TWI526701B - Handler for testing semiconductor - Google Patents

Description

Semiconductor component test sorter

The present invention relates to a semiconductor element test sorting machine used in testing semiconductor elements.

The semiconductor component test sorting machine (hereinafter referred to as "sorting machine") is a device that classifies semiconductor components according to test results after electrically connecting the semiconductor elements manufactured through a predetermined manufacturing process to the tester.

A sorting machine for supporting the test of a semiconductor element has been disclosed in Korean Laid-Open Patent Publication No. 10-2002-0053406 (hereinafter referred to as "Prior Art 1") or Japanese Laid-Open Patent Publication No. 2011-247908 (hereinafter, referred to as A variety of patent documents are disclosed for "Prior Art 2").

According to the published patent document, the gripping head (named "indexing head" in the prior art 1, and the "compression device" in the prior art 2) is lowered in the state of gripping the semiconductor element to make the semiconductor element electrically A test socket (referred to as "detection socket" in prior art 2) connected to a socket board (named "Tester" in prior art 2). To this end, the gripping head is configured to be able to Level movement and vertical movement. Here, the leveling movement of the gripping head is performed between the upper point of the reciprocating device (referred to as "sliding table" in the prior art 2) and the upper point of the socket board. Moreover, the vertical movement of the gripping head is performed when the semiconductor element is gripped or released from the reciprocator and when the semiconductor element is electrically connected to the test socket or the electrical connection is released. Of course, the position between the reciprocator and the gripping head or other related structure can have a variety of configurations.

Electrically connecting the semiconductor component to the test plug by the drop of the gripping head The work of the seat should be performed in a state where accurate positioning is achieved between the semiconductor component grasped by the grip head and the test socket.

However, due to control tolerances or other various settings for level shifting The precise positioning between the semiconductor components gripped by the grip and the test socket will be very difficult. In order to solve this, as in the prior art 2, a positioning pin (designated as "guide pin" in the prior art 2) is generally provided on the socket board, and a positioning hole is provided on the gripping head (referred to as "guiding in the prior art 2" hole"). Thereby, when the gripping head is lowered, the positioning pin of the socket board is first inserted into the positioning hole of the gripping head, so that the semiconductor component can be electrically charged in a state where the precise positioning between the gripping head and the test socket is performed in advance. Connect to the test socket.

In addition, due to the development of integration technology, etc., the end of the semiconductor component The number of children tends to increase. Semiconductor manufacturers have attempted to reduce the size of the terminals and the spacing between the terminals as a solution to accommodate a larger number of terminals in a limited area. Accordingly, it has been developed that the interval between the terminals is reduced from the current 0.50 mm to 0.40 mm to 0.35 mm to 0.30 mm, and is expected to be further reduced in the future. Of course, as the spacing between the terminals is reduced, the size of the terminals should also be reduced. For example, in the BGA type, between the terminals (solder balls) In the case where the pitch is 0.5 mm, the diameter of the terminal is 0.33 mm, but in the case where the pitch between the terminals is 0.35 mm, the diameter of the terminal is reduced to 0.23 mm. In particular, a recent trend is to reduce the pitch between the terminals to 0.3 mm while also reducing the diameter of the terminals to 0.20 mm or less. In such a case, if the semiconductor element is gripped to the gripping head even if it is slightly deviated from the positive position or the twisted posture, the electrical connection between the semiconductor element and the test socket will malfunction. Moreover, there is a risk of damage or short circuit of the terminal.

Therefore, the electrical connection between the semiconductor component and the test socket is necessary Formed more precisely.

However, if the above diameter of the terminal or the space between the terminals is taken into consideration The trend of decreasing distance, relying only on the positioning pin and the positioning hole to obtain accurate positioning between the semiconductor component and the test socket, will be very difficult in the near future in the following point.

First, the positioning pin is repeatedly inserted and disengaged from the positioning hole, resulting in a configuration The wall of the positioning hole is worn. At this point, the locating pin and locating hole will lose their normal function. In order to overcome this, the cumbersome work accompanying the replacement of components is required, but correspondingly, the loss of manpower and the drop in the operating rate of the equipment are caused.

