TWI546006B - 印刷佈線板之製造方法 - Google Patents

印刷佈線板之製造方法 Download PDF

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Publication number
TWI546006B
TWI546006B TW101102469A TW101102469A TWI546006B TW I546006 B TWI546006 B TW I546006B TW 101102469 A TW101102469 A TW 101102469A TW 101102469 A TW101102469 A TW 101102469A TW I546006 B TWI546006 B TW I546006B
Authority
TW
Taiwan
Prior art keywords
printed wiring
wiring board
resin
heating step
board according
Prior art date
Application number
TW101102469A
Other languages
English (en)
Chinese (zh)
Other versions
TW201236531A (en
Inventor
田中伸樹
金田研一
Original Assignee
住友電木股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友電木股份有限公司 filed Critical 住友電木股份有限公司
Publication of TW201236531A publication Critical patent/TW201236531A/zh
Application granted granted Critical
Publication of TWI546006B publication Critical patent/TWI546006B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW101102469A 2011-01-26 2012-01-20 印刷佈線板之製造方法 TWI546006B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011014105 2011-01-26

Publications (2)

Publication Number Publication Date
TW201236531A TW201236531A (en) 2012-09-01
TWI546006B true TWI546006B (zh) 2016-08-11

Family

ID=46580570

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101102469A TWI546006B (zh) 2011-01-26 2012-01-20 印刷佈線板之製造方法

Country Status (5)

Country Link
JP (1) JP2012169600A (ja)
KR (1) KR20140032977A (ja)
CN (1) CN103340023A (ja)
TW (1) TWI546006B (ja)
WO (1) WO2012101992A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI697265B (zh) * 2018-08-09 2020-06-21 元智大學 高速電鍍方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018211992A1 (ja) 2017-05-19 2018-11-22 フリージア・マクロス株式会社 電子部品搭載用基板及びその製造方法
WO2018211991A1 (ja) 2017-05-19 2018-11-22 フリージア・マクロス株式会社 電子部品搭載用基板及びその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2906761B2 (ja) * 1991-08-22 1999-06-21 住友金属鉱山株式会社 銅被覆ポリイミド基板の熱処理方法
JP2005116745A (ja) * 2003-10-07 2005-04-28 Matsushita Electric Works Ltd 導体被覆ポリイミドフィルムの製造方法及び導体被覆ポリイミドフィルム
US7892651B2 (en) * 2004-09-14 2011-02-22 Mitsubishi Gas Chemical Company, Inc. Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate
JP4740692B2 (ja) * 2004-12-14 2011-08-03 三菱瓦斯化学株式会社 プリント配線板の製造法
KR100797719B1 (ko) * 2006-05-10 2008-01-23 삼성전기주식회사 빌드업 인쇄회로기판의 제조공정
JP4797816B2 (ja) * 2006-06-12 2011-10-19 三菱瓦斯化学株式会社 プリント配線板の製造方法
JP2008211060A (ja) * 2007-02-27 2008-09-11 Fujifilm Corp 金属膜付基板の製造方法
JP4464990B2 (ja) * 2007-05-22 2010-05-19 トヨタ自動車株式会社 配線基板及びその製造方法
JPWO2010013611A1 (ja) * 2008-07-30 2012-01-12 住友ベークライト株式会社 無電解銅メッキ方法、プリント配線板、プリント配線板製造方法、半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI697265B (zh) * 2018-08-09 2020-06-21 元智大學 高速電鍍方法

Also Published As

Publication number Publication date
CN103340023A (zh) 2013-10-02
TW201236531A (en) 2012-09-01
WO2012101992A1 (ja) 2012-08-02
JP2012169600A (ja) 2012-09-06
KR20140032977A (ko) 2014-03-17

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