)丁烷、1,3,5-參(3-巰基丁氧基乙基)-1,3,5-三嗪-2,4,6(1H,3H,5H)-三酮、季戊四醇肆(3-巰基丁酸酯)等之聚(巰基丁酸酯)類等。
此等之市售品,例如可舉出BMPA、MPM、EHMP、NOMP、MBMP、STMP、TMMP、PEMP、DPMP、及TEMPIC(以上、堺化學工業(股)製)、Karenz MT-PE1、Karenz MT-BD1、及Karenz-NR1(以上、昭和電工(股)製)等。
又,鏈轉移劑亦可使用具有巰基之雜環化合物。作為具有巰基之雜環化合物,例如可舉出巰基-4-丁內酯(別名:2-巰基-4-丁內酯)、2-巰基-4-甲基-4-丁內酯、2-巰基-4-乙基-4-丁內酯、2-巰基-4-丁硫內酯、2-巰基-4-丁內醯胺、N-甲氧基-2-巰基-4-丁內醯胺、N-乙氧基-2-巰基-4-丁內醯胺、N-甲基-2-巰基-4-丁內醯胺、N-乙基-2-巰基-4-丁內醯胺、N-(2-甲氧基)乙基-2-巰基-4-丁內醯胺、N-(2-乙氧基)乙基-2-巰基-4-丁內醯胺、2-巰基-5-戊內酯、2-巰基
-5-戊內醯胺、N-甲基-2-巰基-5-戊內醯胺、N-乙基-2-巰基-5-戊內醯胺、N-(2-甲氧基)乙基-2-巰基-5-戊內醯胺、N-(2-乙氧基)乙基-2-巰基-5-戊內醯胺、2-巰基苯并噻唑、2-巰基-5-甲硫基-噻二唑、2-巰基-6-己內醯胺、2,4,6-三巰基-s-三嗪(三協化成股份有限公司製:商品名Zisnet F)、2-二丁基胺基-4,6-二巰基-s-三嗪(三協化成股份有限公司製:商品名Zisnet DB)、及2-苯胺基-4,6-二巰基-s-三嗪(三協化成股份有限公司製:商品名Zisnet AF)等。
尤其,由不損及感光性樹脂組成物之顯像性,以巰基苯并噻唑、3-巰基-4-甲基-4H-1,2,4-三唑、5-甲基-1,3,4-噻二唑-2-硫醇、1-苯基-5-巰基-1H-四唑為佳。此等鏈轉移劑可單獨使用1種,亦可併用2種以上。
又,本發明之感光性樹脂組成物中,為了提高組成物之硬化性及所得之硬化膜之強韌性,可添加於1分子中具有複數異氰酸酯基或封端化異氰酸酯基之化合物。此般於1分子中具有複數異氰酸酯基或封端化異氰酸酯基之化合物,可舉出如於1分子中具有複數異氰酸酯基之化合物,即聚異氰酸酯化合物,或於1分子中具有複數封端化異氰酸酯基之化合物,即封端異氰酸酯化合物等。
前述聚異氰酸酯化合物係例如可使用芳香族聚異氰酸酯、脂肪族聚異氰酸酯或脂環式聚異氰酸酯。芳香族聚異氰酸酯之具體例,可舉出如4,4’-二苯基甲烷二異氰酸
酯、2,4-甲伸苯基二異氰酸酯、2,6-甲伸苯基二異氰酸酯、萘-1,5-二異氰酸酯、o-伸茬基二異氰酸酯、m-伸茬基二異氰酸酯及2,4-甲伸苯基二聚物。脂肪族聚異氰酸酯之具體例,可舉出如四亞甲基二異氰酸酯、六亞甲基二異氰酸酯、亞甲基二異氰酸酯、三甲基六亞甲基二異氰酸酯、4,4-亞甲基雙(環乙基異氰酸酯)及異佛酮二異氰酸酯。脂環式聚異氰酸酯之具體例,可舉出如聯環丁烷三異氰酸酯。以及可舉出先前所舉出之異氰酸酯化合物之加成物、縮二脲物及異三聚氰酸酯物。
封端異氰酸酯化合物所包含之封端化異氰酸酯基係異氰酸酯基與封端劑之反應而受到保護且一時惰性化之基。加熱至既定溫度時,此封端劑解離而生成異氰酸酯基。
封端異氰酸酯化合物可使用異氰酸酯化合物與異氰酸酯封端劑之加成反應生成物。作為可與封端劑反應之異氰酸酯化合物,可舉出如異三聚氰酸酯型、縮二脲型、加成物型等。作為此異氰酸酯化合物,例如可使用芳香族聚異氰酸酯、脂肪族聚異氰酸酯或脂環式聚異氰酸酯。芳香族聚異氰酸酯、脂肪族聚異氰酸酯、脂環式聚異氰酸酯之具體例,可舉出先前已例示之化合物。
作為異氰酸酯封端劑,例如可舉出酚、甲酚、茬酚、氯酚及乙基酚等之酚系封端劑;ε-己內醯胺、δ-戊內醯胺、γ-丁內醯胺及β-丙內醯胺等之內醯胺系封端劑;乙醯乙酸乙酯及乙醯基丙酮等之活性亞甲基系封端劑;甲醇、乙醇、丙醇、丁醇、戊醇、乙二醇單甲基醚、乙二醇單乙
基醚、乙二醇單丁基醚、二乙二醇單甲基醚、丙二醇單甲基醚、苄基醚、乙醇酸甲酯、乙醇酸丁酯、二丙酮醇、乳酸甲酯及乳酸乙酯等之醇系封端劑;甲醛肟、乙醛肟、丙酮肟、甲基乙基酮肟、二乙醯單肟、環己酮肟等之肟系封端劑;丁基硫醇、己基硫醇、t-丁基硫醇、硫酚、甲硫基酚、乙基硫酚等之硫醇系封端劑;乙醯胺、苄醯胺等之酸醯胺系封端劑;琥珀酸醯亞胺及馬來酸醯亞胺等之醯亞胺系封端劑;茬胺、苯胺、丁基胺、二丁基胺等之胺系封端劑;咪唑、2-乙基咪唑等之咪唑系封端劑;亞甲基亞胺及伸丙基亞胺等之亞胺系封端劑等。
封端異氰酸酯化合物亦可為市售品,例如可舉出Sumidule BL-3175、BL-4165、BL-1100、BL-1265、Desmodule TPLS-2957、TPLS-2062、TPLS-2078、TPLS-2117、Desmosome 2170、Desmosome 2265(以上、住友拜耳胺基甲酸酯公司製、商品名)、Coronate 2512、Coronate 2513、Coronate 2520(以上、日本聚胺基甲酸酯工業公司製、商品名)、B-830、B-815、B-846、B-870、B-874、B-882(以上、三井武田化工公司製、商品名)、TPA-B80E、17B-60PX、E402-B80T(以上、旭化成化工公司製、商品名)等。尚且,Sumidule BL-3175、BL-4265係作為封端劑使用甲基乙基肟而得者。
