CN107931154B - Electronic component test sorting machine and its taught point method of adjustment - Google Patents
Electronic component test sorting machine and its taught point method of adjustment Download PDFInfo
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- CN107931154B CN107931154B CN201710953124.5A CN201710953124A CN107931154B CN 107931154 B CN107931154 B CN 107931154B CN 201710953124 A CN201710953124 A CN 201710953124A CN 107931154 B CN107931154 B CN 107931154B
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- pickup section
- electronic component
- video camera
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
- B07C5/3422—Sorting according to other particular properties according to optical properties, e.g. colour using video scanning devices, e.g. TV-cameras
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- Supply And Installment Of Electrical Components (AREA)
Abstract
The present invention relates to a kind of electronic component test sorting machine and its taught point methods of adjustment.The present invention relates to following technologies: the grasping state of the pickup section of pickup model or the semiconductor element of the portion's of being picked grasping is shot during starting sorting machine, and image to shooting and stored image are compared, so as to judge by the taught point of pickup model it is bad whether or semiconductor element grasping it is bad whether.According to the present invention, due to constantly adjusting taught point in the start-up course of sorting machine, so the reliability of the mobile operation of semiconductor element can be improved, and due to not occurring based on the undesirable starting suspension situation of taught point, so being able to ascend the starting rate of sorting machine and increasing processing capacity, and it is able to confirm that whether the grasping of semiconductor element is bad and promptly makes correspondence.
Description
Technical field
Semiconductor element is electrically connected to test machine the present invention relates to a kind of, and according to test result and to semiconductor element
The sorting machine classified.
Background technique
Electronic component test with sorting machine (hereinafter referred to as " sorting machine (handler) ") be it is a kind of will be by scheduled system
The electronic component for making process manufacture is electrically connected to test machine (tester) and is divided later according to test result electronic component
The equipment of class.
In general, sorting machine executes following work to test multiple electronic components together: heap is loaded in client's support
The electronic component of disk (customer tray) is moved to test pallet, and heap is loaded in test pallet after completion of testing
Electronic component be moved to client's pallet.
Therefore, in sorting machine equipped with for making electronic component between mutually different preloading element and preloading element
Mobile multiple mobile devices.Here, preloading element further includes for facing other than above-mentioned client's pallet or test pallet
When preloading electronic component buffer part etc. can in sorting machine preloading electronic component all elements.
Mobile device in most cases has the multiple pickups that can be grasped electronic component or can release grasping
Portion (picker).And multiple pickup section it is adjustable between spacing, electronic component can be made different from each other
It is moved between preloading element.
In addition, in order to make pickup section suitably grasp electronic component or release the grasping, need accurately to show being located at
Electronic component is grasped in the state of religion point (teaching point) or releases grasping.Therefore, the taught point of pickup section
(teaching point) needs are accurately set.Here, taught point is construed as executing electronic component in pickup section
Grasping operation or release electronic component grasping operation when job position.
In the case where taught point is not set normally, can occur in the grasping and releasing grasping of electronic component
Problem.
Firstly, under the undesirable situation of teaching for the grasping of electronic component point, due to grasping bad, incomplete grab
It holds and may occur unexpectedly to grasp on the way on the move to release, the loss of electronic component will obviously occur in the case, and
And it may occur accidentally to grasp due to the electronic component for releasing the electronic component of grasping or being damaged is sandwiched in other component parts
Make.
Moreover, will become electronic component can not in the undesirable situation of teaching that the grasping for electronic component releases point
The phenomenon that being normally placed in correct position and being detached from repeats the phenomenon that heap is loaded in the same position, since electronic component is not
In the state of good placement with test electrical contact and the test that occurs is bad, maloperation and the reason of failure.
The present invention relates to a kind of technology of taught point for accurately setting pickup section, the pickup section is partly led for that will have
The thin sheet form of the thinner thickness of volume elements part etc and the electronic component movement with small size.In particular, due to integrated technology
Prosperity correspondingly requires accurately setting for taught point for the electronic components such as the semiconductor element miniaturised
It is fixed, and this is truth.
In the prior art, the adjustment of the taught point of pickup section is manually realized.As the example manually adjusted, have
Following method: being separately provided the teaching fixture for being formed with teaching hole, would be incorporated into as benchmark pickup section (hereinafter,
Referred to as " benchmark pickup section ") teaching pin be inserted into teaching hole, and the moment being smoothly inserted into is captured, so that in the capture
At the time of and capture place complete teaching.It certainly, further include replacing benchmark pickup section by baseline rod (stick) and being mounted on base
The position of quasi- pickup section and the method carried out.But in the case where adjusting taught point as described above by manual mode,
During the taught point for manually and one by one setting volume corresponding with the mobile device of volume, it can consume excessive
Time.Moreover, being conceived to the trend toward miniaturization of electronic component, due to the proficiency of operator is insufficient or vision, show
The setting accuracy of religion point can also decline, therefore, it is difficult to again by setting accurate taught point based on the operation of naked eyes identification.