Secondly, due to the need to have the gripping head in gripping the semiconductor component The structure in which the semiconductor element is electrically connected to the test socket is lowered, and thus the grip state of the semiconductor element is particularly important. However, the movement control tolerance of the reciprocator or gripping head or the loading tolerance of the semiconductor component will affect the precise grip of the semiconductor component gripped by the gripping head. That is, as shown in the exaggerated display of (a) and (b) of FIG. 1, the semiconductor element D may not be grasped correctly by the pickup P of the gripping head or may be gripped in a state of being slightly rotated. However, as much as possible Attempts to design tolerances mentioned in the small can only be limited.

An object of the present invention is to provide a technique for correcting the position or posture of a semiconductor element while ignoring the gripping head while gripping the gripping head of the semiconductor element above the socket board.

In order to achieve the above object, a semiconductor test according to the present invention includes: a socket board having at least one test socket electrically connected to a tester side; and a pocket board arrangably mounted on an upper side of the socket board, in The at least one test socket correspondingly has at least one component pocket for receiving the semiconductor component; and the lifting component enables the concave pocket to be raised and lowered, thereby accommodating at least one semiconductor received in the at least one component pocket The component can be electrically connected to the at least one test socket or to the electrical connection; the component supply provides at least one semiconductor component to the at least one component pocket.

The component supplier includes: a gripping head having at least one picker capable of gripping or disarming the semiconductor element; a level shifter moving the gripping head in a horizontal direction; and a vertical shifter moving in the up and down direction The gripping head is an elastic member that elastically supports the concave bag plate against the socket plate, and the concave bag plate is lowered by the grasping head, and the grasping head is according to the The operation of the vertical mover is lowered.

The concave pocket plate and the gripping head are selectively provided with positioning holes for setting positions between each other and positioning pins inserted into the positioning holes, respectively.

Also including guiding the lifting movement of the concave pocket plate while limiting the A level shifting guide for the pocket.

The guide is fixedly disposed on the socket board.

In order to achieve the above object, a method of operating a semiconductor component test sorting machine according to a first aspect of the present invention includes: a first step of gripping at least one semiconductor component with at least one picker on a gripping head; Moving the gripping head upwardly of the concave bag plate; in the third step, supplying at least one semiconductor component gripped by the at least one picker to at least one component concave pocket on the concave pocket plate; and fourth step, lowering the concave pocket plate, Electrically connecting at least one semiconductor component housed in the at least one component pocket to at least one test socket located on the socket plate below the concave bag plate; in the fifth step, when the test performed after the fourth step ends, The head carries out at least one semiconductor component housed in at least one component pocket.

The third step includes a third step a, dropping the gripping head to a lowered position, and a third step b, dropping the at least one semiconductor component.

The lowering of the concave pocket in the fourth step is achieved in a forcible manner by further lowering the gripping head to a lower connecting position than the lowered position.

At least one picker on the gripping head descending to the connected position in the fourth step presses the at least one semiconductor component toward the test socket side.

Preferably, a step is further included between the second step and the third step: setting a position of the concave pocket plate and the gripping head relative to each other.

While performing the fifth step, the concave bag plate is raised in accordance with the elastic force.

In order to achieve the above object, a semiconductor according to a second aspect of the present invention The method for operating a body component testing sorting machine includes: a first step of grasping at least one semiconductor component by using at least one picker on the gripping head; and a second step of moving the gripping head over the concave pocket plate; a step of lowering at least one semiconductor element downward; a fourth step a, correcting a position of the lowered at least one semiconductor element; and a fourth step b, applying at least one semiconductor element to the socket board side by the gripping head to at least one The semiconductor component is electrically connected to at least one test socket on the socket board; in a fifth step, the at least one semiconductor component is disconnected from the at least one test socket by the gripping head when the test performed after the fourth step is completed.

The third step is in a state in which the gripping head is lowered to the lowered position. get on.