上述於1分子中具有複數異氰酸酯基或封端化異氰酸酯基之化合物係可單獨使用1種,亦可將2種以上組合使用。
此般於1分子中具有複數異氰酸酯基或封端化異氰酸酯基之化合物之配合量,係相對於全羧酸樹脂100質量份而言,為1~100質量份,較佳為2~70質量份。前述配合量若未滿1質量份時,有無法取得充分塗膜之強韌性之情形。另一方面,若超過100質量份時,有保存安定性降低之情形。
本發明之感光性樹脂組成物中,可添加用以促進羥基或羧基與異氰酸酯基之硬化反應之胺基甲酸酯化觸媒。胺基甲酸酯化觸媒係以使用選自由錫系觸媒、金屬氯化物、金屬乙醯基丙酮酸鹽、金屬硫酸鹽、胺化合物及胺鹽所成群之1種以上之胺基甲酸酯化觸媒為佳。
前述錫系觸媒例如可舉出辛酸亞錫、二丁基錫二月桂酸鹽等之有機錫化合物、無機錫化合物等。
前述金屬氯化物係由Cr、Mn、Co、Ni、Fe、Cu或Al所構成之金屬之氯化物,例如可舉出三氯化鈷、二氯化鎳、三氯化鐵等。
前述金屬乙醯基丙酮酸鹽係由Cr、Mn、Co、Ni、Fe、Cu或Al所構成之金屬之乙醯基丙酮酸鹽,例如可舉出鈷乙醯基丙酮酸鹽、鎳乙醯基丙酮酸鹽、鐵乙醯基丙酮酸鹽等。
前述金屬硫酸鹽係由Cr、Mn、Co、Ni、Fe、Cu或Al所構成之金屬之硫酸鹽,例如可舉出硫酸銅等。
前述胺化合物例如可舉出過往公知之三伸乙二胺、N,N,N’,N’-四甲基-1,6-己二胺、雙(2-二甲基胺基乙基)醚、N,N,N’,N”,N”-五甲基二伸乙三胺、N-甲基嗎啉、N-乙基嗎啉、N,N-二甲基乙醇胺、二嗎啉基二乙基醚、N-甲基咪唑、二甲基胺基吡啶、三嗪、N’-(2-羥基乙基)-N,N,N’-三甲基-雙(2-胺基乙基)醚、N,N-二甲基己醇胺、N,N-二甲基胺基乙氧基乙醇、N,N,N’-三甲基-N’-(2-羥基乙基)乙二胺、N-(2-羥基乙基)-N,N’,N”,N”-四甲基二伸乙三胺、N-(2-羥基丙基)-N,N’,N”,N”-四甲基二伸乙三胺、N,N,N’-三甲基-N’-(2-羥基乙基)丙烷二胺、N-甲基-N’-(2-羥基乙基)哌嗪、雙(N,N-二甲基胺基丙基)胺、雙(N,N-二甲基胺基丙基)異丙醇胺、2-胺基奎寧、3-胺基奎寧、4-胺基奎寧、2-奎寧醇、3-奎寧醇、4-奎寧醇、1-(2’-羥基丙基)咪唑、1-(2’-羥基丙基)-2-甲基咪唑、1-(2’-羥基乙基)咪唑、1-(2’-羥基乙基)-2-甲基咪唑、1-(2’-羥基丙基)-2-甲基咪唑、1-(3’-胺基丙基)咪唑、1-(3’-胺基丙基)-2-甲基咪唑、1-(3’-羥基丙基)咪唑、1-(3’-羥基丙基)-2-甲基咪唑、N,N-二甲基胺基丙基-N’-(2-羥基乙基)胺、N,N-二甲基胺基丙基-N’,N’-雙(2-羥基乙基)胺、N,N-二甲基胺基丙基-N’,N’-雙(2-羥基丙基)胺、N,N-二甲基胺基乙基-N’,N’-雙(2-羥基乙基)胺、N,N-二甲基胺基乙基-N’,N’-雙(2-羥基丙基)胺、三聚氰胺或/及苯胍胺等。
前述胺鹽例如可舉出DBU(1,8-二吖-雙環[5.4.0]十一烯-7)之有機酸鹽系之胺鹽等。
前述胺基甲酸酯化觸媒之配合量係相對於全羧酸樹脂100質量份而言,以0.1~20質量份為佳,更佳為0.5~10.0質量份。
本發明之感光性樹脂組成物中可使用如三聚氰胺衍生物、苯胍胺衍生物之胺基樹脂等之熱硬化成分。作為此般熱硬化成分,例如可舉出羥甲基三聚氰胺化合物、羥甲基苯胍胺化合物、羥甲基乙炔脲化合物、羥甲基脲化合物、烷氧基甲基化三聚氰胺化合物、烷氧基甲基化苯胍胺化合物、烷氧基甲基化乙炔脲化合物、烷氧基甲基化脲化合物等。上述烷氧基甲基之種類並非係受到特別限定者,例如可作成甲氧基甲基、乙氧基甲基、丙氧基甲基、丁氧基甲基等。尤其係以對人體或環境溫和之福馬林濃度在0.2%以下之三聚氰胺衍生物為佳。上述熱硬化成分可單獨使用1種,亦可將2種以上組合使用。
作為此等熱硬化成分之市售品,例如可舉出Cymel 300、同301、同303、同370、同325、同327、同701、同266、同267、同238、同1141、同272、同202、同1156、同1158、同1123、同1170、同1174、同UFR65、同300(以上,三井氰胺(股)製)、Nikalac Mx-750、同Mx-032、同Mx-270、同Mx-280、同Mx-290、同Mx-706、同Mx-708、同Mx-40、同Mx-31、同Ms-11、同Mw-30、同Mw-30HM、同Mw-390、同Mw-100LM、同Mw-750LM、
(以上,(股)三和化學製)等。