That is, whether benchmark pickup section (or baseline rod) can smoothly be inserted into the visual field and feel that operator is depended in teaching hole entirely, therefore make
The respective standard of dealer is different from each other, and according to the proficiency of operator, the required time is also multifarious.Due to these
Reason, taught point adjustment operation need to consume 5 hours or so.Also, when adjusting taught point, due to rigid between all parts
Property difference, the damaged condition between structural member contacted is larger, thus also occur that cost waste.In turn, it needs
It adjusts taught point and removes teaching fixture later, placement meets the preloading element of the type of semiconductor element and drives and set later
Standby, there is also some difficulties in the process, that is, also needs to consider that tolerance is arranged.
Therefore, it such as KR published patent the 10-2006-0003110th (hereinafter, being referred to as " prior art "), studied
For setting the technology of taught point automatically.
In the prior art, plate is determined using two video cameras, test board (test plate) and position to set pickup section
Taught point.However, the prior art has the following problems.
First, plate is determined due to needing to be equipped with two video cameras, test board and position, so production cost will increase.
Second, due to will by two video cameras obtain information all of so data processing speed can also reduce.
Summary of the invention
The present invention provides a kind of base position and taught point that benchmark pickup section can be accurately set using video camera
Technology.
Electronic component test sorting machine according to the present invention for solving purpose as described above includes: multiple movements
The electronic component for being located at the teaching region of front end is moved to the teaching of rear end in the movement routine of semiconductor element by device
Region；Attachment device makes electronic component be electrically connected to test machine in the test position being located in the movement routine；At least one
A video camera, the teaching for judging the electronic component by least one mobile device in the multiple mobile device are bad
Whether；Control device controls the multiple mobile device, the attachment device and at least one described video camera, the multiple
At least one mobile device in mobile device includes: pickup model, has at least one pickup section, at least one described pickup
Portion includes the benchmark pickup section for the grasping that can be grasped electronic component or release electronic component；And moving machine, it is described for making
Pickup model moves between the teaching region of front end and the teaching region of rear end, and the video camera shooting is located at specific position
The bottom surface of the specific electronic components grasped by the benchmark pickup section, the control device are utilized in the specific location by institute
The bottom surface image of specific electronic components that video camera is shot, by benchmark pickup section grasping is stated to judge that the benchmark picks up
After whether the teaching in portion is bad, if the teaching of the benchmark pickup section is bad, the teaching of the benchmark pickup section is adjusted
Point.
The control device is shooting the bottom surface of the benchmark pickup section in the specific position using the video camera
After image, the taught point of the benchmark pickup section is analyzed and is adjusted for the first time, then using by adjustment teaching for the first time
The bottom surface image of the specific electronic components of the benchmark pickup section grasping of point is bad come the teaching for judging the benchmark pickup section
Whether.
The control device makes the bottom center of the benchmark pickup section using the bottom surface image of the benchmark pickup section
It is aligned with the center of the video camera, and the benchmark pickup section that bottom center is aligned with the center of the video camera is grabbed
The center of the bottom surface image for the specific electronic components held and the center of the video camera are compared, to judge that the benchmark picks up
Whether taking the teaching in portion bad.
The specific electronic components are in order to which the model made whether the teaching for judging the benchmark pickup section is bad is set
It is standby.
The X-axis length and Y-axis length of the simulator bottom surface are respectively than the X-axis length and Y of practical electronic component bottom surface
Shaft length is long.
In the bottom surface of the simulator, place's identification division different from background color equipped with color in the predetermined area.
The mobile device further include: identification elements is incorporated into the benchmark pickup section, to pick up for setting the benchmark
The base position in portion.
The identification elements has the structure that the benchmark pickup section is inserted in the form of pipeline.
The mobile device further includes and the fixed setting video camera of the relative coordinate of the benchmark pickup section, the control
Device processed judges after shooting the video camera by the setting video camera by the image of the setting video camera shooting
Whether center is aligned with the center of the video camera, to set the base position of the benchmark pickup section.
The taught point tune in electronic component test sorting machine according to the present invention for solving purpose as described above
Adjusting method comprises the following steps that grasping step, and the simulator in predetermined position is located at using the grasping of benchmark pickup section；Mobile step
Suddenly, the benchmark pickup section for grasping simulator is moved to specific position；Image acquisition step obtains position using video camera
In the bottom surface image for the simulator that the benchmark pickup section of the specific position is grasped；Return step makes the base
Quasi- pickup section is moved to after predetermined position, and simulator is made to be back to original position；Analytical procedure is walked to obtaining in described image
The image when image obtained in rapid and normal grasping is compared and analyzes；Set-up procedure, using in the analytical procedure
The value of analysis adjusts the taught point of the benchmark pickup section.
Further include following steps: verification step utilizes the benchmark pickup section that taught point was adjusted in the set-up procedure
Again the simulator returned in the return step is grasped, the moving step, image acquisition step are then re-executed
And analytical procedure, thus whether confirming that taught point is bad.
According to the present invention, have the effect of as follows.