The fourth b step is performed to enable the fourth step a The at least one semiconductor element whose position is corrected is stopped further downward by means of the gripping head.

While the fifth step is being performed, the concave bag plate is raised in accordance with the elastic force.

According to the present invention, since the position in the horizontal direction of the concave bag plate and the test socket can always maintain an accurately set state, there is a positive effect that the reliability of the electrical connection between the semiconductor element and the test socket can be further improved.

200‧‧‧Semiconductor component test sorting machine

240‧‧‧Components supplier

241‧‧‧Scratch head

241a‧‧‧Positioning holes

P‧‧‧ Picker

242‧‧‧Level mover

243‧‧‧Vertical mover

250‧‧‧Socket board

251‧‧‧Test socket

260‧‧‧ concave pocket board

261‧‧‧Component pocket

261c‧‧ Locating pin

270‧‧‧guide

280‧‧ ‧ spring

Fig. 1 is a reference diagram for explaining problems of the prior art.

2 is a conceptual plan view of a sorting machine in accordance with the present invention.

Fig. 3 is a partially exploded perspective view showing the main part of the sorting machine of Fig. 2 cut away.

4 is a schematic side view of a component supplier for the sorter applied to FIG. 2.

Figure 5 is a sampling diagram for a socket board applied to the sorter of Figure 2.

Figure 6 is a sample view of a pocket plate applied to the sorter of Figure 2.

Figure 7 is a bottom perspective view of a component pocket according to other examples applicable to the pocket plate of Figure 6.

8 to 12 are reference diagrams for explaining a working method for a main portion of a sorting machine according to the present invention.

Hereinafter, a preferred embodiment according to the present invention as described above will be described with reference to FIGS. 2 to 12. For the sake of brevity of description, the well-known or repeated descriptions or reference numerals are omitted or compressed as much as possible.

<For the description of the device>

2 is a conceptual plan view of a semiconductor component test sorting machine 200 (hereinafter, simply referred to as "sorting machine") according to the present invention, and FIG. 3 is a cutaway view of the main part IP of the sorting machine of FIG. A partial exploded perspective view.

2 and 3, the sorting machine 200 according to the present invention includes: a shuttle 210, a loading portion 220, an unloading portion 230, a component supplier 240, a socket plate 250 (refer to FIG. 3), and a concave portion. Pocket plate 260 (see FIG. 3), guide 270 (see FIG. 3), and spring 280 (refer to FIG. 3) .

The reciprocator 210 has a loading position LP and a grip in the left and right direction A pocket table 211 that reciprocates in a straight line at the position DP and the unloading position UP. The pocket table 211 has eight loading pockets 211a and eight unloading pockets 211b on which semiconductor elements can be placed. Here, the loading pocket 211a reciprocates between the loading position LP and the gripping position DP according to the reciprocating movement of the pocket table 211, and the unloading pocket 211b is grasped according to the reciprocating movement of the pocket table 211. The holding position DP and the unloading position UP reciprocate. The loading portion 220 loads the semiconductor elements that need to be tested into the respective loading pockets 211a of the reciprocator 210.

The unloading portion 230 will be completed from the unloading pocket 211b of the reciprocator 210. The tested semiconductor components are unloaded.

It should be noted here that regarding loading/unloading of semiconductor components The technology is well known by being disclosed in various forms, and thus a detailed description thereof will be omitted.

The component supplier 240 supplies eight semiconductor components to the pocket plate 260 . To this end, as shown in the schematic side view of FIG. 4, the component supplier 240 includes a gripping head 241, a level shifter 242, and a vertical shifter 243.

The gripping head 241 can grasp 8 semiconductor components or can be grasped There are eight pickers P that can grip one semiconductor element or release the grip by vacuum pressure. Such a gripping head 241 is formed with a plurality of positioning holes 241a for setting a precise position with the pocket plate 260.

The level mover 242 moves the grip head 241 in the front-rear direction.

The vertical mover 243 moves the gripping head 241 in the up and down direction.