在使用上述於分子中具有複數環狀(硫)醚基之熱硬化性成分時,係以含有熱硬化觸媒為佳。作為此般熱硬化觸媒,例如可舉出咪唑、2-甲基咪唑、2-乙基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、4-苯基咪唑、1-氰基乙基-2-苯基咪唑、1-(2-氰基乙基)-2-乙基-4-甲基咪唑等之咪唑衍生物;二氰二胺、苄基二甲基胺、4-(二甲基胺基)-N,N-二甲基苄基胺、4-甲氧基-N,N-二甲基苄基胺、4-甲基-N,N-二甲基苄基胺等之胺化合物、己二酸二醯肼、癸二酸二醯肼等之胼化合物;三苯基膦等之磷化合物等。又,市售品可舉出例如四國化成工業公司製之2MZ-A、2MZ-OK、2PHZ、2P4BHZ、2P4MHZ(皆為咪唑系化合物之商品名)、San-Apro公司製之U-CAT(註冊商標)3503N、U-CAT3502T(皆為二甲基胺之封端異氰酸酯化合物之商品名)、DBU、DBN、U-CATSA102、U-CAT5002(皆為二環式脒化合物及其鹽)等。尤其,並非受限於此等者,環氧樹脂或氧環丁烷化合物之熱硬化觸媒,或只要係促進環氧基及/或氧環丁烷基與羧基之反應者即可,可單獨使用或將2種以上混合使用亦無妨。又,亦可使用胍胺、乙胍胺、苯胍胺、三聚氰胺、2,4-二胺基-6-甲基丙烯醯氧基乙基-S-三嗪、2-乙烯基-2,4-二胺基-S-三嗪、2-乙烯基-4,6-二胺基-S-三嗪‧異三聚氰酸加成物、2,4-二胺基-6-甲基
丙烯醯氧基乙基-S-三嗪‧異三聚氰酸加成物等之S-三嗪衍生物,較佳係將此等亦可作用為密著性賦予劑之化合物與前述熱硬化觸媒併用。
此等熱硬化觸媒之配合量係相對於全羧酸樹脂100質量份而言,以為0.1~20質量份為佳,更佳為0.5~15.0質量份。
本發明之感光性樹脂組成物中,為了提升層間之密著性或感光性樹脂層與基材之密著性,可使用密著促進劑。密著促進劑例如可舉出苯并咪唑、苯并噁唑、苯并噻唑、2-巰基苯并咪唑、2-巰基苯并噁唑、2-巰基苯并噻唑(商品名:川口化學工業(股)製Accel M)、3-嗎啉基甲基-1-苯基-三唑-2-硫酮、5-胺基-3-嗎啉基甲基-噻唑-2-硫酮、2-巰基-5-甲硫基-噻二唑、三唑、四唑、苯并三唑、羧基苯并三唑、胺基含有苯并三唑、矽烷耦合劑等。
本發明之感光性樹脂組成物中可含有著色劑。作為使用之著色劑,可使用如紅、青、綠、黃、白等之慣用公知之著色劑,可為顏料、染料、色素之任一者。具體例可舉出如編號有下述之色指數(C.I.;英國染色及配色師協會(The Society of Dyers and Colourists)發行)者。但,若添加如氯化酞花青綠之含鹵素之綠色著色劑,則在隱蔽性、
耐熱性上為佳。
紅色著色劑係如有單偶氮系、雙偶氮系、偶氮色淀系、苯并咪唑酮系、苝系、吡咯並吡咯二酮系、縮合偶氮系、蒽醌系、喹吖酮系等,具體地可舉出如以下者。
單偶氮系:顏料紅1,2,3,4,5,6,8,9,12,14,15,16,17,21,22,23,31,32,112,114,146,147,151,170,184,187,188,193,210,245,253,258,266,267,268,269。
雙偶氮系:顏料紅37,38,41。
單偶氮色淀系:顏料紅48:1,48:2,48:3,48:4,49:1,49:2,50:1,52:1,52:2,53:1,53:2,57:1,58:4,63:1,63:2,64:1,68。
苯并咪唑酮系:顏料紅171、顏料紅175、顏料紅176、顏料紅185、顏料紅208。
苝系:溶劑紅135、溶劑紅179、顏料紅123、顏料紅149、顏料紅166、顏料紅178、顏料紅179、顏料紅190、顏料紅194、顏料紅224。
吡咯並吡咯二酮系:顏料紅254、顏料紅255、顏料紅264、顏料紅270、顏料紅272。
縮合偶氮系:顏料紅220、顏料紅144、顏料紅166、顏料紅214、顏料紅220、顏料紅221、顏料紅242。
蒽醌系:顏料紅168、顏料紅177、顏料紅216、溶劑紅149、溶劑紅150、溶劑紅52、溶劑紅207。
喹吖酮系:顏料紅122、顏料紅202、顏料紅206、顏料紅207、顏料紅209。
藍色著色劑係如有酞花青系、蒽醌系,顏料系則係如有分類為顏料(Pigment)之化合物,具體如:顏料藍15、顏料藍15:1、顏料藍15:2、顏料藍15:3、顏料藍15:4、顏料藍15:6、顏料藍16、顏料藍60。
染料系則可使用如溶劑藍35、溶劑藍63、溶劑藍68、溶劑藍70、溶劑藍83、溶劑藍87、溶劑藍94、溶劑藍97、溶劑藍122、溶劑藍136、溶劑藍67、溶劑藍70等。除上述以外,亦可使用金屬取代或無取代之酞花青化合物。
綠色著色劑係同樣如有酞花青系、蒽醌系、苝系,具體地可使用如顏料綠7、顏料綠36、溶劑綠3、溶劑綠5、溶劑綠20、溶劑綠28等。除上述以外,亦可使用金屬取代或無取代之酞花青化合物。
黃色著色劑如有單偶氮系、雙偶氮系、縮合偶氮系、
苯并咪唑酮系、異吲哚酮系、蒽醌系等,具體地可舉出如以下者。