First, due to not needing that fixture etc. is used alone, so can reduce production cost.
Second, since the position of pickup section can be accurately held in specific position by identification elements (Identifier)
It sets, it is possible to improve the adjustment accuracy of taught point.
Third, due to be able to use simulator and improve by video camera shoot image clarity, so can
The adjustment accuracy of taught point is enough improved, and life can be further reduced and saving the additional member for improving accuracy
Produce cost.
4th, due to adjusting test point by using the simulator almost the same with the specification of resettlement groove, so energy
Enough further increase the adjustment precision of taught point.
5th, due to enough as long as handling the information based on a video camera, so can be real within the shorter time
The adjustment of existing taught point.
Detailed description of the invention
Fig. 1 is the schematical plane composition for the electronic component test sorting machine of an embodiment according to the present invention
Figure.
Fig. 2 is the schematical composition figure for the mobile device of the sorting machine applied to Fig. 1.
Fig. 3 is to win the identification elements of mobile device applied to Fig. 2 to win figure.
Fig. 4 to Fig. 7 is the simulator for illustrating to be applied to the sorting machine of Fig. 1 with reference to figure.
Fig. 8 is the flow chart for the method for the taught point adjustment carried out in the sorting machine of Fig. 1.
Fig. 9 to Figure 11 is for being referred in the flow chart of explanatory diagram 8 with reference to figure.
Figure 12 is the exemplary schematical composition figure for the deformation of mobile device according to fig. 2.
Symbol description
100: sorting machine is used in electronic component test
MA (121,171,191): mobile device
PM: pickup model HM1: first level moving machine
HM2: second moves horizontally machine R: identification elements
SC: setting video camera
122,172,192: video camera
150: attachment device
CA: control device
M: simulator
Specific embodiment
Hereinafter, being illustrated to preferred embodiment in accordance with the present invention as described above.As reference, in order to illustrate letter
Known interior perhaps repeat description can be omitted as far as possible or be compressed to clean property.
<for the explanation of sorting machine constituted substantially>
Fig. 1 is the electronic component test sorting machine 100 for an embodiment according to the present invention (hereinafter, being referred to as " to divide
Select machine ") schematical plane constitute figure.
As shown in Figure 1, the sorting machine 100 of an embodiment according to the present invention includes following element and constitutes: test pallet
110, first movement device 121, the first video camera 122, equal hot cell (soak chamber), 140 (test of test chamber
Chamber), attachment device 150, move back equal hot cell 160 (desoak chamber), the second mobile device 171, the second video camera
172, pigeonholes (Sorting table) 180, third mobile device 191, third video camera 192 and control device CA.
In test pallet 110, multiple plug-in units (insert) of semiconductor element can be disposed more or less can to move about ground
It is set, and is recycled according to multiple transfer devices (not shown) along closed path C.
First movement device 121 makes heap be loaded in client's pallet CT1Semiconductor element to be tested is moved to be located at dress
Carry the test pallet 110 of position LP (Loading Position).
Whether first video camera 122 is in order to sense bad by the teaching of the semiconductor element of first movement device 121 and
It is equipped with.
Equal hot cell 130 is to implement function such as and be equipped with: the test come from " loaded " position LP by transfer is being loaded in heap
Before the semiconductor element of pallet 110 is tested, it is preheated or is pre-chilled according to test environment conditions.That is, heap is loaded in
The semiconductor element of test pallet 110 is assimilated while being transferred after being received equal hot cell 130 as needed for test
Temperature.
Test chamber 140 is to implement function such as and be equipped with: will obtain being transferred after preheating/pre-cooling in equal hot cell 130
Test pallet 110 to test position TP (Test Position) accommodates, and the test pallet 110 being received is loaded in heap
Semiconductor element is tested.
Attachment device 150 pushes semiconductor element to the test machine side (Tester) for being incorporated into 140 side of test chamber, from
And it is electrically connected semiconductor element with test machine (Tester), wherein the semiconductor element heap is loaded in positioned at test chamber 140
The test pallet 110 of interior test position TP.
Moving back equal hot cell 160 is to implement function such as and be equipped with: heap is loaded in the test support transferred from test chamber 140
The semiconductor element of disk 110 being heated or cooled assimilates into mobile by the second mobile device 171 or third mobile device 191
The temperature (being preferably close to room temperature) of Shi Suoxu.
Second mobile device 171 is loaded in heap from moving back equal hot cell 160 to be moved to unloading position UP (Unloading
Position the semiconductor element of test pallet 110) is mobile to pigeonholes (Sorting table) 180.
Whether second video camera 172 is in order to sense bad by the teaching of the semiconductor element of the second mobile device 171
It is equipped with.
Heap is loaded with the semiconductor element mobile from test pallet 110 by the second mobile device 171 on pigeonholes 180
Part.
The semiconductor element that third mobile device 191 is loaded in pigeonholes 180 to heap is classified by test grade, and makes it
It is moved to empty client's pallet CT2。
Whether third video camera 192 is in order to detect bad by the teaching of the semiconductor element of first movement device 191 and
It is equipped with.