As shown in the extracted plan view of Figure 5, the socket board 250 has eight test plugs. The socket 251, each test socket 251 is electrically connected to the side of the tester (not shown, which can also be distinguished as the main body of the tester according to different opinions). Such a socket board 250 is set to be fixed.

The pocket plate 260 is liftably disposed on the upper side of the socket plate 250. Figure 6 As shown in the sampling diagram, such a pocket plate 260 includes eight component pockets 261 and a setting frame 262.

Each component pocket 261 is disposed in a test socket with the socket board 250 251 one-to-one corresponding position, and includes a main body 261a, a support plate 261b, and a positioning pin 261c. The component pocket 261 is distinguished from the plug-in used in a typical test sorter. That is, a plug or a rod for fixing a semiconductor element is missing from the plug-in.

The main body 261a has a quadrangular cross section that can accommodate the semiconductor element Containment space RS. Here, the wall surface constituting the accommodating space RS is inclined so that the width between the wall faces facing each other when the side faces toward the lower side is narrowed. Thereby, the area of the lower end of the accommodating space RS is reduced to an area which substantially coincides with the plane area of the semiconductor element. Thereby, the semiconductor element which is free to fall in the accommodating space RS is corrected in accordance with the inclined wall surface, and can be placed in the accommodating space RS. That is, the concave pocket plate 260 has a function of a position correcting unit or a posture correcting unit that corrects the position or posture of the semiconductor element.

The support plate 261b supports the semiconductor element housed in the accommodating space RS Pieces. Thereby, the semiconductor element accommodated in the accommodating space RS is prevented from being detached from below. Further, a plurality of exposure holes EH for exposing the terminals of the semiconductor element to the lower side are formed on the support plate 261b.

The shape of the support plate 261b is excellent in consideration of the protruding height of the small terminal Choose the film form as thin as possible. However, according to various embodiments, it is also conceivable to form the support table SJ integrally formed with the main body 261A on the main body 261A by omitting the support plate as shown in FIG. Of course, it is preferable to form a plurality of positioning grooves PS on the support table SJ for setting the positions of the terminals.

The positioning pin 261c is used to set the concave pocket plate 260 and the gripping head 241 to each other The location between. That is, when the gripping head 241 is lowered, the positioning pin 261c of the concave pocket plate 260 is inserted first into the positioning hole 241a of the gripping head 241, whereby the position between the concave pocket plate 260 and the gripping head 241 is accurate The ground is set. Of course, according to different embodiments, the positioning pin can be provided on the gripping head, and the positioning hole can be formed on the concave bag board.

The setting frame 262 is formed with an eight-piece concave pocket 261. A hole 262a and an insertion hole 262b for inserting the guide 270 are provided.

The guide 270 is disposed such that the lower end is fixed to the socket board 250, and the upper end is continuous The insertion hole 262b of the concave pocket plate 260 is passed. Such a guide 270 restricts the leveling movement of the pocket plate 260 while guiding the lifting movement of the pocket plate 260. That is, according to the guide 270, the leveling movement of the concave pocket plate 260 is restricted, and only the lifting movement can be performed. According to this, the position in the horizontal direction between the concave pocket plate 260 and the socket plate 250 is always maintained in an accurately set state.

The spring 280 elastically supports the concave pocket plate 260 against the socket plate 250 Reinforcing elastic parts. By such elastic support of the spring 280, the concave pocket plate 260 can be set to be movable up and down, and at this point, the spring 280 functions as a lifting member.

<Description of operation method>

Further, referring to Figures 8 to 12, the sorting machine 200 according to the present invention The operation method of the main part is explained.

The gripping head 241 is from the pocket table 211 located at the gripping position DP The loading pocket 211a grips the semiconductor element D. Next, the level shifter 242 is activated, and as shown in FIG. 8, the grip head 241 is moved above the socket plate 250, that is, above the pocket plate 260.