蒽醌系:溶劑黃163、顏料黃24、顏料黃108、顏料黃193、顏料黃147、顏料黃199、顏料黃202。
異吲哚酮系:顏料黃110、顏料黃109、顏料黃139、顏料黃179、顏料黃185。
縮合偶氮系:顏料黃93、顏料黃94、顏料黃95、顏料黃128、顏料黃155、顏料黃166、顏料黃180。
苯并咪唑酮系:顏料黃120、顏料黃151、顏料黃154、顏料黃156、顏料黃175、顏料黃181。
單偶氮系:顏料黃1,2,3,4,5,6,9,10,12,61,62,62:1,65,73,74,75,97,100,104,105,111,116,167,168,169,182,183。
雙偶氮系:顏料黃12,13,14,16,17,55,63,81,83,87,126,127,152,170,172,174,176,188,198。
其他,以調整色調為目的,亦可添加如紫、橘色、茶色、黑等之著色劑。
若具體例示,則有顏料紫19、23、29、32、36、38、42、溶劑紫13、36、C.I.顏料橘1、C.I.顏料橘5、C.I.顏料橘13、C.I.顏料橘14、C.I.顏料橘16、C.I.顏料橘17、C.I.顏料橘24、C.I.顏料橘34、C.I.顏料橘36、C.I.顏料橘38、C.I.顏料橘40、C.I.顏料橘43、C.I.顏料橘46、C.I.顏料橘49、C.I.顏料橘51、C.I.顏料橘61、C.I.顏料橘63、C.I.顏料橘64、C.I.顏料橘71、C.I.顏料橘73、C.I.顏
料棕23、C.I.顏料棕25、C.I.顏料黑1、C.I.顏料黑7等。
著色劑之配合量雖並無特別限制,相對於前述全羧酸樹脂100質量份而言,以0.01~10質量份為佳,特佳為0.1~5質量份。
並且,本發明之感光性樹脂組成物為了合成前述酸變性感光性環氧樹脂或調整組成物,或為了用以調整塗佈於基板或載體薄膜之黏度,亦可使用有機溶劑。
此般有機溶劑可舉出如酮類、芳香族烴類、二醇醚類、二醇醚乙酸酯類、酯類、醇類、脂肪族烴、石油系溶劑。更具體而言,可舉出甲基乙基酮、環己酮等之酮類;甲苯、若、四甲基苯等之芳香族烴類;溶纖劑、甲基溶纖劑、丁基溶纖劑、卡必醇、甲基卡必醇、丁基卡必醇、丙二醇單甲基醚、二丙二醇單甲基醚、二丙二醇二乙基醚、三乙二醇單乙基醚等之二醇醚類;乙酸乙酯、乙酸丁酯、二丙二醇甲基醚乙酸酯、丙二醇甲基醚乙酸酯、丙二醇乙基醚乙酸酯、丙二醇丁基醚乙酸酯等之酯類;乙醇、丙醇、乙二醇、丙二醇等之醇類;辛烷、癸烷等之脂肪族烴;石油醚、石油腦、氫化石油腦、溶劑石油腦等之石油系溶劑等。此般有機溶劑可單獨使用1種,亦可將2種以上作成混合物而使用。
本發明之感光性樹脂組成物為了防止氧化,可含有使產生之自由基無效化之自由基捕捉劑,或使產生之過氧化物分解成無害物質且不使新自由基產生之過氧化物分解劑等之防氧化劑。本發明所使用之防氧化劑可防止樹脂等之氧化劣化且抑制黃變。並且,藉由添加防氧化劑,除上述記載之效果以外,尚可防止因感光性樹脂組成物之光硬化反應所造成之光暈、使開口形狀安定化等、提高製作感光性樹脂組成物時之操作界限。防氧化劑可單獨使用1種,亦可將2種以上組合使用。
作用為自由基捕捉劑之防氧化劑,例如可舉出氫醌、4-t-丁基兒茶酚、2-t-丁基氫醌、氫醌單甲基醚、2,6-二-t-丁基-p-甲酚、2,2-亞甲基-雙(4-甲基-6-t-丁基酚)、1,1,3-參(2-甲基-4-羥基-5-t-丁基苯基)丁烷、1,3,5-三甲基-2,4,6-參(3,5-二-t-丁基-4-羥基苄基)苯、1,3,5-參(3’,5’-二-t-丁基-4-羥基苄基)-S-三嗪-2,4,6-(1H,3H,5H)三酮等之酚系化合物、甲萘醌、苯醌等之醌系化合物、雙(2,2,6,6-四甲基-4-哌啶基)-癸二酸酯、酚噻嗪等之胺系化合物等。市售品例如可舉出Adekastab AO-30、Adekastab AO-330、Adekastab AO-20、Adekastab LA-77、Adekastab LA-57、Adekastab LA-67、Adekastab LA-68、Adekastab LA-87(以上、旭電化公司製、商品名)、IRGANOX 1010、IRGANOX 1035、IRGANOX 1076、IRGANOX 1135、TINUVIN 111FDL、TINUVIN 123、TINUVIN 144、TINUVIN 152、TINUVIN 292、TINUVIN 5100(以上,
Ciba Specialty Chemicals公司製,商品名)等。
作用為過氧化物分解劑之防氧化劑,例如可舉出三苯基亞磷酸酯等之磷系化合物、季戊四醇四月桂基硫代丙酸酯、二月桂基硫代二丙酸酯、二硬脂醯3,3’-硫代二丙酸酯等之硫黃系化合物等。市售品例如可舉出Adekastab TPP(旭電化公司製、商品名)、Mark AO-412S(Adeka Agus Chemicals公司製、商品名)、Sumilizer TPS(住友化學公司製、商品名)等。