Control device CA controls above-mentioned first movement device 121, the first video camera 122, attachment device 140, second and moves
The work of dynamic device 171, the second video camera 172, third mobile device 191 and third video camera 192.In particular, control device CA
It is adjusted using the image obtained by the first video camera 122, the second video camera 172 and third video camera 192 for by
One mobile device 121, the second mobile device 171 and third mobile device 191 grasp semiconductor element or release semiconductor element
The taught point of the grasping of part.
Then, it is illustrated to the characteristic of the invention in the sorting machine 100 constituted substantially as described above.
<for the explanation of mobile device>
The responsible client's pallet CT in mobile device MA:121,171,1911、CT2With test pallet 110 and pigeonholes 180 it
Between the movement of electronic component that carries out.At this point, mobile device MA makes teaching region of the electronic component from front end in movement routine
The teaching region of (for example, region where client's pallet of preloading tested electronic component in need) rear end is (for example, connect
Receive from the preloading band of position where the test pallet of the tested electronic component of the needs that above-mentioned client's pallet is mobile to be come) it moves
It is dynamic.
Schematical embodiment as illustrated in Figure 2, mobile device MA have pickup model PM, first level moving machine
HM1, second move horizontally machine HM2And elevator UD.
Pickup model PM has the pickup section for the grasping that can be grasped semiconductor element or release semiconductor element
(picker)P0,P.Here, pickup section P0, P is by vacuum grip semiconductor element, or released by releasing vacuum and partly led
The grasping of volume elements part.It can also enough adjusting pickup section P0, spacing between P.Certainly, pickup section P0As long as, P be equipped with one with
On then enough, and arbitrary quantity required for being equipped to according to the specification of sorting machine 100.
First level moving machine HM1Make pickup model PM along the horizontal plane on first direction it is mobile.
Second moves horizontally machine HM2Make pickup model PM along the horizontal plane on second direction (being generally perpendicular to the first direction)
It is mobile.
Therefore, pickup model PM is according to by first level moving machine HM1Machine HM is moved horizontally with second2Come the movement determined
Mode and move and keep semiconductor element mobile.
As reference, according to embodiment, first level moving machine HM1Machine HM is moved horizontally with second2In any one
It can be removed.It also include only along certain that is, may include the situation for needing to be moved along X-axis and Y-axis according to moving machine
One axis (X-axis or Y-axis) moves then enough situations.The reason is that corresponding to the preloading element of moving machine may be configured as along X-axis
Or Y-axis is mobile, is also configured to be moved along the whole of two axis.Therefore, it can constitute as follows: correspond to preloading
The moving direction of the mobility or stationarity of element, moving machine can be moved along the direction of any one axis, or can be along two axis
All moved.
Elevator UD can be such that pickup model PM goes up and down, and can grasp semiconductor element by pickup section P, or release
The grasping of semiconductor element.
In addition, mobile device MA:121,171,191 further include being installed on benchmark pickup section P0Identification elements R.
Generally, due to pickup section P0, the spacing between P accurately set, as long as so can accurately adjust benchmark
Pickup section P0Taught point, then remaining pickup section P0, P taught point will automatically be adjusted.Therefore, such as the present embodiment,
It, preferably will be in adjustment pickup section P in order to ensure the adjustment accuracy of taught point0, spacing between P when will not move and
Pickup section P in stationary state0, P consider be benchmark pickup section P0。
Identification elements R is in order to set benchmark pickup section P0Base position and be equipped with, and as shown in figure 3, be installed into entirety
Benchmark pickup section P is inserted into as pipe (tube) form0Structure.Therefore, according to the bottom surface of the identification elements R of the present embodiment
Center and benchmark pickup section P0Bottom surface center O alignment.Certainly, since identification elements R is to grasp benchmark pickup section P0's
Bottom center O and the element used, as long as so it can correctly grasp benchmark pickup section P0Bottom center O shape
State, then any structure can preferably be considered.For example, identification elements R mounted shape can be the annular such as ring
Shape, or can be disk (disk) shape.Also, it can also be the angulation for being merely able to confirm more than one place
(angled) shape.
In turn, identification elements R can be equipped with by the material with elastic force, can easily be loaded and unloaded, and can also be by
Divided fragment manufacture, to be equipped to the mode for making these fragments be combined with each other during installation.In the case, it is realizing
In installation process while the shortening of consumed time, can prevent may be due to installing to pickup section or other structures part
And the damage or distortion of the excessive external force used and the existing structure part occurred.
Although this identification elements R is than benchmark pickup section P0Bottom surface outer diameter D1It is wider, but there is pickup section P0, between P
Spacing the unimpeded outer diameter D of adjustment2.Here, benchmark pickup section P0Bottom surface outer diameter D1It is specific to indicate absorption layer
(pad) 1 outer diameter.
