TWI532795B - 熱硬化性墨水組成物及其用途 - Google Patents

熱硬化性墨水組成物及其用途 Download PDF

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Publication number
TWI532795B
TWI532795B TW101123152A TW101123152A TWI532795B TW I532795 B TWI532795 B TW I532795B TW 101123152 A TW101123152 A TW 101123152A TW 101123152 A TW101123152 A TW 101123152A TW I532795 B TWI532795 B TW I532795B
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TW
Taiwan
Prior art keywords
acid
formula
group
ether
bis
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Application number
TW101123152A
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English (en)
Chinese (zh)
Other versions
TW201302934A (zh
Inventor
諸越信太
古田智嗣
Original Assignee
捷恩智股份有限公司
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Application filed by 捷恩智股份有限公司 filed Critical 捷恩智股份有限公司
Publication of TW201302934A publication Critical patent/TW201302934A/zh
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Publication of TWI532795B publication Critical patent/TWI532795B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
  • Paints Or Removers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW101123152A 2011-07-01 2012-06-28 熱硬化性墨水組成物及其用途 TWI532795B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011147411 2011-07-01
JP2012139754A JP5895732B2 (ja) 2011-07-01 2012-06-21 熱硬化性インク組成物およびその用途

Publications (2)

Publication Number Publication Date
TW201302934A TW201302934A (zh) 2013-01-16
TWI532795B true TWI532795B (zh) 2016-05-11

Family

ID=47788615

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101123152A TWI532795B (zh) 2011-07-01 2012-06-28 熱硬化性墨水組成物及其用途

Country Status (3)

Country Link
JP (1) JP5895732B2 (ja)
KR (1) KR101984017B1 (ja)
TW (1) TWI532795B (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6163801B2 (ja) * 2013-03-13 2017-07-19 Jnc株式会社 硬化膜
JP6288091B2 (ja) * 2013-07-25 2018-03-07 Jnc株式会社 熱硬化性樹脂組成物、硬化膜、硬化膜付き基板および電子部品
TWI724033B (zh) * 2015-09-30 2021-04-11 日商荒川化學工業股份有限公司 改質聚醯亞胺、黏著劑組成物、附有樹脂之銅箔、覆銅積層板、印刷線路板及多層基板
KR102653701B1 (ko) * 2015-09-30 2024-04-01 아라까와 가가꾸 고교 가부시끼가이샤 변성 폴리이미드, 접착제 조성물, 수지 부착 동박, 동장 적층판, 프린트 배선판 및 다층 기판
JP6759932B2 (ja) * 2015-09-30 2020-09-23 荒川化学工業株式会社 変性ポリイミド、接着剤組成物、樹脂付銅箔、銅張積層板、プリント配線板及び多層基板
KR102211591B1 (ko) * 2016-03-30 2021-02-02 아라까와 가가꾸 고교 가부시끼가이샤 폴리이미드, 폴리이미드계 접착제, 필름상 접착재, 접착층, 접착 시트, 수지부 동박, 동피복 적층판 및 프린트 배선판, 그리고 다층 배선판 및 그 제조 방법
KR102646207B1 (ko) 2016-09-28 2024-03-11 다우 글로벌 테크놀로지스 엘엘씨 폴리(아미드산) 및 폴리이미드 폴리머의 합성용 dmpa-기반 용매계
JP7003795B2 (ja) * 2017-03-29 2022-01-21 荒川化学工業株式会社 ポリイミド、接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法
JP7003794B2 (ja) * 2017-03-29 2022-01-21 荒川化学工業株式会社 ポリイミド、接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法
KR101953777B1 (ko) * 2017-08-25 2019-03-05 주식회사 켐트로닉스 전도성 조성물, 이를 이용하여 제조한 필름 및 상기 필름을 포함하는 화상표시장치
WO2020149116A1 (ja) * 2019-01-18 2020-07-23 株式会社カネカ イミドオリゴマー、ワニス、それらの硬化物、並びにそれらを用いたプリプレグ及び繊維強化複合材料
US20220179310A1 (en) * 2019-04-02 2022-06-09 Nippon Kayaku Kabushiki Kaisha Bismaleimide compound, photosensitive resin composition using same, cured product thereof, and semiconductor element
TWI730757B (zh) * 2020-05-11 2021-06-11 晉一化工股份有限公司 熱固性聚醯亞胺樹脂及其製造方法、組成物、預聚物、薄膜、黏著劑、及其用途

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5380805B2 (ja) * 2006-08-31 2014-01-08 Ｊｎｃ株式会社 インクジェット用インク
JP5407151B2 (ja) * 2008-02-29 2014-02-05 Ｊｎｃ株式会社 インクジェット用インク
JP5617235B2 (ja) * 2008-12-12 2014-11-05 Jnc株式会社 インクジェット用インク
JP2010256532A (ja) * 2009-04-23 2010-11-11 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント及びこれを用いたレジストパターンの形成方法

Also Published As

Publication number Publication date
KR101984017B1 (ko) 2019-05-30
JP2013032501A (ja) 2013-02-14
KR20130004160A (ko) 2013-01-09
JP5895732B2 (ja) 2016-03-30
TW201302934A (zh) 2013-01-16

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