使用上述防氧化劑時之配合量係相對於全羧酸樹脂100質量份而言,以0.01質量份~10質量份為佳,0.01~5質量份為較佳。防氧化劑之配合量若未滿0.01質量份時,則變得無法取得添加前述防氧化劑之效果。另一方面,若過量配合多於10質量份時,因有光反應之阻礙、對鹼水溶液之顯像不良、黏性之惡化、塗膜物性之下降之憂慮而不佳。
又,前述之防氧化劑,特別係酚系防氧化劑,藉由與耐熱安定劑併用,有更加發揮效果之情形,故於本發明之感光性樹脂組成物中亦可配合耐熱安定劑。
耐熱安定劑可舉出如磷系、羥基胺系、硫系耐熱安定劑等。此等耐熱安定劑之市售品可舉出如IRGAFOX168、IRGAFOX12、IRGAFOX38、IRGASTAB PUR68、IRGASTAB PVC76、IRGASTAB FS301FF、IRGASTAB FS110、IRGASTAB FS210FF、IRGASTAB FS410FF、IRGANOX PS800FD、IRGANOX PS802FD、
RECYCLOSTAB 411、RECYCLOSTAB 451AR、RECYCLOSSORB 550、RECYCLOBLEND 660(以上為BASF JAPAN之商品名)等。上述耐熱安定劑可單獨使用1種,亦可將2種以上予以併用。
使用耐熱安定劑時之配合量係相對於全羧酸樹脂100質量份而言,以0.01質量份~10質量份為佳,以0.01~5質量份為更佳。
一般而言,高分子材料因吸收光,藉此而引起分解‧劣化,故在本發明之感光性樹脂組成物中,為了對紫外線之安定化施以對策,除上述防氧化劑以外,尚可使用紫外線吸收劑。
紫外線吸收劑可舉出如二苯甲酮衍生物、苯甲酸酯衍生物、苯并三唑衍生物、三嗪衍生物、苯并噻唑衍生物、桂皮酸酯衍生物、鄰胺苄酸酯衍生物、二苄醯基甲烷衍生物等。二苯甲酮衍生物之具體例,可舉出2-羥基-4-甲氧基二苯甲酮、2-羥基-4-n-辛氧基二苯甲酮、2,2’-二羥基-4-甲氧基二苯甲酮及2,4-二羥基二苯甲酮等。苯甲酸酯衍生物之具體例,可舉出2-乙基己基柳酸酯、苯基柳酸酯、p-t-丁基苯基柳酸酯、2,4-二-t-丁基苯基-3,5-二-t-丁基-4-羥基苯甲酸酯及十六基-3,5-二-t-丁基-4-羥基苯甲酸酯等。苯并三唑衍生物之具體例,可舉出2-(2’-羥基-5’-t-丁基苯基)苯并三唑、2-(2’-羥基-5’-甲基苯基)苯并三唑、2-
(2’-羥基-3’-t-丁基-5’-甲基苯基)-5-氯苯并三唑、2-(2’-羥基-3’,5’-二-t-丁基苯基)-5-氯苯并三唑、2-(2’-羥基-5’-甲基苯基)苯并三唑及2-(2’-羥基-3’,5’-二-t-戊基苯基)苯并三唑等。三嗪衍生物之具體例,可舉出羥基苯基三嗪、雙乙基己氧基酚甲氧基苯基三嗪等。
作為紫外線吸收劑之市售品,例如可舉出TINUVIN PS、TINUVIN 99-2、TINUVIN 109、TINUVIN 384-2、TINUVIN 900、TINUVIN 928、TINUVIN 1130、TINUVIN 400、TINUVIN 405、TINUVIN 460、TINUVIN 479(以上,BASF JAPAN,商品名)等。
上述之紫外線吸收劑可單獨使用1種,亦可將2種以上組合使用。藉由併用前述防氧化劑,可謀求由本發明之感光性樹脂組成物所得之硬化物之安定化。
本發明之感光性樹脂組成物中因應必要,亦可添加微粉二氧化矽、有機皂土、蒙特石、水滑石等之觸變化劑。作為觸變化劑,因有機皂土、水滑石之經時安定性優異,故為佳,尤其係水滑石在電特性優異而為佳。又,亦可配合熱聚合禁止劑,或聚矽氧系、氟系、高分子系等之消泡劑及/或均染劑、防銹劑,以及雙酚系、三嗪硫醇系等之銅害防止劑等之公知慣用之添加劑類。
前述熱聚合禁止劑可使用用以防止前述聚合性化合物之熱性聚合或經時性聚合。熱聚合禁止劑,例如可舉出4-
甲氧基酚、氫醌、烷基或芳基取代氫醌、t-丁基兒茶酚、五倍子酚、2-羥基二苯甲酮、4-甲氧基-2-羥基二苯甲酮、氯化銅、酚噻嗪、四氯苯醌、萘基胺、β-萘酚、2,6-二-t-丁基-4-甲酚、2,2’-亞甲基雙(4-甲基-6-t-丁基酚)、吡啶、硝基苯、二硝基苯、苦味酸、4-鄰甲苯胺、亞甲基藍、銅與有機螯合劑反應物、水楊酸甲酯、及酚噻嗪、亞硝基化合物、亞硝基化合物與Al之螯合物等。
本發明之感光性樹脂組成物係例如以前述有機溶劑調整成適宜塗布方法之黏度,於基材上,藉由浸塗法、浮塗法、輥塗法、棒塗法、網版印刷法、簾塗法等之方法進行塗佈,以約60~100℃之溫度使組成物中所含之有機溶劑揮發乾燥(假乾燥),而可形成無黏之塗膜。又,將上述組成物塗佈於載體薄膜上,使其乾燥並捲取作為薄膜之乾薄膜時,以層合機等使感光性樹脂組成物層與基材接觸般地貼合於基材上後,藉由剝離載體薄膜剝而可形成樹脂絕緣層。
其後,藉由接觸式(或非接觸方式),通過形成有圖型之光罩而選擇性地以活性能量線進行曝光,或藉由雷射直接曝光機直接曝光圖型曝光,藉由稀鹼水溶液(例如0.3~3wt%碳酸鈉水溶液)顯像未曝光部而形成抗蝕圖型。並且,在含有熱硬化性成分之組成物時,可藉由例如加熱至約140~180℃之溫度使其熱硬化,前述羧酸樹脂之羧基與熱硬化性成分反應,形成耐熱性、耐藥品性、耐吸濕性、密著性、電特性等之諸特性優良之硬化塗膜。尚且,