In addition, the lower end of identification elements R is in order to prevent due to the distance on the image by the shooting of video camera 122,172,192
Feel mistake caused by (Perspective), be as closely as possible to absorption layer 1, it is, however, preferable that close to extremely will not be to benchmark
Pickup section P0The movement for grasping electronic component or releasing the grasping of electronic component forms the place interfered.For this purpose, the lower end identification elements R
Form preferably can be considered and take following structure: how much outer diameter and content are extended, so as to make the upside of absorption layer 1
It is inserted partially into inside the lower end of identification elements R.
In turn, since identification elements R needs to make benchmark pickup section P0Bottom surface (specifically, bottom surface of absorption layer) can be clear
It is shown on the image shot by video camera 122,172,192 clearly, is preferably equipped to have different from absorption layer 1
Color.
Embodiment according to the present invention, can also make the lateral profile of absorption layer 1 have the color different from inside or
Line etc., so as to make lateral profile effect be identification elements R.However, if it is considered that manufacturing cost etc., such as the present embodiment
Ground, identification elements R are more highly preferred in such a way that the component different from absorption layer 1 is equipped with.
<for the explanation of video camera>
Since video camera 122,172,192 needs to shoot the benchmark pickup section P positioned at specific position0Bottom surface, so excellent
Choosing is provided to the lower section of specific position, but to shoot the benchmark pickup section P positioned at specific position using reflecting mirror etc.0Side
Formula is equipped with also enough.
<for the explanation of simulator>
The present embodiment uses simulator to adjust taught point.Here, simulator be in order to adjust taught point and
The stage property of special manufacture is played the portion of being picked and grasps and move identically as practical electronic component when adjusting taught point
Effect, but do not have electronic loop.
Fig. 4 is the exemplary diagram for the bottom surface of simulator M.
If exaggerating diagram, as shown in Figure 5, it is preferable that the X-axis length and Y-axis length of the bottom surface of simulator M are than reality
Electronic component D long.
Simulator M in order to by prevent using practical electronic component D taught point adjustment when may be adjoint
Problem, and improve the adjustment accuracy of taught point and used.
For example, the area of the resettlement groove S of preloading element is compared to practical electricity if exaggerating diagram as shown in Figure 6
The area of the bottom surface of subassembly D is manufactured into comparatively wide.That is, more specifically, the X-axis length and Y-axis length of resettlement groove S is equal
X-axis length and Y-axis length than electronic component D is longer.Even if can also make reality the reason is that having numerous parameters
Electronic component D installed with being properly inserted into the state of resettlement groove S.However the manufacture with practical electronic component D
The fact that tolerance is 0.1mm is on the contrary, the resettlement groove S of preloading element can be more accurate with the manufacturing tolerance of 0.02mm to 0.08mm
Ground must be produced.If it is considered that the point that the base area of the actual electronic component D of the area ratio of resettlement groove S is more broadly produced
And the production tolerance etc. of resettlement groove S and practical electronic component D, for current resettlement groove S practical electronic component D it is opposite
The maximum value for making tolerance is 0.68mm.Even the maximum allowance of above-mentioned 0.68mm is it is meant that in practical electronic component D by base
Quasi- pickup section P0In the case where grasping, the center of practical electronic component D can also deviate 0.68mm at the center O from absorption layer 1
Spacing in the state of grasped.If the diameter of absorption layer 1 is 1.5mm, for the base area with 3mm × 4mm
For the practical electronic component D of semiconductor element etc, left and right ampleness spacing will only remain 0.75mm respectively.If by above-mentioned maximum
Tolerance 0.68mm and ampleness spacing 0.75mm are compared, then can be lost using the adjustment of the taught point of practical electronic component D
Its meaning.That is, shown in Fig. 7 as shown in exaggerating, if the practical electronic component D that will be utilized the adjustment of taught point is in
The state (a) deviateed to the side of resettlement groove S, or the state (b) rotated with vertical axes (Z axis) for rotary shaft, then
Still taught point alignment error can occur.
Therefore, although the X-axis of the bottom surface of simulator M and Y-axis length are shorter than the X-axis of resettlement groove S and Y-axis length,
The X-axis and Y-axis length of bottom surface than practical electronic component D are long, thus (c) of Fig. 7 as shown in exaggerating and (d) shown, energy
Simulator M is enough minimized to be biased to resettlement groove S and be placed (a) or be placed the error degree of (b) with the state rotated,
So as to free from errors, accurately realize the adjustment of taught point.Herein, it is preferable that the base area of simulator M and placement
The area of slot S is almost the same, so that simulator M can be dumped with the state for being inserted in resettlement groove S almost seamlessly
The mode of load is equipped with, and therefore, preloading is bad in order to prevent, it is necessary to by production allowance control in 0.01mm to 0.07mm, thus
Production tolerance than resettlement groove S is more critically produced.
