TWI526701B - 半導體元件測試用分選機 - Google Patents
半導體元件測試用分選機 Download PDFInfo
- Publication number
- TWI526701B TWI526701B TW103108407A TW103108407A TWI526701B TW I526701 B TWI526701 B TW I526701B TW 103108407 A TW103108407 A TW 103108407A TW 103108407 A TW103108407 A TW 103108407A TW I526701 B TWI526701 B TW I526701B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor component
- component
- gripping head
- test
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130036093A KR102010275B1 (ko) | 2013-04-03 | 2013-04-03 | 반도체소자 테스트용 핸들러 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201439557A TW201439557A (zh) | 2014-10-16 |
TWI526701B true TWI526701B (zh) | 2016-03-21 |
Family
ID=51665454
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103108407A TWI526701B (zh) | 2013-04-03 | 2014-03-11 | 半導體元件測試用分選機 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR102010275B1 (ko) |
CN (1) | CN104096684B (ko) |
TW (1) | TWI526701B (ko) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102433967B1 (ko) * | 2014-11-28 | 2022-08-22 | (주)테크윙 | 전자부품 테스트용 핸들러 |
CN110780133B (zh) * | 2014-11-28 | 2022-01-04 | 泰克元有限公司 | 用于测试电子部件的分选机 |
KR102228819B1 (ko) * | 2015-03-11 | 2021-03-18 | (주)테크윙 | 반도체소자 테스트용 핸들러 |
KR102325275B1 (ko) * | 2015-07-07 | 2021-11-11 | (주)테크윙 | 테스트핸들러용 푸셔 조립체 및 매치플레이트 |
KR102312491B1 (ko) * | 2015-08-11 | 2021-10-15 | (주)테크윙 | 반도체소자 테스트용 핸들러 |
KR20170078209A (ko) * | 2015-12-29 | 2017-07-07 | (주)테크윙 | 반도체소자 테스트용 핸들러 |
KR102473315B1 (ko) * | 2016-02-19 | 2022-12-02 | (주)테크윙 | 전자부품 테스트용 핸들러의 가압장치 |
KR20170116875A (ko) * | 2016-04-12 | 2017-10-20 | (주)테크윙 | 전자부품 테스트용 핸들러 |
CN107931154B (zh) * | 2016-10-13 | 2019-07-26 | 泰克元有限公司 | 电子部件测试用分选机及其示教点调整方法 |
KR20200071357A (ko) * | 2018-12-11 | 2020-06-19 | (주)테크윙 | 전자부품 테스트용 핸들러 |
CN110743816B (zh) * | 2019-11-08 | 2020-07-07 | 深圳市源微创新实业有限公司 | 一种便捷型半导体存储器检测装置 |
KR20220114214A (ko) * | 2021-02-08 | 2022-08-17 | (주)테크윙 | 전자부품 테스트용 핸들러의 어댑터 |
CN116273994B (zh) * | 2023-05-26 | 2023-07-21 | 北京京瀚禹电子工程技术有限公司 | 一种具有智能上料分拣功能的电器老炼测试设备 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0387042A (ja) * | 1989-08-30 | 1991-04-11 | Nec Corp | テーピング品の検査用オートハンドラ |
JPH04326742A (ja) * | 1991-04-26 | 1992-11-16 | Hitachi Ltd | Icハンドラのソケット位置決め方式 |
US5500605A (en) * | 1993-09-17 | 1996-03-19 | At&T Corp. | Electrical test apparatus and method |
JPH08233899A (ja) * | 1995-02-28 | 1996-09-13 | Ando Electric Co Ltd | Icのコンタクト機構 |
JP2983163B2 (ja) * | 1995-12-27 | 1999-11-29 | 株式会社しなのエレクトロニクス | Icハンドラ |
JPH10185993A (ja) * | 1996-12-26 | 1998-07-14 | Advantest Corp | Ic試験装置 |
JPH11287842A (ja) * | 1998-04-02 | 1999-10-19 | Advantest Corp | Ic試験装置 |
US6292003B1 (en) * | 1998-07-01 | 2001-09-18 | Xilinx, Inc. | Apparatus and method for testing chip scale package integrated circuits |
US6265886B1 (en) * | 1999-07-12 | 2001-07-24 | Micron Technology, Inc. | Conductive bump array contactors having an ejector and methods of testing using same |
JP2002071750A (ja) * | 2000-08-29 | 2002-03-12 | Enplas Corp | ハンドラー装置用キャリア,ハンドラー装置用プッシャー及びハンドラー装置 |
JP2002181887A (ja) * | 2000-12-12 | 2002-06-26 | Advantest Corp | 電子部品試験装置 |
JP2002207063A (ja) * | 2001-01-09 | 2002-07-26 | Advantest Corp | プッシャ及びこれを備えた電子部品試験装置 |
KR100907337B1 (ko) * | 2007-07-26 | 2009-07-13 | 주식회사 아이에스시테크놀러지 | 테스트용 소켓 |
-
2013
- 2013-04-03 KR KR1020130036093A patent/KR102010275B1/ko active IP Right Grant
-
2014
- 2014-03-11 TW TW103108407A patent/TWI526701B/zh active
- 2014-04-01 CN CN201410128979.0A patent/CN104096684B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR20140121909A (ko) | 2014-10-17 |
CN104096684A (zh) | 2014-10-15 |
CN104096684B (zh) | 2017-05-10 |
KR102010275B1 (ko) | 2019-08-13 |
TW201439557A (zh) | 2014-10-16 |
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