即使係在不含有熱硬化性成分之情況時,藉由熱處理,曝光時以未反應之狀態而殘留之乙烯性不飽和鍵進行熱自由基聚合,而使塗膜特性提升,故亦可因應目的‧用途而施以熱處理(熱硬化)。
作為上述基材,除可舉出預先已形成電路之印刷配線板或可撓性印刷配線板以外,尚可舉出使用紙酚、紙環氧、玻璃布環氧、玻璃聚醯亞胺、玻璃布/不繊布環氧、玻璃布/紙環氧、合成纖維環氧、氟‧聚乙烯‧PPO‧氰酸酯等之使用高頻率電路用貼銅層合版等之材質者之全部等級(FR-4等)之貼銅層合版,其他另可舉出聚醯亞胺薄膜、PET薄膜、玻璃基板、陶瓷基板、晶圓板等。
塗佈本發明之感光性樹脂組成物後所施行之揮發乾燥可使用熱風循環式乾燥爐、IR爐、加熱板、對流烘箱等(使用具備蒸氣所致之空氣加熱方式之熱源者,使乾燥機內之熱風對向流動接觸之方法及藉由噴嘴對支持體吹附之方式)進行。
藉由對將感光性樹脂組成物塗佈且使溶劑揮發乾燥後取得之塗膜施行曝光(活性能量線之照射),而曝光部(被活性能量線所照射之部分)硬化。
作為上述活性能量線之照射所使用之曝光機,只要係搭載高壓水銀燈、超高壓水銀燈、金屬鹵素燈、水銀短弧燈等,在350~450nm之範圍內照射紫外線之裝置即可,並且,亦可使用直接描繪裝置(例如由電腦之CAD資料直接以雷射描繪圖像之雷射直接成像裝置)。作為直描機之
雷射光源,只要係使用最大波長在350~410nm範圍內之雷射光,即可為氣體雷射、固體雷射之任意者。圖像形成用之曝光量雖依據膜厚等而相異,一般為20~800mJ/cm2,較佳可設在20~600mJ/cm2之範圍內。
前述顯像方法可使用浸漬法、噴淋法、噴霧法、刷洗法等,顯像液可使用如氫氧化鉀、氫氧化鈉、碳酸鈉、碳酸鉀、磷酸鈉、矽酸鈉、氨、胺類等之鹼水溶液。
以下,展示實施例及比較例具體地說明關於本發明,但本發明並非係受到下述實施例所限定者。尚且,以下之「份」及「%」在無特別界定時皆為質量基準。
對具備有攪拌機與冷卻管之2000ml燒瓶添加二丙二醇單甲基醚431g,在氮氣流下加熱至90℃。將混合溶解有苯乙烯104.2g、甲基丙烯酸296.6g、二甲基2,2'-偶氮雙(2-甲基丙酸酯)(和光純藥工業(股)製:V-601)23.9g者,以4小時滴入燒瓶中。
藉此而取得非感光性羧酸樹脂A。此A之固形分酸價為140mgKOH/g,固形分為50%。
將下述表1所示之化合物以表中記載之比例(質量份)
配合,於攪拌機中預備混合後,以三輥混練機進行混練而調製成感光性樹脂組成物。
以網版印刷將各實施例及比較例之感光性樹脂組成物全面塗佈於已形成有圖型之銅箔基板上而使其乾燥膜厚為20μm,在80℃下乾燥30分鐘,放置冷卻至室溫。對此基板使用搭載有高壓水銀燈之曝光裝置,以最佳曝光量曝光圖型後,藉由30℃之1wt%碳酸鈉水溶液,在噴壓0.2MPa
之條件下進行60秒鐘顯像而取得圖型。
對此基板施行150℃‧60分鐘之後硬化(post-cure),而取得形成有硬化物圖型之評價基板。
使用取得之評價基板如以下般地評價關於各特性。
對上述150℃‧60分之後硬化後之基板塗佈水溶性助焊劑(W-2704、Mec公司製),於288℃之焊槽中浸漬基板15秒鐘。其次,將基板投入約60℃之水中並放置10分鐘(助焊劑除去步驟)。將基板由水中取出,並將基板表面之水分充分拭去。
使用所得之評價基板,藉由膠帶剝離而評價有無抗蝕層之剝離。各別之判定基準係如以下般。所得之結果係如下述表2所示。
◎:30秒鐘×2次浸漬後,完全未發現剝離。
○:30秒鐘×1次浸漬後,未發現剝離。
×:30秒鐘×1次浸漬後,抗蝕層膨脹且有剝離。
評價基板係使用市售品之無電解鍍鎳浴及無電解鍍金浴,於80~90℃中,鎳5μm、金0.05μm之條件下進行鍍敷。對經鍍敷之評價基板,評價有無抗蝕層之剝離或有無鍍敷之滲入後,藉由膠帶剝離評價有無抗蝕層之剝離。各別之判定基準係如以下般。取得之結果係如下述表2所
示。
◎:鍍敷後完全未發現滲入,膠帶剝離後未產生剝離。
○:鍍敷後僅發現些許滲入,但膠帶剝離後未產生剝離。
△:鍍敷後僅確認有些許滲入,膠帶剝離後僅產生些許剝離。
×:鍍敷後確認有滲入,膠帶剝離後亦發現剝離。
上述無電解鍍金耐性、焊劑耐熱性評價後,以目視評價硬化皮膜表面之白濁情形。各別之判定基準係如以下般。所得之結果係如下述表2所示。
◎:硬化皮膜上完全未發現變色。
○:硬化皮膜上發現輕微之變色,但外觀上並係造成問題之程度。
△:硬化皮膜上有部分地白濁變色。
×:硬化皮膜全體變成白濁。
在通常步驟中採取製成之硬化塗膜試料。在過氧化氫水中捕集將此試料以900℃燃燒處理所產生之氣體。將捕集氣體後之液以離子層析法予以定性、定量。
由表2可確認到未使用含鋁填充料之比較例1、2及3在鍍敷白化試驗、整平白化試驗之任一者中硬化皮膜呈現白濁。未使用非感光性羧酸樹脂之比較例4亦在條件嚴苛之整平白化試驗中確認到白濁。相對於此,使用含鋁填充料之實施例皆未再硬化皮膜上發現變色,故為良好之結果。