In addition, simulator M preferably have can with the color in contrast with the color of component parts around, so as to borrow
It helps video camera 122,172,192 and is significantly distinguished in the image of shooting.For example, as in actual electronic component, in mould
There are more than one pickup section P in surrounding's component parts of type equipment M0, P, pickup model PM and a large amount of wiring.Therefore,
Only needing to shoot benchmark pickup section P0In the case where the absorption layer 1 of lower end, also due in the figure of video camera 122,172,192
Benchmark pickup section P as in0The form of the absorption layer 1 of lower end is mixed in component parts around and can not be distinguished, therefore,
It is all more important than anything that simulator M is equipped to the color this point that can obviously distinguish from the component parts of surrounding.
Moreover, so-called can be can be equipped with simulator this point with the color that component parts around these obviously distinguishes, sufficiently
Illustrate that the use of simulator M is more advantageous than practical electronic component.Here, in turn, in order in the picture more clearly
Confirm that the center O' of simulator M, the bottom center O' of simulator M preferably have the color different from background color.In turn,
Preferably, at the bottom center O' of model electronic equipment M, negative cutting T is formed in the margin of tolerance of 0.01mm, and make
Have inside the yin cutting T can with the color in contrast with background color, so as to smart by video camera 122,172,192
Really confirm the bottom center O' of simulator M.
Certainly, it may be equipped with illuminating to obtain specific image by video camera 122,172,192, it is therefore, excellent
Selection of land, having the coating coated on the simulator M or negative cutting T including center O' prevents irreflexive material.
It, can also be in addition, simulator M as described above can be equipped to the component being provided on sorting machine 100 always
Operator carries out being provided to sorting machine 100 when taught point adjustment operation.But the situation of even the latter, operator also can
It is enough to provide simulator M to sorting machine 100 when taught point adjusts operation, and simulator M effect is made to be sorting machine 100
One component parts, therefore should also be as being understood to that simulator M is a structure for constituting sorting machine 100 in the case of the latter
At component.
<for the explanation of control device>
Control device CA using grasped by the image that video camera 122,172,192 takes the bad of taught point with
It is no, and taught point is adjusted in the undesirable situation of taught point.
More specifically, control device CA grasps benchmark using the image taken by video camera 122,172,192
Pickup section P0Center O and simulator M center O', so as to adjust taught point.
Then the adjustment for the taught point realized in the sorting machine 100 with feature as described above is illustrated.
<method of adjustment of taught point when initial placement-reference Fig. 8 flow chart>
1, benchmark pickup section P is shot0Bottom surface (S1)
For example, as shown in figure 9, the coordinate of the specific position shot by video camera 122,172,192 is (0,0), and model
The coordinate value of the position of the bottom center O' of equipment M is (- 2, -10).Here, simulator M fixed position (- 2 ,-
10) it is the position arbitrarily determined in the resettlement groove S being present in preloading element, can be wanted as previously mentioned by each preloading
Element and have at least one.If former taught point is accurately adjusted, benchmark pickup section P0Center O need it is as accurate as possible
Ground is moved to the center (- 2, -10) of simulator M.
Therefore, firstly, by benchmark pickup section P0Be placed in the state of the top of specific position using video camera 122,
172,192 shooting benchmark pickup section P0Bottom surface.
Here, specific position can be located at benchmark pickup section P0On the path moved, with can be in the movement of electronic component
It is mobile to make electronic component on path, but is also possible to following place: even if de- from the movement routine of general electronic component
From benchmark pickup section P0Also the position that can be in.As long as only this specific position is accurately set as described below
Its coordinate value is then enough.
It is, of course, preferable to ground, specific position is only located at benchmark pickup section P0The region moved, and in benchmark pickup section P0Institute
In each mobile region, as long as configuring a video camera 122,172,192 enough.It is intended that preventing each other
The collision that may occur in the case where the overlapping that moving area occurs between the pickup model PM of different mobile device MA.When
So, specific position is position present in video camera 122,172,192, is also can correspond to video camera 122,172,192
At center.
2, benchmark pickup section P0Position setting (S2)
Benchmark pickup section P is grasped by the image shot in S1 step0Center O, and carry out as illustrated in fig. 10
Make benchmark pickup section P0Center O and image center O0The control (reference arrow " a ") of (center of video camera) alignment, thus
Accurately set base position (for example, the place of (0,0) is in the center of absorption layer).Here, due to benchmark pickup section P0In
Heart O is the center O of identification elements R, so benchmark pickup section P can easily be grasped by grasping the center of identification elements R0In
Heart O.At this point, benchmark pickup section P0Base position setting can only be carried out by the image shot in S1 step, but
Be in order to ensure accuracy, can also be by the way that the image of stored benchmark image and shooting be compared to realize.
3, the grasping (S3) of simulator M
Utilize the benchmark pickup section P for setting base position in S2 step0Grasping is located at coordinate (- 2, -10)
Simulator M.
4, benchmark pickup section P0Movement (S4)
Make the benchmark pickup section P for grasping simulator M0It is mobile to the specific position that coordinate is (0,0).
5, the bottom surface image (S5) of simulator M is obtained
Benchmark pickup section P is shot using video camera 122,172,1920Bottom surface.At this point, due to benchmark pickup section P0It is in
Grasp the state of simulator M, it is possible to the bottom surface image of simulator M is obtained from the image of shooting.