In the state of Fig. 8, the vertical shifter 243 is activated and enlarged as shown in Fig. 9. Specifically shown in the extracted portion, the gripping head 241 is lowered to the lowered position FP (which is based on the lower end of the pickup). At this time, the positioning pin 261c of the concave pocket plate 260 is inserted into the positioning hole 241a of the gripping head 241 to realize the positioning of the concave pocket plate 260 and the gripping head 241 with each other.

In the state of FIG. 9, by releasing the vacuum pressure of the pickup P or lifting For the compression supply, as shown in the enlarged extraction portion of Fig. 10, the semiconductor element D attached to the pickup P is lowered. As a result, the semiconductor element D is corrected by the wall surface of the housing space RS constituting the element pocket 261, and is lowered to the lower end of the housing space RS that can be supported by the support plate 261b. Here, the level position and posture of the semiconductor element that is stopped after being lowered to the lower end of the housing space RS have been accurately corrected.

In the state of FIG. 10, the vertical mover 243 is activated again to make the grip The head 241 is lowered. According to this, as shown in the enlarged extraction drawing portion of Fig. 11, the lower end of the pickup P abuts against the upper surface of the semiconductor element D to press the semiconductor element D downward. Moreover, at this time, a part of the gripping head 241 abuts on the upper surface of the element pocket 261, so that the gripping head 241 becomes a state in which the component pocket 261 can be pressed downward.

Moreover, as the vertical mover 243 continues to operate, as shown in FIG. As shown in the enlarged extraction diagram portion, the gripping head 241 is lowered to a lower connection position CP (based on the lower end of the pickup) than the lowering position FP. That is, the pickup P maintains the state in which the semiconductor element D accommodated in the element pocket 261 is pressed downward, and the grip head 241 continues to descend until reaching the connection position CP. According to this, the biasing force applied to the element pocket 261 by the gripping head 241 causes the pocket plate 260 to be forced downward toward the lower side against the elastic force of the spring 280. Of course, the guide 270 guides the lowering of the pocket plate 260.

In the state of FIG. 12, the semiconductor element D is electrically connected to the test socket 251. Of course, at this time, the lower end of the pickup P is in a state of continuously applying pressure and supporting the semiconductor element D, and in this state, the test of the semiconductor element D by the tester is performed.

It should be noted here that although there is no needle in the diagram of this specification Terminals and sockets (for example, pogo pins or PCR sockets) of the semiconductor element are shown in detail, but since this part is a general matter, it is omitted.

After the test is completed, the vertical mover 243 is activated to cause the gripping head 241 rise. Of course, as the gripping head 241 rises, the pressing force by the gripping head 241 is released, and the pocket plate 260 is also raised by the elastic force of the spring 280. At this time, the vacuum pressure acts on the pickup P. Accordingly, as the gripping head 241 rises, the semiconductor element D also rises, and the electrical connection between the semiconductor element D and the test socket 251 is released. Further, the gripping head 241 is further raised by the lowering position FP, so that the semiconductor element D is taken out from the element pocket 261.

When the raising of the gripping head 241 is completed, the level shifter 242 is activated to move the gripping head 241 toward the unloading pocket 211b located at the gripping position DP . Next, the semiconductor element D held by the gripping head 241 is placed on the unloading pocket 211b of the pocket table 211 at the gripping position DP.

In addition, although eight semiconductor elements are exemplified in the present embodiment at the same time The example to be tested, but the present invention can be preferably applied as long as it is a case where one or more semiconductor elements are simultaneously tested. Of course, the number of pickers, the number of component pockets, and the number of test sockets will be the same as the number of semiconductor components tested at the same time.

Moreover, although in the present embodiment, only one reciprocator is exemplified The present invention can also be preferably applied in the case where a plurality of reciprocators and a plurality of gripping heads are provided as in the Korean Patent No. 10-2012-0110424 filed by the applicant of the present application.

As described above, the detailed description of the present invention is made by referring to the embodiments of the drawings, but the above-described embodiments are merely described by way of example of the preferred embodiments of the present invention, and therefore, The scope of the invention should be understood as the scope of the claims and the equivalents thereof.