又,全羧酸樹脂中,未使用非感光性羧酸樹脂,但僅使用源自環氧樹脂之感光性羧酸樹脂之比較例4及5中,確認到氯含有率為900ppm以上,其之鹵素量較多。相對於此,併用非感光性羧酸樹脂及上述感光性羧酸樹脂之實施例中,皆確認到氯含有率為900ppm以下,其鹵素量較少。
Claims (7)
- 一種感光性樹脂組成物,其特徵為包含(A)藉由不飽和羧酸與選自苯乙烯及其衍生物之中之至少任意一種之共聚合而得之非感光性羧酸樹脂、(B)含鋁無機填充料、(C)雙酚A型環氧樹脂。
- 如請求項1之感光性樹脂組成物,其中進而包含感光性單體。
- 如請求項1或2之感光性樹脂組成物,其中進而包含感光性羧酸樹脂。
- 如請求項1之感光性樹脂組成物,其中氯含有率為900ppm以下。
- 如請求項1之感光性樹脂組成物,其係抗焊劑。
- 一種硬化皮膜,其特徵為使如請求項1~5中任一項之感光性樹脂組成物硬化而成。
- 一種印刷配線板,其特徵為具備如請求項6之硬化皮膜。
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JP5643417B1 (ja) * | 2013-12-24 | 2014-12-17 | 互応化学工業株式会社 | 白色ソルダーレジスト層の製造方法、白色ソルダーレジスト層、及び白色ソルダーレジスト層の製造に用いられる白色ソルダーレジスト組成物 |
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JP2017212400A (ja) * | 2016-05-27 | 2017-11-30 | 住友ベークライト株式会社 | 樹脂シートおよび回路基板 |
CN106198776B (zh) * | 2016-06-22 | 2019-04-26 | 中国瑞林工程技术股份有限公司 | 测定废旧电路板冶炼烟尘中卤素的方法 |
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JP6337190B1 (ja) * | 2017-03-29 | 2018-06-06 | 東洋インキScホールディングス株式会社 | 固体撮像素子向けカラーフィルタ用感光性緑色着色組成物および固体撮像素子用カラーフィルタ |
US20210017410A1 (en) * | 2018-03-30 | 2021-01-21 | Taiyo Ink Mfg. Co., Ltd. | Curable composition for inkjet, cured product of same, and electronic component comprising said cured product |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010003759A1 (en) * | 1997-11-28 | 2001-06-14 | Kuniaki Sato | Photo curable resin composition and photosensitive element |
TW201105743A (en) * | 2009-03-23 | 2011-02-16 | Taiyo Ink Mfg Co Ltd | Curable resin composition, dry film and printed circuit board using the same |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3931467A1 (de) * | 1989-09-21 | 1991-04-04 | Hoechst Ag | Durch strahlung polymerisierbares gemisch und verfahren zur herstellung einer loetstopmaske |
DE4142735A1 (de) * | 1991-12-21 | 1993-06-24 | Hoechst Ag | Durch strahlung polymerisierbares gemisch und verfahren zur herstellung einer loetstoppmaske |
JP3276833B2 (ja) * | 1995-12-13 | 2002-04-22 | 太陽インキ製造株式会社 | 光硬化性・熱硬化性艶消しレジストインキ組成物 |
KR100634341B1 (ko) * | 2000-02-14 | 2006-10-16 | 타이요 잉크 메뉴펙츄어링 컴퍼니, 리미티드 | 윤기를 없앤 피막 형성용 광경화성·열경화성 조성물 |