6, the return (S6) of simulator M
After executing S5 step, control device CA makes simulator M be back to home position, that is, coordinate (- 2, -10).
7, image compares and analyzes (S7)
While executing step S6, center O of the control device CA to the image shot in step s 50With simulator
The bottom center O' of M is compared and analyzes.
Above-mentioned steps S7 can be performed simultaneously with above-mentioned steps S6, can also first carried out than step S6.That is, according to setting
Mode, step S6 and step S7 can be interchanged temporal precedence relationship, also may be performed simultaneously.
8, taught point adjustment (S8)
Value adjusts benchmark pickup section P obtained from being compared and analyzing in the step s 70Taught point.
For example, the error of taught point is equivalent to conduct if the image shot in step s 5 is as illustrated in Figure 11
The center O of the image at 122,172,192 center of video camera0Spacing L between the center O' as simulator M, therefore control
Device CA processed controls mobile device MA:121,171,191 and benchmark pickup section is made to be located at the taught point in rear adjustment.As ginseng
It examines, the base position of benchmark pickup section is set in step s 2, therefore as shown in figure 11, benchmark pickup section P0Bottom surface in
The center O of heart O and the image at the center as video camera 122,172,1920Alignment.
9, whether confirmation taught point is bad (S9)
If being completed to step S8, will be repeated from step S3 to S8 and confirm taught point it is bad whether.That is,
In this step S9, for setting benchmark pickup section P0The operation of base position be removed.
Certainly, if taught point is good, it is judged as that the adjustment of taught point is completed, and stops to confirm operation.
<taught point method of adjustment when part replacement>
For example, changing in various parts (client's pallet, test pallet etc.) according to by the specification of electronic component to be tested
Deng and in the case where being replaced, need to reset taught point.
As described above, being in benchmark pickup section P in the case where component is replaced0The state that has set of base position,
Therefore, in the flow chart of figure 8, step S1 and S2 can be removed.Therefore, the adjustment process of taught point when replacement component
Execute the step S3 to step S9 in the flow chart of Fig. 8.
<using the situation of see-through model equipment>
In the case where simulator M is tempered glass or toughened plastic and is transparent material, even picked up in benchmark
Take portion P0In the state of grasping simulator M, it is also able to carry out reflection benchmark pickup section P0With the shooting of the image of identification elements.
Therefore, using see-through model equipment, the step S1 and S2 in the flow chart of Fig. 8 can also be saved, and
As long as executing step S3 to step S9.
As reference, the pickup section P than being provided to a preloading element mobile device M is loaded in heap0, P it is more
Electronic component in the case where, in a preloading element, the taught point of benchmark pickup section may be present in many places.But if
Any one taught point in a preloading element can be accurately set, then remaining taught point can be according to standardized data
And be automatically set by calculating, there is no need to execute the adjustment operation for being directed to remaining taught point.However, installing
Location tolerance may also can occur during preloading element, therefore according to embodiment, can also show for a preloading element
It teaches at two, so that location tolerance can also be corrected.
<variation>
In the above-described embodiments, using being installed to benchmark pickup section P0Identification elements R set benchmark pickup section P0Position
It sets.
However, as shown in figure 12, also constitute for pickup model PM be further equipped with individually setting video camera SC and
Instead of identification elements R, to set benchmark pickup section P0Position.
In the example of such as Figure 12, make pickup model PM mobile in the early stage, to shoot position using setting video camera SC
Video camera 122,172,192 in lower section.And judge by setting video camera SC shooting image center whether with camera shooting
The center of machine 122,172,192 is aligned, and keeps pickup model PM mobile according to above-mentioned judging result, so that being taken the photograph by setting
The center of the image of camera SC shooting is aligned with the center of video camera 122,172,192.By above-mentioned process, if video camera
122,172,192 center is located at the center of the image by setting video camera SC shooting, then setting benchmark picks up in this state
Take portion P0Position.Here, setting video camera SC and benchmark pickup section P0Between relative coordinate it has been determined that and due to video camera
122,172,192 or electric from other preloading elements (client's pallet, test pallet, pigeonholes etc.) grasping electronic component or placement
The coordinate in the place of subassembly is set in the form of fixed coordinates, so if setting video camera SC coordinate and video camera 122,
172,192 coordinate alignment, then can determine benchmark pickup section P by simple calculating0Coordinate.
That is, setting benchmark pickup section P according to embodiment0Base position method can take multiplicity method.Cause
This, although having been carried out according to the embodiment being described with reference to for specific description of the invention, however, above-mentioned implementation
Only the preferred embodiment of the present invention is illustrated as an example for example, and therefore, the present invention should not be construed as being limited to
The above embodiments, the range that interest field of the invention should be understood the range of claims and be equal with this.