240‧‧‧Components supplier

241‧‧‧Scratch head

250‧‧‧Socket board

251‧‧‧Test socket

260‧‧‧ concave pocket board

261‧‧‧Component pocket

261c‧‧ Locating pin

262b‧‧‧ insertion hole

270‧‧‧guide

280‧‧ ‧ spring

P‧‧‧ Picker

Claims (13)

A semiconductor component testing sorting machine, comprising: a socket board having at least one test socket electrically connected to a tester side; and a concave pocket board arrangably mounted on an upper side of the socket board, at The at least one test socket correspondingly has at least one component pocket for receiving the semiconductor component; and the lifting component enables the concave pocket to be raised and lowered, thereby accommodating at least one semiconductor component received in the at least one component pocket The electrical connection can be electrically connected to the at least one test socket or the component supply can provide at least one semiconductor component to the at least one component pocket. The semiconductor component testing sorting machine according to claim 1, wherein the component supplier comprises: a gripping head having at least one picker capable of gripping or un grasping the semiconductor component; and a level shifter, Moving the gripping head in a horizontal direction; and a vertical shifter moving the gripping head in an up and down direction, the lifting member being an elastic member for elastically supporting the concave bag panel against the socket board, The concave pocket is lowered by the gripping head, which is lowered in accordance with the operation of the vertical mover. The semiconductor component testing sorting machine according to claim 2, wherein the concave pocket plate and the gripping head are selectively provided with positioning holes for setting positions between each other and inserted into the same The positioning pin of the positioning hole. The semiconductor component test sorting machine according to claim 1, characterized by further comprising a guide for guiding the movement of the concave pocket plate while restricting the leveling movement of the concave pocket plate. The semiconductor component test sorting machine according to claim 4, characterized in that the guide is fixedly disposed on the socket board. A method for operating a semiconductor component testing sorting machine, comprising: a first step of gripping at least one semiconductor component with at least one picker on a gripping head; and a second step of moving over the concave pocket plate Holding a head; a third step of providing at least one semiconductor component gripped by at least one picker to at least one component pocket on the pocket plate; and in a fourth step, the recessed pocket plate is to be received in at least one component pocket At least one semiconductor component is electrically connected to at least one test socket on a socket board located below the concave bag plate; and a fifth step, when the test performed after the fourth step ends, is taken out by at least one component by means of the grasping head At least one semiconductor component of the pocket. The method for operating a semiconductor component test sorting machine according to claim 6, wherein the third step comprises: a third step a, lowering the gripping head to a descending position; and a third step b, at least A semiconductor component is lowered. The method of operating a semiconductor component test sorter according to claim 6, characterized in that the fourth step is implemented in a forced manner by further lowering the gripping head to a lower connecting position than the lowering position Concave bag Decline. The method of operating a semiconductor component test sorter according to claim 6, characterized in that at least one of the pick-ups on the gripping head descending to the joint position in the fourth step faces the test socket side to the at least one semiconductor The component is pressurized. A method for operating a semiconductor component testing sorting machine, comprising: a first step of gripping at least one semiconductor component with at least one picker on a gripping head; and a second step of moving over the concave pocket plate Holding the head; the third step of lowering the at least one semiconductor component downward; the fourth step a, correcting the position of the descending at least one semiconductor component; and the fourth step b, applying the at least one semiconductor component to the socket board side by the gripping head Pressing, at least one semiconductor component is electrically connected to at least one test socket on the socket board; in a fifth step, at least one semiconductor component is removed from the at least one test socket by means of the gripping head when the test performed after the fourth step is completed Unlink. The method of operating a semiconductor component test sorting machine according to claim 10, characterized in that the third step is performed in a state where the gripping head is lowered to the lowered position. The method of operating a semiconductor component test sorting machine according to claim 10, wherein the fourth step b is performed to cause at least one of the states in which the position is corrected by the fourth a step The semiconductor component is further lowered downward by means of the gripping head. The method of operating a semiconductor component test sorting machine according to claim 6 or 10, characterized in that, while the fifth step is performed, the concave pocket plate is raised in accordance with the elastic force.