JP4555942B2 (ja) | 2004-08-02 | 2010-10-06 | 日立化成工業株式会社 | 感光性樹脂組成物、永久レジスト用感光性フィルム、レジストパターンの形成方法及びプリント配線基板 |
JP2007147721A (ja) * | 2005-11-24 | 2007-06-14 | Fujikura Ltd | 感光性熱硬化性樹脂組成物及びこれを硬化させてなる絶縁保護皮膜 |
CN102445850B (zh) * | 2006-04-13 | 2013-07-31 | 太阳控股株式会社 | 碱显影型阻焊剂及其固化物以及使用其得到的印刷线路板 |
JP5098411B2 (ja) * | 2006-04-19 | 2012-12-12 | 日立化成工業株式会社 | 感光性樹脂組成物、並びにこれを用いた感光性フィルム及び感光性永久レジスト |
US20090233225A1 (en) * | 2008-03-12 | 2009-09-17 | Johnson Donald W | Low chlorine epoxy resin formulations |
JP5218828B2 (ja) * | 2008-05-15 | 2013-06-26 | 日立化成株式会社 | 感光性樹脂組成物、並びにこれを用いた感光性フィルム、レジストパターンの形成方法及び永久レジスト |
JP4900510B2 (ja) * | 2008-09-04 | 2012-03-21 | 日立化成工業株式会社 | 半導体パッケージ用プリント配線板の保護膜用感光性樹脂組成物 |
JP5239786B2 (ja) * | 2008-11-28 | 2013-07-17 | 日立化成株式会社 | 感光性樹脂組成物、並びにこれを用いた感光性フィルム、レジストパターンの形成方法、ソルダーレジスト、層間絶縁膜、プリント配線板の製造方法及びプリント配線板 |
JP5377021B2 (ja) * | 2009-03-23 | 2013-12-25 | 太陽ホールディングス株式会社 | 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板 |
JP5261242B2 (ja) * | 2009-03-23 | 2013-08-14 | 太陽ホールディングス株式会社 | 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板 |
JP5356935B2 (ja) * | 2009-07-02 | 2013-12-04 | 太陽ホールディングス株式会社 | 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
JP5356934B2 (ja) * | 2009-07-02 | 2013-12-04 | 太陽ホールディングス株式会社 | 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
WO2011030580A1 (ja) * | 2009-09-10 | 2011-03-17 | 積水化学工業株式会社 | 感光性組成物及びプリント配線板 |
JP5661293B2 (ja) * | 2010-02-08 | 2015-01-28 | 太陽ホールディングス株式会社 | 光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板 |
JP5238777B2 (ja) * | 2010-09-14 | 2013-07-17 | 太陽ホールディングス株式会社 | 感光性樹脂、それを含有する硬化性樹脂組成物及びそのドライフィルム並びにそれらを用いたプリント配線板 |
-
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- 2012-09-28 US US13/630,506 patent/US20130081858A1/en not_active Abandoned
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010003759A1 (en) * | 1997-11-28 | 2001-06-14 | Kuniaki Sato | Photo curable resin composition and photosensitive element |
TW201105743A (en) * | 2009-03-23 | 2011-02-16 | Taiyo Ink Mfg Co Ltd | Curable resin composition, dry film and printed circuit board using the same |
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