Claims (11)
1. a kind of electronic component test sorting machine, wherein include:
Multiple mobile devices, in the movement routine of semiconductor element, the electronic component that will be located at the teaching region of front end is mobile
To the teaching region of rear end；
Attachment device makes electronic component be electrically connected to test machine in the test position being located in the movement routine；
At least one video camera, for judging the electronic component by least one mobile device in the multiple mobile device
Teaching it is bad whether；
Control device controls the multiple mobile device, the attachment device and at least one described video camera,
At least one mobile device in the multiple mobile device includes:
Pickup model, has at least one pickup section, at least one described pickup section includes that can grasp electronic component or releasing
The benchmark pickup section of the grasping of electronic component；And
Moving machine, for moving the pickup model between the teaching region of front end and the teaching region of rear end,
The video camera shooting is located at the bottom surface for the specific electronic components of specific position grasped by the benchmark pickup section,
The control device utilizes being shot in the specific location by the video camera, by benchmark pickup section grasping
After whether the bottom surface image of specific electronic components is bad come the teaching for judging the benchmark pickup section, if the benchmark picks up
The teaching in portion is bad, then adjusts the taught point of the benchmark pickup section.
2. electronic component test sorting machine as described in claim 1, wherein
The control device is shooting the bottom surface image of the benchmark pickup section in the specific position using the video camera
Later, the taught point of the benchmark pickup section is analyzed and is adjusted for the first time, then using by adjustment taught point for the first time
Whether the bottom surface image of the specific electronic components of the benchmark pickup section grasping is bad come the teaching for judging the benchmark pickup section.
3. electronic component test sorting machine as claimed in claim 2, wherein
The control device makes the bottom center and institute of the benchmark pickup section using the bottom surface image of the benchmark pickup section
The center alignment of video camera is stated, and the benchmark pickup section that bottom center is aligned with the center of the video camera is grasped
The center of the bottom surface image of specific electronic components and the center of the video camera are compared, to judge the benchmark pickup section
Teaching it is bad whether.
4. electronic component test sorting machine as described in claim 1, wherein
The specific electronic components are the simulators in order to make whether the teaching for judging the benchmark pickup section is bad.
5. electronic component test sorting machine as claimed in claim 4, wherein
The X-axis length and Y-axis length of the simulator bottom surface are longer than the X-axis length and Y-axis of practical electronic component bottom surface respectively
Degree length.
6. electronic component test sorting machine as claimed in claim 4, wherein
In the bottom surface of the simulator, place's identification division different from background color equipped with color in the predetermined area.
7. electronic component test sorting machine as described in claim 1, wherein
The mobile device further include: identification elements is incorporated into the benchmark pickup section, for setting the benchmark pickup section
Base position.
8. electronic component test sorting machine as claimed in claim 7, wherein
The identification elements has the structure that the benchmark pickup section is inserted in the form of pipeline.
9. electronic component test sorting machine as described in claim 1, wherein
The mobile device further include with the fixed setting video camera of the relative coordinate of the benchmark pickup section,
The control device judges to be clapped by the setting video camera after shooting the video camera by the setting video camera
Whether the center for the image taken the photograph is aligned with the center of the video camera, to set the base position of the benchmark pickup section.
10. the taught point method of adjustment in a kind of electronic component test sorting machine, wherein comprise the following steps that
Step is grasped, the simulator in predetermined position is located at using the grasping of benchmark pickup section；
The benchmark pickup section for grasping simulator is moved to specific position by moving step；
Image acquisition step is obtained using video camera and is set positioned at the model that the benchmark pickup section of the specific position is grasped
Standby bottom surface image；
Return step makes simulator be back to original position after making the benchmark pickup section be moved to predetermined position；
Analytical procedure, image when to the image obtained in described image obtaining step and normal grasping are compared and divide
Analysis；
Set-up procedure adjusts the taught point of the benchmark pickup section using the value analyzed in the analytical procedure.
11. the taught point method of adjustment in electronic component as claimed in claim 10 test sorting machine, wherein further include as
Lower step:
Verification step is grasped again using the benchmark pickup section for adjusting taught point in the set-up procedure and is walked in the return
The simulator returned in rapid, then re-executes the moving step, image acquisition step and analytical procedure, so that confirmation is shown
Whether religion point is bad.
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| KR20160132731 | 2016-10-13 | ||
| KR10-2016-0132731 | 2016-10-13 | ||
| KR1020170092372A KR102461013B1 (en) | 2016-10-13 | 2017-07-21 | Handler for testing electronic devices and method for adjusting teaching point thereof |
| KR10-2017-0092372 | 2017-07-21 |
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| KR20200071357A (en) * | 2018-12-11 | 2020-06-19 | (주)테크윙 | Handler for testing electronic components |
| KR20210079435A (en) * | 2019-12-19 | 2021-06-30 | (주)테크윙 | Handler for managing electronic components and method of setting teaching point thereof |
| KR20210104967A (en) * | 2020-02-18 | 2021-08-26 | (주)테크윙 | Picking apparatus for gripping electronic component |
| CN111898516A (en) * | 2020-07-27 | 2020-11-06 | 元准智能科技(苏州)有限公司 | Static load stowage identification system based on machine vision and identification method thereof |
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